DIP8 JEDEC Search Results

pmfp

Abstract: SO8 package MS-012AA VSO40 SOT176-1 075E03 SOT144-1
Contextual Info: PACKAGE INFORMATION Page Index DIP PMFP SO VSO Soldering - Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

DIP40

Abstract: LQFP100 LQFP128 LQFP64 QFP44 DIP20 DIP28 015ad ZE 004-1
Contextual Info: PACKAGE INFORMATION Page Index DIP LQFP QFP SIL SO SSOP VSO Soldering - Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil)

LM833

Abstract: LM833 data JESD97 LM833N LM8335 V 833Y LM833 DIAGRAM
Contextual Info: LM833 Low Noise Dual Operational Amplifier • Low voltage noise: 4.5nV/√Hz ■ High gain bandwidth product: 15MHz ■ High slew rate: 7V/µs ■ Low distortion: 0.002% ■ Excellent frequency stability ■ ESD protection 2kV N DIP8 Plastic Package Description

Contextual Info: LM111-LM211-LM311 Voltage Comparators • Maximum input current: 150nA ■ Maximum offset current: 20nA ■ Differential input voltage range: ±30V ■ Power consumption:135mW at ±15V ■ Supply voltage: +5V to ±15V ■ Output current: 50mA N DIP8 Plastic Package

204C

Abstract: JESD97 LS204 LS204C LS204CD LS204CN LS204I ls204 application active filters butterworth second order ST 163 So8
Contextual Info: LS204 High performance dual operational amplifier Features • Low power consumption ■ Short-circuit protection ■ Low distortion, low noise ■ High gain-bandwidth product ■ High channel separation N DIP8 Plastic package Description The LS204 is a high performance dual operational

sot267

Contextual Info: Philips Semiconductors Package information Package outlines INDEX VERSION DESCRIPTION NAME PAGE DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 ; SOT97 593 DIP16 plastic dual in-line package; 16 leads (300 mil); long body

LS204CD

Contextual Info: LS204 High performance dual operational amplifier Features • Low power consumption ■ Short-circuit protection ■ Low distortion, low noise ■ High gain-bandwidth product ■ High channel separation N DIP8 Plastic package Description The LS204 is a high performance dual operational

softstart PWM offline

Abstract: NCP1231
Contextual Info: NCP1231 Low−Standby Power High Performance PWM Controller The NCP1231 represents a major leap towards achieving low standby power in medium−to−high power Switched−Mode Power Supplies such as notebook adapters, off−line battery chargers and consumer electronics equipment. Housed in SO−8 or DIP8, the

Contextual Info: NCP1231 Low-Standby Power High Performance PWM Controller The NCP1231 represents a major leap towards achieving low standby power in medium−to−high power Switched−Mode Power Supplies such as notebook adapters, off−line battery chargers and consumer electronics equipment. Housed in SO−8 or DIP8, the

TLP3540

Contextual Info: TLP3540 TOSHIBA Photocoupler GaAs Ired & Photo−MOS FET TLP3540 Memory Testers Logic IC Testers Data Recording Equipment Measuring Equipment Unit in mm TLP3540 is a photorelay and consists of a GaAs infrared emitting diode optically coupled to a photo−MOSFET in a 8−pin DIP package DIP8 .

Contextual Info: NCP1231 Low−Standby Power High Performance PWM Controller The NCP1231 represents a major leap towards achieving low standby power in medium−to−high power Switched−Mode Power Supplies such as notebook adapters, off−line battery chargers and consumer electronics equipment. Housed in SO−8 or DIP8, the

DIP18 package

Abstract: SOP20 Package SSOP10 DIP18 DIP20 DIP40 SDIP22 jedec MS-013 EIAJ SSOP020-P-0225
Contextual Info: PACKAGE CODE TABLE 2. PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP16 DIP16-D2/D3 DIP18 DIP20

SOP18 EIAJ

Abstract: QFP64 package jedec MS-013 emp8 Package dimension jedec QFP80 QFP80 jedec QFP100 QFP44-A1 SOP20 Package SOP24 EIAJ
Contextual Info: PACKAGE CODE TABLE PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18

DIP18

Abstract: DIP20 DIP40
Contextual Info: PACKAGE CODE TABLE PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18

UC384x pulse skipping

Abstract: ic ncp1200 1N4937 MTD1N60E NCP1200 NCP1201 NCP1201D100R2 NCP1201D60R2 NCP1201P100 NCP1201P60
Contextual Info: NCP1201 PWM Current−Mode Controller for Universal Off−Line Supplies Featuring Low Standby Power with Fault Protection Modes Housed in SO−8 or DIP8 package, the NCP1201 enhances the previous NCP1200 series by offering a reduced optocoupler current with additional brownout detection protection BOK . Similarly, the

QFP80

Abstract: SOP40 VQFN20 jedec QFP100 QFN28 QFP44-A1 QFP48 SOP20 Package sop28 SOP32
Contextual Info: PACKAGE CODE TABLE PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18

1n49376

Abstract: TO-223 MOSFET marking 735 optocoupler
Contextual Info: NCP1201 PWM Current−Mode Controller for Universal Off−Line Supplies Featuring Low Standby Power with Fault Protection Modes Housed in SO−8 or DIP8 package, the NCP1201 enhances the previous NCP1200 series by offering a reduced optocoupler current with additional brownout detection protection BOK . Similarly, the

tda1308

Abstract: MO-001 TDA1308A TDA1308AT TDA1308AUK TDA1308T TDA1308TT TDA1545A TDA1308 application MKA781
Contextual Info: TDA1308; TDA1308A Class-AB stereo headphone driver Rev. 04 — 25 January 2007 Product data sheet 1. General description The TDA1308; TDA1308A is an integrated class-AB stereo headphone driver contained in an SO8, DIP8 or a TSSOP8 plastic package. The TDA1308AUK is available in an 8 bump

QFP80

Abstract: QFP44-A1 SOP20 Package sop28 SSOP10 jedec MS-013
Contextual Info: PACKAGE CODE TABLE 2. PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18

diode 5v1

Contextual Info: NCP1201 PWM Current−Mode Controller for Universal Off−Line Supplies Featuring Low Standby Power with Fault Protection Modes Housed in SO−8 or DIP8 package, the NCP1201 enhances the previous NCP1200 series by offering a reduced optocoupler current with additional brownout detection protection BOK . Similarly, the

Contextual Info: NCP1231 Low- Standby Power High Performance PWM Controller The NCP1231 represents a major leap towards achieving low standby power in medium-to-high power Switched-Mode Power Supplies such as notebook adapters, off-line battery chargers and consumer electronics equipment. Housed in SO-8 or DIP8, the

LGA 1156 PIN OUT diagram

Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
Contextual Info: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)

sqfp 14x20

Abstract: 74ALSXX P51XA-G3 OTP-e PC 74 HCT 32 P sQFP 14X14 TDA1308 equivalent SG 2368 tqfp 14x14 tray TDA1308 application notes
Contextual Info: Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308 FEATURES GENERAL DESCRIPTION • Wide temperature range The TDA1308 is an integrated class AB stereo headphone driver contained in an SO8 or a DIP8 plastic package. The device is fabricated in a 1 mm CMOS process and has

DIP18

Abstract: DIP20 DIP28 DIP40 LQFP100 LQFP128 LQFP32 LQFP64 ZE 004-1
Contextual Info: PACKAGE INFORMATION Page Index 1694 DIP LQFP QFP SDIP SO SSOP TSSOP VSO 1696 1706 1710 1712 1713 1721 1725 1726 Soldering 1728 Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION PAGE DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil)