DOW CORNING 200 Search Results

MIL-S-8660

Abstract: MIL-S-8660C 8660C Corning
Contextual Info: Product Information DOW CORNING 4 Electrical insulating compound FEATURES • High dielectric strength Grease like material containing an inert silica filler in combination with selected polydimethyl silicone fluids • Low volatility APPLICATIONS • Moisture resistant

dow corning 732

Abstract: Dow Corning DC 11 Dow Corning DC 896 MIL-A-46106A MIL-A-46106 Dow Corning DC 1200 Dow Corning Taiwan 0097B 10-1096E-01 PRIMER
Contextual Info: Product Information DOW CORNING 732 Multi-Purpose Sealant FEATURES Multi-purpose silicone adhesive/sealant • One-component adhesive/sealant • Cures at room temperature when exposed to moisture in the air • Acetoxy cure system • Non-sag, paste consistency

Dow Corning 340

Abstract: Dow Corning Dow Corning d 340 DOW 340 heat sink compound 340 Heat Sink Compound Semco cartridge AGP5223 D 217 dow corning silicone compound
Contextual Info: Product Information Silicon-Based Compounds Dow Corning 340 Heat Sink Compound FEATURES • High thermal conductivity • Low bleed • Stable at high temperatures COMPOSITION • Greaselike silicone fluid thickened with metal oxide filler Compound provides thermal coupling of electrical/electronic

Dow Corning DC 11

Abstract: Dow Corning Q3-6611 Q36611 Dow Corning 307 polysulphide Dow Corning DC 11 compound
Contextual Info: Product Information DOW CORNING Q3-6611 Adhesive FEATURES Flowable, one-component silicone adhesive • One-part • Flowable • Rapid heat cure • Addition cure system: no cure by-products • Self-priming • High tear strength • Flexible rubber - protects against

sic wafer

Contextual Info: Correlation between carrier recombination lifetime and forward voltage drop in 4H-SiC PiN diodes 1 ,a Gil Chung , M. J. Loboda1), Sid Sundaresan2) and Ranbir Singh2) 1 Dow Corning Compound Semiconductor Solutions, Midland MI 48611, USA 2 GeneSiC Semiconductor Inc., Dulles, VA, 20166, USA

Dow Corning 736

Abstract: Dow Corning FPH29194
Contextual Info: Product Information Silicone Sealants Dow Corning 736 Heat Resistant Sealant FEATURES • Will not sag or run • May be applied overhead or on side walls • May be used in applications with continuous exposure to 260°C 500°F and intermittent exposure

Sylgard 170

Abstract: Dow Corning 4 Catalyst sylgard 160 Dow Corning 140 MIL-PRF23586F SYLGARD low volatile potting silicone 92023 CORNING Resistor sylgard 186
Contextual Info: P R O D U C T I N F O R M A T I O N Information about Dow Corning brand Silicone Encapsulants Silicones and Electronics Long-term, reliable protection of sensitive circuits and components is becoming more important in many of today’s delicate and demanding electronic applications. Silicones function as durable

Contextual Info: Product Information Solar Sylgard 184 Silicone Elastomer FEATURES • Transparent • Cures to flexible elastomer • Constant cure rate, regardless of sectional thickness or degree of confinement • Service range of -45 to 200°C -49 to 392°F • No post cure required

Sylgard 170

Contextual Info: Product Information Electronics Encapsulants FEATURES & BENEFITS • Low viscosity  Long working time  Room temp or heat accelerated cure  Moderate thermal conductivity  UL 94V-0 and Mil Spec tested to MIL-PRF-23586F specifically listed material numbers only

SYLGARD 527

Abstract: SYLGARD 527 A B Dow Corning 527 D1084 SYLGARD 527 A B gel Dow Corning SYLGARD D1824 silicone red rubber viscosity
Contextual Info: Product Information SYLGARD 527 Silicone dielectric gel FEATURES Purity tested gel • Two-part, 1:1 mixing ratio • Low viscosity • Room temperature cure or rapid heat cure • Addition cure system: no cure by-products • Self-healing gel • Permanent pressure sensitive

austerlitz WPS

Abstract: austerlitz wacker P12 v6515 Wacker igbt eupec V6515 Paste Dow Corning d 340 Dow Corning 340 wps 50gr
Contextual Info: APPLICATION NOTE Date: 2002-12-19 Page 1 of 4 AN Number: AN2002-12 Aging stability of various heatconducting pastes for use with modules without baseplates Heat-conducting pastes from various manufacturers were tested for their aging stability in conjunction with an

LGA1156

Abstract: LGA115 a6063 intel i5 Dow Corning TC 1996 2759t Dow Corning TC-1996* Dow Corning TC-1996 LGA1156 thermal
Contextual Info: 2009 Ne w LGA115 6 FHS-A9025S19 DELTA ELECTRONICS, INC. Application: Intel Core i5 Picture: Intel LGA1156 Nehalem(45nm 95W) / Westmere (32nm 87W) CPU Lynnfield & Clarkdale sequence (Low Profile M/B mounting hole pitch 75x 75mm) Thermal & Mechanical Spec.:

DOW 1-2620

Abstract: Dow Corning 1-2620 low voc RTV Silicone Dow Corning RTV Silicone Dow Corning 1-2577 dow 1-2577 asymtek conforming corning 1-2577 12620 conformal rabbit semiconductor TN303
Contextual Info: TN303 Conformal Coating Z-World has started to apply conformal coating to high-impedance circuits such as the 32 kHz oscillator on Rabbit-based boards to protect them from moisture and contaminants. This Technical Note explains the purpose, types, and application procedures for the conformal coatings used to protect these sensitive circuits.

Polydimethylsiloxane

Abstract: power supply hv laser co2 MSDS ferrite Dow Corning DC 11 40KV CABLE HV transformer 5kv LC1202 40kv transformer SERVICE MANUAL OF FLUKE 724 Dow Corning 340
Contextual Info: INSTRUCTION MANUAL FOR LC1202 HIGH VOLTAGE POWER SUPPLY 83-494-001 Revision D TDK-Lambda Americas Inc. 405 ESSEX ROAD, NEPTUNE, NJ 07753 TEL: 732 922-9300 FAX: (732) 922-9334 WEB: www.US.TDK-Lambda/HP THIS PAGE INTENTIONALLY BLANK ONE YEAR WARRANTY TDK-Lambda Americas, Inc. (405 Essex Road, Neptune, N.J. 07753), warrants that the unit is free from defects in

molykote

Abstract: wire ferrule crimp CT-1005 CT-1004 PANDUIT 100-5 Dow Corning
Contextual Info: PA24073A01 REV: 01 11-2004 CT-1002, CT-1003, CT-1004, CT-1005 and CT-1006 CONTROLLED CYCLE FERRULE CRIMPING TOOLS OPERATION, INSPECTION and MAINTENANCE INSTRUCTIONS Panduit Corp. 2004 Fig. 1 CRIMP POCKET for Insulated and Non-Insulated Ferrules. Part usage dependent on wire range.

LD50

Abstract: MGM095A
Contextual Info: MATERIAL SAFETY DATA SHEET SECTION 1: CHEMICAL PRODUCT AND COMPANY IDENTIFICATION PRODUCT: Barrier J-2 November 29, 2005 Vishay Micro-Measurements Post Office Box 27777 Raleigh, NC 27611 MSDS # MGM095A 919-365-3800 CHEMTREC 1-800-424-9300 U.S. 703-527-3887 (Outside U.S.)

September 2001

Abstract: NORTEL laser toyota engineering standard
Contextual Info: Winners Index Of Winners TO: The 100 Winners of the 2001 "R&D 100 Award" Winner Winner 3rdTech Inc. Advanced Ceramics Research Advanced Engine Technology Ltd. Advanced Fuel Research Agilent Technologies Inc. Aisan Industry Co. Amcast Industry Co. Ameritherm Inc.

Dow Corning RTV 3145

Abstract: rtv 3145 Trimethylated silica dow corning 3145 3145 RTV equivalent dow rtv 3145 rtv gray 3145 dow rtv gray 3145 1200 RTV MGM053I
Contextual Info: MATERIAL SAFETY DATA SHEET SECTION 1: CHEMICAL PRODUCT AND COMPANY IDENTIFICATION PRODUCT: RTV 3145 November 17, 2005 Vishay Micro-Measurements Post Office Box 27777 Raleigh, NC 27611 MSDS # MGM053I 919-365-3800 CHEMTREC 1-800-424-9300 U.S. 703-527-3887 (Outside U.S.)

JESD22-A114-F

Abstract: Application Specification 114-18022 734641-2 Dow corning 744 114-74013 1987025-1 114-18488 solarlok junction box photovoltaic module JESD22-A114F
Contextual Info: 114-18488 Application Specification 27. November 2009 Rev. S SOLARLOK * AMP GmbH Application specification 114-18488 Anschlusssystem für Solarpanels Connection system for Photovoltaic panel . Tyco Electronics Corporation, Harrisburg, PA 17105 * Trademark

RTV 3140

Abstract: Trimethylated silica Dow corning RTV 3140 Dow Corning 3140 Dow corning RTV 3140 MSDS FORMALDEHYDE 1200 RTV Dow Corning RTV Silicone A 27611 MGM052J
Contextual Info: MATERIAL SAFETY DATA SHEET SECTION 1: CHEMICAL PRODUCT AND COMPANY IDENTIFICATION PRODUCT: RTV 3140 November 23, 2005 Vishay Micro-Measurements Post Office Box 27777 Raleigh, NC 27611 MSDS # MGM052J 919-365-3800 CHEMTREC 1-800-424-9300 U.S. 703-527-3887 (Outside U.S.)

5052-T32

Abstract: 340 Heat Sink Compound Dow Corning
Contextual Info: M IC R O G U JA L IT Y / Application Notes SEM IC O N D U C TO R , INC. IBR Installation Data Recommended Plate Thickness, “ T” = Vs to 3/i6 inches Hole Diameter, “ D” = 0.747 ± .001 iiiches. Material, Aluminum with hardness Brinnell 10/500 55 to 75 tensile strength

Sumitomo EME-G600 material

Abstract: EME-G600 SUMITOMO EME-G600 SUMITOMO G600 EME G600 G600 mold compound MP8000AN Nitto Q3-6646 Compound
Contextual Info: Simtek Corporation Product Change Notification [PCN] Home page: http://www.simtek.com E-mail: information@simtek.com 4250 Buckingham Drive, Suite 100 Colorado Springs CO 80907 USA 719-531-9444 fax 719-531-9481 PCN # 10059 00 PCN Status Final PCN Date July 12, 2006

DIN ISO 1302

Abstract: Dow Corning 340 ejot torque TO247 CASE isoplus ixys mounting Dow Corning SMD-247 Dow Corning DC 11 plug M4 threaded stud SCREW EJOT
Contextual Info: Mounting instructions Basic Instructions Semiconductors should be mounted so that they are not heated up by adjacent parts. In case of natural convection heatsink fins must be arranged so that the air can flow freely from the bottom to the top. In case of forced convection by air or liquid the power semiconductor can be mounted in any position as long as the cooling

Contextual Info: SERIES 28 HiPer-D Introduction and Technical Reference Space-Grade HiPer-D Information Outgassing • HiPer-D® connectors must be specially processed to meet ASTM E595 outgassing requirements. • Modification codes are a convenient way to specify special