DIP PACKAGES OF 7 RESISTORS EACH Search Results

DIP SWITCH

Abstract: datasheet of 4-pin DIP switch
Contextual Info: Using ispGDS f Devices TM your design will require fewer solder joints and external parts, improving mechanical reliability and lowering assembly cost. The ispGDS family also provides additional capability for system test. Since you can set each I/O pin of an ispGDS device to either Vcc or Ground GND , your

ispGDS14

Contextual Info: Using ispGDS f Devices TM your design will require fewer solder joints and external parts, improving mechanical reliability and lowering assembly cost. The ispGDS family also provides additional capability for system test. Since you can set each I/O pin of an ispGDS device to either Vcc or Ground GND , your

Contextual Info: Hermetic Dual Inline Package Features Electro-Films offers a broad line of standard Dual Inline Package DIP resistor networks. Hermetic packages with 8,14,16,18, 20, or 24 leads are offered. Each DIP network is available in three different standard network configurations: isolated, series connection, and common connection. Six tolerance

ispcode

Abstract: ispGDS14
Contextual Info: Using ispGDS f Devices TM your design will require fewer solder joints and external parts, improving mechanical reliability and lowering assembly cost. The ispGDS family also provides additional capability for system test. Since you can set each I/O pin of an ispGDS device to either Vcc or Ground GND , your

Contextual Info: Using ispGDS f Devices TM your design will require fewer solder joints and external parts, improving mechanical reliability and lowering assembly cost. The ispGDS family also provides additional capability for system test. Since you can set each I/O pin of an ispGDS device to either Vcc or Ground GND , your

UDQ2559B

Abstract: UDN2559LB UDQ2559B-T UDK2559EBTR UDN2559B UDN2559B-T UDN2559EB UDN2559EB-T UDN2559EBTR UDN2559LB-T
Contextual Info: 2559 Protected Quad Power Driver Features and Benefits Description ▪ 700 mA output current per channel ▪ Independent overcurrent protection for each driver ▪ Thermal protection for device and each driver ▪ Low output-saturation voltage ▪ Integral output flyback diodes

HDIP

Contextual Info: HD420, 421, 422 Vishay Electro-Films Hermetic Dual In-line Package FEATURES Product may not be to scale Vishay Electro-Films EFI offers a broad line of standard DualIn-line Package (DIP) resistor networks. Hermetic packages with 8, 14, 16, 18, 20, or 24 leads are offered. Each DIP network

UDQ2559

Abstract: UDK2559B
Contextual Info: 2559 Protected Quad Power Driver Features and Benefits Description ▪ 700 mA output current per channel ▪ Independent overcurrent protection for each driver ▪ Thermal protection for device and each driver ▪ Low output-saturation voltage ▪ Integral output flyback diodes

UDQ2559LB

Abstract: UDN2559LBTR
Contextual Info: 2559 Protected Quad Power Driver Features and Benefits Description ▪ 700 mA output current per channel ▪ Independent overcurrent protection for each driver ▪ Thermal protection for device and each driver ▪ Low output-saturation voltage ▪ Integral output flyback diodes

udn2559bt

Abstract: UDN2559B-T UDQ2559LBTR-T UDQ2559 UDQ2559B-T UDK2559B-T UDK2559EBTR UDK2559LBTR UDK2559LBTR-T UDQ2559B
Contextual Info: 2559 Protected Quad Power Driver Features and Benefits Description ▪ 700 mA output current per channel ▪ Independent overcurrent protection for each driver ▪ Thermal protection for device and each driver ▪ Low output-saturation voltage ▪ Integral output flyback diodes

UDQ2559LBTR-T

Abstract: UDN2559B-T UDK2559B-T UDK2559EBTR UDK2559LBTR UDK2559LBTR-T UDQ2559B UDQ2559B-T udn2559ebtr-t
Contextual Info: 2559 Protected Quad Power Driver Features and Benefits Description ▪ 700 mA output current per channel ▪ Independent overcurrent protection for each driver ▪ Thermal protection for device and each driver ▪ Low output-saturation voltage ▪ Integral output flyback diodes

MAX232E

Abstract: 16-Pin SSOP RS-232 Transceivers MAX211ECWI MAX241ECWI MAX202E MAX203E MAX205E MAX213E MAX211ECA
Contextual Info: 19-0175; Rev 5; 10/03 ±15kV ESD-Protected, +5V RS-232 Transceivers Next-Generation Device Features The MAX202E–MAX213E, MAX232E/MAX241E line drivers/receivers are designed for RS-232 and V.28 communications in harsh environments. Each transmitter output and receiver input is protected against ±15kV

Contextual Info: MAX202E–MAX213E, MAX232E/MAX241E LE AVAILAB ±15kV ESD-Protected, +5V RS-232 Transceivers General Description Next-Generation Device Features The MAX202E–MAX213E, MAX232E/MAX241E line drivers/receivers are designed for RS-232 and V.28 communications in harsh environments. Each transmitter

MAX232E

Abstract: MAX232EEWE MAX211E MAX232EESE MAX208ECWG MAX202E MAX203E MAX205E MAX213E
Contextual Info: 19-0175; Rev 6; 3/05 ±15kV ESD-Protected, +5V RS-232 Transceivers Next-Generation Device Features The MAX202E–MAX213E, MAX232E/MAX241E line drivers/receivers are designed for RS-232 and V.28 communications in harsh environments. Each transmitter output and receiver input is protected against ±15kV

Contextual Info: MAX202E–MAX213E, MAX232E/MAX241E LE AVAILAB ±15kV ESD-Protected, +5V RS-232 Transceivers General Description Next-Generation Device Features The MAX202E–MAX213E, MAX232E/MAX241E line drivers/receivers are designed for RS-232 and V.28 communications in harsh environments. Each transmitter

MAX232EEWE

Abstract: C2C211 MAX211E MAX232E MAX232EESE MAX208ECWG
Contextual Info: 19-0175; Rev 6; 3/05 ±15kV ESD-Protected, +5V RS-232 Transceivers Next-Generation Device Features The MAX202E–MAX213E, MAX232E/MAX241E line drivers/receivers are designed for RS-232 and V.28 communications in harsh environments. Each transmitter output and receiver input is protected against ±15kV

MAX232EEWE

Abstract: MAX211E MAX232E MAX232EESE MAX208ECWG
Contextual Info: 19-0175; Rev 6; 3/05 ±15kV ESD-Protected, +5V RS-232 Transceivers Next-Generation Device Features The MAX202E–MAX213E, MAX232E/MAX241E line drivers/receivers are designed for RS-232 and V.28 communications in harsh environments. Each transmitter output and receiver input is protected against ±15kV

Contextual Info: INA137 INA2137 INA 137 INA 213 7 INA 137 INA 213 7 AUDIO DIFFERENTIAL LINE RECEIVERS ±6dB G = 1/2 or 2 FEATURES APPLICATIONS ● SINGLE AND DUAL VERSIONS ● LOW DISTORTION: 0.0005% at f = 1kHz ● AUDIO DIFFERENTIAL LINE RECEIVER ● G = 1/2 OR G = 2 AMPLIFIER

MAX514BCNG

Abstract: MAX514ACWI
Contextual Info: 19-4516; Rev 1:2197 CMOS Quad, 12-Bit, Serial-Input M ultiplying DAC The MAX514 contains four 12-bit R-2R multiplying digital-to-analog converters DACs , each with a serial-in parallel-out shift register, a DAC register, and control logic. The MAX514’s 3-wire serial interface design mini­

Contextual Info: General Description Features Using BiCMOS technology, the MIC5841/5842 integrated circuits were fabricated to be used in a wide variety of peripheral power driver applications. The devices each have an eight-bit CMOS shift register, CMOS control circuitry,

Contextual Info: INA134 INA2134 INA 134 INA 213 4 INA 134 INA 213 4 AUDIO DIFFERENTIAL LINE RECEIVERS 0dB G = 1 FEATURES APPLICATIONS ● SINGLE AND DUAL VERSIONS ● AUDIO DIFFERENTIAL LINE RECEIVER ● LOW DISTORTION: 0.0005% at f = 1kHz ● HIGH SLEW RATE: 14V/µs

MAX4359

Contextual Info: 19-1389; Rev 2; 2/07 Low-Cost 4x4, 8x4, 8x8 Video Crosspoint Switches Features The MAX4359/MAX4360/MAX4456 low-cost video crosspoint switches are designed to reduce component count, board space, design time, and system cost. Each contains a matrix of T-switches that connect any of their four

HI9P0508-5

Abstract: 100N 9c transistor HI507
Contextual Info: HI-506, HI-507 Hl~508, HIS09 H a r r is S E M I C O N D U C T O R December 1993 Single 16 and 8/Differential 8 and 4 Channel CMOS Analog Multiplexers Features Description • Low On Resistance 1 son The HI-506/HI-507 and HI-508/HI-509 monolithic CMOS multiplexers each include an array of sixteen and eight ana­

Contextual Info: 19-1389; Rev 2; 2/07 Low-Cost 4x4, 8x4, 8x8 Video Crosspoint Switches Features The MAX4359/MAX4360/MAX4456 low-cost video crosspoint switches are designed to reduce component count, board space, design time, and system cost. Each contains a matrix of T-switches that connect any of their four