DIP20 PACKAGE Search Results

db535

Abstract: DIP20 DB586 DIP-20 SO20
Contextual Info: ST7MDT10-20/DVP DIP20/SO20 Connection Kit for ST7MDT10-DVP3 DATA BRIEF The DIP20/SO20 Connection Kit ST7 MDT1020/DVP provides the hardware you need to connect your ST7MDT10-DVP3 emulator to your application when debugging applications for ST7 microcontrollers in DIP20 and SO20 packages.

DB535

Abstract: DIP20 SO20 ST7MDT10-EMU3 DIP20-SO20 DB586 DIP-20
Contextual Info: AC7MDT10-D20/S20 DIP20/SO20 Connection Kit for ST7MDT10-EMU3 DATA BRIEF The DIP20/SO20 Connection Kit AC7MDT10D20/S20 provides the hardware you need to connect your ST7MDT10-EMU3 emulator to your application when debugging applications for ST7 microcontrollers in DIP20 and SO20 packages.

ST62E2X-EPB

Abstract: SO28 DIP28 ST62E2XC-EPB DIP20 ST6200 ST626X-EMU2 DIP-28 SO16 package st6280b
Contextual Info: ST62, Hardware Tools Overview Page 1 de1 Hardware Tools Overview ST62 FAMILY DEVICE GANG PROGRAMMER PACKAGE EPROM PROGRAMMER STARTER KIT EMULATOR ST62E0X-GP/DIP16 or ST62E2X-EPB ST62E0X-GP/SO16 ST622XC-KIT ST626X-EMU2 ST6208C/09C/10C/20C DIP20/SO20 ST62E10-GP/DIP20 or

BA6212

Contextual Info: Driver, 8-channel, high current BA6212 The BA6212 consists of an array of eight transistor circuits each of which has built-in input resistors. Dimensions U n its: mm BA6212 (DIP20) low voltage equipment. 20 )0 Features I • available in a DIP20 package

D2 Package

Abstract: DIP16 package d2 transistor DIP20
Contextual Info: PACKAGE DIMENSIONS DIP16-D2 DIP20 24.2±0.3 11 1 10 6.4±0.2 20 7.62 0.46±0.1 0.51MIN 2.54 1.0±0.2 2.8MIN 1.22MAX 4.7MAX 1.5±0.2 +0.15 0.25 -0.05 0~15° UNIT : mm

DIP20-P-300-2

Contextual Info: DIP20-P-300-2.54-S1 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.49 TYP. 2/Dec. 11, 1996

DIP20

Abstract: DMP16 QFP44-A1 QFP64-G1 SDIP22 SDIP24 SDIP28 SDIP42 SDMP30
Contextual Info: RECOMMENDED MOUNTING METHOD RECOMMENDED MOUNTING METHOD 1. Soldering Method The recommended soldering methods for each are show In the following table. 1 Recommended Soldering Methods Table Through-Hole mount device type package PACKAGE DIP16 DIP20 SDIP22

Contextual Info: Reliability Tests Report Product Name: TC74HCT245AP Package Name: DIP20 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)

Contextual Info: Reliability Tests Report Product Name: TC74HCT273AP Package Name: DIP20 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)

Contextual Info: Reliability Tests Report Product Name: TC74HCT688AP Package Name: DIP20 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)

Contextual Info: Reliability Tests Report Product Name: TC74ACT640P Package Name: DIP20 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)

DIP20-P-300-2

Contextual Info: DIP20-P-300-2.54-W1 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.50 TYP. 2/Dec. 11, 1996

Contextual Info: Reliability Tests Report Product Name: TC74HC240AP Package Name: DIP20 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)

Contextual Info: Reliability Tests Report Product Name: TC74HC7240AP Package Name: DIP20 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)

Contextual Info: Reliability Tests Report Product Name: TC74HCT244AP Package Name: DIP20 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)

4-bit flash adc

Abstract: UAA1005 STV9410 PQFP44 SO24 STV8438CV DIP20
Contextual Info: COMPUTER DISPLAY CIRCUITS GRAPHIC Type STV9410 Description Graphic Display Processor for CRT & LCD Package DIP20 - SO24 HIGH SPEED DATA CONVERSION Type UAA1005 Description 4-bit Flash ADC, 30 MHz Sampling Rate Package DIP24 TRIPLE DAC Type STV8438CV Description

TLP621 optocoupler

Abstract: SMPS IC 2003 diagram ATX PWM control atx SMPS 2003 ic LM7912CV pc atx 20 pin smps diagram IC 78L05 SMPS IC 2003 ATX control LM7912CV st SCHEMATIC DIAGRAM SMPS 12v 5A SMPS IC 2003 16 pin diagram ATX PWM control
Contextual Info: TSM111 TRIPLE VOLTAGE AND CURRENT SUPERVISOR •OVERVOLTAGE PROTECTION FOR 3.3V, 5V AND 12V WITHOUT EXTERNAL COMPONENTS ■ OVERCURRENT PROTECTION FOR 3.3V, 5V AND 12V WITH INTERNAL THRESHOLD VOLTAGE N DIP20 Plastic Package ■ POWER GOOD CIRCUITRY ■ GENERATES POWER GOOD SIGNAL

atx SMPS 2003 ic

Abstract: SMPS IC 2003 ATX control SMPS IC 2003 diagram ATX PWM control
Contextual Info: TSM111 TRIPLE VOLTAGE AND CURRENT SUPERVISOR •OVERVOLTAGE PROTECTION FOR 3.3V, 5V AND 12V WITHOUT EXTERNAL COMPONENTS ■ OVERCURRENT PROTECTION FOR 3.3V, 5V AND 12V WITH INTERNAL THRESHOLD VOLTAGE N DIP20 Plastic Package ■ POWER GOOD CIRCUITRY ■ GENERATES POWER GOOD SIGNAL

TDA8191

Abstract: OV-10 DIP20 OV10 C417
Contextual Info: /= T SGS-THOMSON TDA8191 TV SOUND CHANNEL • ■ ■ ■ ■ ■ ■ ■ HIGH SENSITIVITY EXCELLENT AM REJECTION DC VOLUME CONTROL PERITELEVISION FACILITY 4W OUTPUT POWER LOW DISTORTION THERMAL PROTECTION TURN-ON AND TURN-OFF MUTING DIP20 Plastic Package

TDA8191

Abstract: tda AMP 12V DIP20
Contextual Info: TDA8191 TV SOUND CHANNEL . . . . HIGH SENSITIVITY EXCELLENT AM REJECTION DC VOLUME CONTROL PERITELEVISION FACILITY 4W OUTPUT POWER LOW DISTORTION THERMAL PROTECTION TURN-ON AND TURN-OFF MUTING DIP20 Plastic Package ORDER CODE : TDA8191 DESCRIPTION The TDA8191 is a monolithic integrated circuit that

CMOS NE555

Abstract: lm393 equivalent DC MOTOR DRIVE WITH LM324 PWM generator TL084 NE556 PWM tsm103 application LM358 replacement UA741 DIP14 TL071 IC equivalent ic MC33079
Contextual Info: Packages Thin Shrink Small Outline Packages Tiny Package OUT 1 SOT23-3 TSSOP8 SO8 DIP8 SOT23-5 TSSOP14 SO14 DIP14 TSSOP16 SO16 DIP16 SO20 DIP20 OPERATIONAL AMPLIFIERS COMPARATORS TIMERS VOLTAGE REFERENCES MIXED ANALOG 5 V+ V- 2 IN+ 3 Dual in Line Packages

Contextual Info: Reliability Tests Report Product Name: TC74HCT540AP Package Name: DIP20 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)

Contextual Info: Reliability Tests Report Product Name: TC74HC244AP Package Name: DIP20 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)

Contextual Info: Reliability Tests Report Product Name: TC74VHC9541P Package Name: DIP20 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)