DPS3 Search Results

Contextual Info: □PM . Dense-Pac Microsystems Inc. DPS32M8A ^ HICH SPEED 32K X 8 CMOS SRAM MONOLITHIC ADVANCED INFORMATION DESCRIPTION: The DPS32M8A is a 32K X 8 CMOS Static Random Access Memory SRAM . The memory utilizes asynchronous circuitry and may be maintained in any

Contextual Info: 1 Megabit CMOS SRAM D EN SE-PA C DPS3232V M I C R O S Y S Ï li M S DESCRIPTION: The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matching thermal coefficients. The LCCs are

Contextual Info: DPS384 □PM Dense-Pac Microsystems, Inc. 64K X 6 CMOS SRAM MODULE NOT RECOMMENDED FOR NEW DESIGNS D ESC R IPT IO N : The DPS384 is a 64K X 6 high-speed, low-power static RA M module comprised of six 64K X 1 m onolithic SR A M 's, and decoupling capacitors

Contextual Info: □PM DPS32M8A Dense-Pac Microsystems, Inc. O H IG H SPEED 32K X 8 C M O S S R A M M O N O L IT H IC ADVANCED INFORMATION D ESCRIPTIO N: The D P S 3 2 M 8 A is a 32K X 8 C M O S Static Random A c ce ss M e m o ry SR A M . The m em ory utilizes asynchronous circuitry and may be maintained in any

DPD72PG1

Abstract: 23L206 AA2876A 34n20 DPD72 AA2876 DPS32PG1 270AN Anaheim Automation
Contextual Info: DPD72PG1 DPS32PG1 DPL Anaheim Automation Driver Packs with pulse generator incorporate a bilevel driver, matching power supply and pulse generator. The AA2876 Pulse Generator is used in the DPS32PG1 and DPD72PG1 units while the DPL has its Pulse Generator built into its circuitry. There are

Contextual Info: T Dense-Pac Microsystems, Inc. DPS32M8A H IG H SP E E D 3 2 K X 8 C M O S S R A M M O N O L IT H IC O ADVANCED INFORMATION DESCRIPTION: The D P S 3 2 M 8 A is a 3 2 K X 8 C M O S Static Random A c c e s s M e m o r y S R A M . T h e m e m o ry utilizes

Contextual Info: / □PM Dense-Pac Microsystems, Inc. DPS32X16A r o H I G H S P E E D 3 2 K X 16 C M O S S R A M P G A M O D U L E PRELIMINARY D E S C R IP T IO N : The D P S 3 2 X 1 6 A is a 40-pin Pin Grid Array P G A consisting of two 3 2 K X 8 S R A M devices in ceramic

twilight

Contextual Info: □PM Dense-Pac Microsystems, Inc. DPS3232V 32K X 32 CMOS SRAM VERSAPAC MODULE O DESCRIPTION: The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 3 2 K X8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceram ic substrate w ith m atching thermal

Contextual Info: DPS32X16A □PM Dense-Pac Microsystems, Inc. O H IG H SPEED 3 2 K X 16 C M O S S R A M P G A M O D U L E PRELIM INARY DESCRIPTIO N: The DPS32X16A is a 40-pin Pin Grid Array PGA consisting of two 32K X 8 S R A M devices in ceramic LCC packages surface mounted on a co-fired ceramic

Contextual Info: □PM DPS32M8A Dense-Pac Microsystems. Inc. HIGH SPEED 32K X 8 CM OS SRAM MONOLITHIC ADVANCED INFORMATION DESCRIPTION: The DPS32M8A is a 32K X 8 CM OS Static Random Access Memory SRAM . The memory utilizes asynchronous circuitry and may be maintained in any

Contextual Info: D FN SF-P A C m,rc li o s y s r Jr: .vi 3 /k -D & u u s High Density Memory Device 1 Megabit High Speed SRAM DPS32KX32Y5 PRELIMINARY D ESCR IPTIO N : The DPS32KX32Y5 a 32K x 32 SRAM module the utilize the new and innovative space saving TSOP stacking technology. The module is constructed of

"32K x 32" SRAM

Abstract: DPS32KX32Y5
Contextual Info: DENSE-PAC 1 Megabit High Speed SRAM /H - ~ D c n S tiS H/gft Density Memory Device m icrosystem s dps32KX32Y5 PRELIMINARY DESCRIPTION: The DPS32KX32Y5 a 32K x 32 SRAM module the utilize the new and innovative space saving TSOP stacking technology. The module is constructed of

Contextual Info: DPS3 Power Supply/Charger Rev.฀DPS3_01212013 Overview DPS3 ฀ ฀

Contextual Info: D E N S E -P A C M 1 C R O S Y S T e Ms /H - T c n S k S ¡-j¡gh Density Memory Device 1 Megabit High Speed SRAM dps32KX32Y5 PRELIMINARY DESCRIPTION: The DPS32KX32Y5 a 32K x 32 SRAM module the utilize the new and innovative space saving TSOP stacking technology. The module is constructed of

Contextual Info: DENSE-PAC 1 Megabit CMOS SRAM MICROSYSTEMS DPS3232V DESCRIPTION: The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matchi ng thermal coeffi cients. The LCCs

32Kx4

Contextual Info: □P M DPS32X16A Dense-Pac Microsystems, Inc. O H IG H SPEED 32K X 16 C M O S S R A M P G A M O D U L E PRELIMINARY DESCRIPTION: The DPS32X16A is a 40-pin Pin Grid Array PGA consisting of two 32K X 8 SR A M devices in ceramic LCC packages surface mounted on a co-fired ceramic

Contextual Info: FEATURES & • 1243-1253 MHz ■ 45° LSB, 315° Range ■ Integrated Power Divider For REF Channel MODEL NO. DPS38017 3 Section Phase Shifter ■ Integrated Amplifier For Equal Insertion Loss ■ ECL Driver PART IDENTIFICATION GUARANTEED PERFORMANCE LOGIC TABLE

IC 4490

Abstract: T-50
Contextual Info: r •ras 2343431 4bE D CONNOR-ùlINFIELD CORP 00003^7 ICN ill 3 . Aurora, I L. 6 0 5 0 5 . v CONNOR-WINFIELD CORPORATION V PHONE 7 0 8 8 5 1 - 4 7 2 2 FAX ( 7 0 8 ) 8 5 1 - 5 0 4 0 C A B L E : CONWINWCQO T-50-05 J O S C IL L A T O R S r DIP SINEWAVE MODELS DPS 1, D PS2, DPS3 & DPS4

AL233

Abstract: dps41288-150c 1014a 32Kx16 150ns
Contextual Info: Q ZC3 < r/w ' a j í APR 1 3 1937 D P S 3 2 K x 8 BASED CMOS SRAM FAMILY DPS45128 DPS45129 DESCRIPTION: The DPS32K x 6 fam ily consists of asynchronous Static Random Access Memories SRAMs), complete with memory interface logic and on-board capacitors, availab le in the organizations and packages described

Contextual Info: 1 Megabit CMOS SRAM D EN SEFAC M I C R O S Y S ï If MS DPS3232V-35I-TI DESCRIPTION: The DPS3232V-35I-TI is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matching thermal coefficients. The LCCs

Contextual Info: Programmable Process Scanners ⁄8 DIN, 4- and 7- Channel Input 1 DPS3100 Series Shown smaller than actual size $ 425 Basic Unit To Order Specify Model Number MADE IN USA Note: Add Input Code from Chart Below Model No. Price Description Dedicated Input 4 & 7 Channel Scanner

Contextual Info: DPS3232V Dense-Pac Microsystems, Inc. ^ 32K X 32 CMOS SRAM VERSAPAC MODULE DESCRIPTION: The DPS3232V is a 66-pin Pin G rid Array PGA consisting o f fo u r 32K X 8 SRAM devices in ceramic LCC packages surface m o u n te d on a co-fired c e ra m ic s u b s tra te w ith m a tc h in g th e rm a l

Contextual Info: DENSE-PAC 1 Megabit CMOS SRAM MICROSYSTEMS DPS3232V D E SC R IP T IO N : The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matching thermal coefficients. The LCCs

DP645

Abstract: vlt 2800 AJJ 610 Dense-Pac Microsystems DPS41288-120M DPS41288-70I vlt 2800 application dps41288-150m C18045 E148
Contextual Info: Q Ì %C3 DPS32KX 8 BASED CMOS SRAM FAMILY DESCRIPTION: The DPS32K X 8 fam ily consists of asynchronous Static Random A ccess Memories SRAMs , com plete with memory interface logic and on-board capacitors, available in the organizations and packages described