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DS00233D Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
pure tin recommended reflow profile Abstract: AN233 Contextual Info: AN233 Solder Reflow Recommendation Author: BASICS OF THE REFLOW PROCESS Ravi Sharma Microchip Technology Inc. Lead-free soldering techniques have been available for some years. However, they do not always meet the same physical criteria for attachments as alloys	Original	AN233 tem6334-8870 DS00233D-page pure tin recommended reflow profile AN233	PDF
AN233 Contextual Info: AN233 有关回流焊接的建议作者：回流工艺基础 Ravi Sharma Microchip Technology Inc. 无铅焊接技术已应用多年。然而，却总是难以满足与含铅合金粘结处理相同的物理标准。过去，用于连接电子元件最常用的合金是成份为 63% 的锡和 37% 的铅的混	Original	AN233 DS00233D AN233	PDF

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pure tin recommended reflow profile

Abstract: AN233
Contextual Info: AN233 Solder Reflow Recommendation Author: BASICS OF THE REFLOW PROCESS Ravi Sharma Microchip Technology Inc. Lead-free soldering techniques have been available for some years. However, they do not always meet the same physical criteria for attachments as alloys

Original

AN233 tem6334-8870 DS00233D-page pure tin recommended reflow profile AN233

PDF

AN233

Contextual Info: AN233 有关回流焊接的建议作者：回流工艺基础 Ravi Sharma Microchip Technology Inc. 无铅焊接技术已应用多年。然而，却总是难以满足与含铅合金粘结处理相同的物理标准。过去，用于连接电子元件最常用的合金是成份为 63% 的锡和 37% 的铅的混

Original

AN233 DS00233D AN233

PDF