Part Number
    Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DIP PACKAGE DIMENSION Search Results

    DIP PACKAGE DIMENSION Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54ACT825/QKA
    		Rochester Electronics LLC 54ACT825/QKA - Dual marked (5962-9161101MKA), D-Type Flip-Flop, 5V, 24-CFP PDF Buy
    TPH1R306PL
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Datasheet
    TPH9R00CQH
    		Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Datasheet
    TPH9R00CQ5
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Datasheet
    TPHR8504PL
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Datasheet

    DIP PACKAGE DIMENSION Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    smd reed relay

    Abstract: DIP12
    Contextual Info: MEDER electronic DIP Series Molded DIP Reed Relays DESCRIPTION The DIP series is a very compact design having a low profile package and a high profile package. This series is compatible with all DIP relays. CHARACTERISTICS • Low profile package • Standard pin configurations


    Original     		PDF

    SHEET24

    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC To Top / Package Lineup / Package Index DIP-24C-A07 EIAJ code :∗DIP024-C-0600-4 24-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-24C-A07 24-pin ceramic DIP


    Original     		DIP-24C-A07 DIP024-C-0600-4 24-pin DIP-24C-A07) D24021SC-1-3 SHEET24 PDF

    fujitsu

    Abstract: 20p 2.54 DIP-20P-M01
    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 20 PIN PLASTIC To Top / Package Lineup / Package Index DIP-20P-M01 EIAJ code :∗DIP020-P-0300-1 20-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-20P-M01 20-pin plastic DIP


    Original     		DIP-20P-M01 DIP020-P-0300-1 20-pin DIP-20P-M01) D20005S-3C-3 fujitsu 20p 2.54 DIP-20P-M01 PDF

    DIP032-P-0600-1

    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN PLASTIC To Top / Package Lineup / Package Index DIP-32P-M01 EIAJ code :∗DIP032-P-0600-1 32-pin plastic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Plastic mold DIP-32P-M01 32-pin plastic DIP


    Original     		DIP-32P-M01 DIP032-P-0600-1 32-pin DIP-32P-M01) D32007S-1C-3 DIP032-P-0600-1 PDF

    22-Pin

    Abstract: transistor 22p
    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 22 PIN PLASTIC To Top / Package Lineup / Package Index DIP-22P-M03 EIAJ code :∗DIP022-P-0400-1 22-pin plastic DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Plastic mold DIP-22P-M03 22-pin plastic DIP


    Original     		DIP-22P-M03 DIP022-P-0400-1 22-pin DIP-22P-M03) D22010S-4C-3 transistor 22p PDF

    48-pin

    Abstract: d480 DIP048-P-0600-1
    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index DIP-48P-M02 EIAJ code :∗DIP048-P-0600-1 48-pin plastic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Plastic mold DIP-48P-M02 48-pin plastic DIP


    Original     		DIP-48P-M02 DIP048-P-0600-1 48-pin DIP-48P-M02) D48003S-3C-3 d480 DIP048-P-0600-1 PDF

    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 14 PIN CERAMIC To Top / Package Lineup / Package Index DIP-14C-C04 EIAJ code :∗DIP014-G-0300-4 14-pin ceramic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Cerdip DIP-14C-C04 14-pin ceramic DIP


    Original     		DIP-14C-C04 DIP014-G-0300-4 14-pin DIP-14C-C04) DIP-C14-C04) D14006SC-2-3 PDF

    24-Pin Ceramic DIP

    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC To Top / Package Lineup / Package Index DIP-24C-C01 EIAJ code :∗DIP024-G-0600-2 24-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Cerdip DIP-24C-C01 24-pin ceramic DIP


    Original     		DIP-24C-C01 DIP024-G-0600-2 24-pin DIP-24C-C01) D24008SC-3-4 24-Pin Ceramic DIP PDF

    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 14 PIN PLASTIC To Top / Package Lineup / Package Index DIP-14P-M02 EIAJ code :∗DIP014-P-0300-1 14-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-14P-M02 14-pin plastic DIP


    Original     		DIP-14P-M02 DIP014-P-0300-1 14-pin DIP-14P-M02) D14010S-4C-3 PDF

    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC To Top / Package Lineup / Package Index DIP-16C-C04 EIAJ code :∗DIP016-G-0300-5 16-pin ceramic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Cerdip DIP-16C-C04 16-pin ceramic DIP


    Original     		DIP-16C-C04 DIP016-G-0300-5 16-pin DIP-16C-C04) D16032SC-4-3 PDF

    24-Pin Ceramic DIP

    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC To Top / Package Lineup / Package Index DIP-24C-C03 EIAJ code :∗DIP024-G-0600-3 24-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Cerdip DIP-24C-C03 24-pin ceramic DIP


    Original     		DIP-24C-C03 DIP024-G-0600-3 24-pin DIP-24C-C03) D24014SC-2-3 24-Pin Ceramic DIP PDF

    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 42 PIN CERAMIC To Top / Package Lineup / Package Index DIP-42C-A01 EIAJ code :∗DIP042-C-0600-1 42-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-42C-A01 42-pin ceramic DIP


    Original     		DIP-42C-A01 DIP042-C-0600-1 42-pin DIP-42C-A01) D42005SC-2-3 PDF

    48-pin

    Abstract: D4800 d480
    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN CERAMIC To Top / Package Lineup / Package Index DIP-48C-A01 EIAJ code :∗DIP048-C-0600-1 48-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-48C-A01 48-pin ceramic DIP


    Original     		DIP-48C-A01 DIP048-C-0600-1 48-pin DIP-48C-A01) D48001SC-3-3 D4800 d480 PDF

    fujitsu

    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 18 PIN PLASTIC To Top / Package Lineup / Package Index DIP-18P-M04 EIAJ code :∗DIP018-P-0300-3 18-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-18P-M04 18-pin plastic DIP


    Original     		DIP-18P-M04 DIP018-P-0300-3 18-pin DIP-18P-M04) D18015S-4C-3 fujitsu PDF

    18-Pin

    Abstract: d1801 DUAL transistor M03 DIP-18P-M03 D18011
    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 18 PIN PLASTIC To Top / Package Lineup / Package Index DIP-18P-M03 EIAJ code :∗DIP018-P-0300-2 18-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-18P-M03 18-pin plastic DIP


    Original     		DIP-18P-M03 DIP018-P-0300-2 18-pin DIP-18P-M03) D18011S-3C-3 d1801 DUAL transistor M03 DIP-18P-M03 D18011 PDF

    dip 24 dimension

    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC To Top / Package Lineup / Package Index DIP-24C-A04 EIAJ code :∗DIP024-C-0600-2 24-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-24C-A04 24-pin ceramic DIP


    Original     		DIP-24C-A04 DIP024-C-0600-2 24-pin DIP-24C-A04) D24013SC-2-3 dip 24 dimension PDF

    28-pin

    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index DIP-28P-M05 EIAJ code :∗DIP028-P-0600-2 28-pin plastic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Plastic mold DIP-28P-M05 28-pin plastic DIP


    Original     		DIP-28P-M05 DIP028-P-0600-2 28-pin DIP-28P-M05) D28013S-3C-2 PDF

    18-Pin

    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 18 PIN CERAMIC To Top / Package Lineup / Package Index DIP-18C-C01 EIAJ code :∗DIP018-G-0300-2 18-pin ceramic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Cerdip DIP-18C-C01 18-pin ceramic DIP


    Original     		DIP-18C-C01 DIP018-G-0300-2 18-pin DIP-18C-C01) D18005SC-4-3 PDF

    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 18 PIN PLASTIC To Top / Package Lineup / Package Index DIP-18P-M02 EIAJ code :∗DIP018-P-0300-1 18-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-18P-M02 18-pin plastic DIP


    Original     		DIP-18P-M02 DIP018-P-0300-1 18-pin DIP-18P-M02) D18009S-3C-3 PDF

    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 36 PIN PLASTIC To Top / Package Lineup / Package Index DIP-36P-M01 EIAJ code :∗DIP036-P-0600-1 36-pin plastic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Plastic mold DIP-36P-M01 36-pin plastic DIP


    Original     		DIP-36P-M01 DIP036-P-0600-1 36-pin DIP-36P-M01) D36001S-1C-2 PDF

    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 40 PIN CERAMIC To Top / Package Lineup / Package Index DIP-40C-A05 EIAJ code :∗DIP040-C-0600-3 40-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-40C-A05 40-pin ceramic DIP


    Original     		DIP-40C-A05 DIP040-C-0600-3 40-pin DIP-40C-A05) D40006SC-2-3 conten27( PDF

    DIP-14C-C01

    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 14 PIN CERAMIC To Top / Package Lineup / Package Index DIP-14C-C01 EIAJ code :∗DIP014-G-0300-1 14-pin ceramic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Cerdip DIP-14C-C01 14-pin ceramic DIP


    Original     		DIP-14C-C01 DIP014-G-0300-1 14-pin DIP-14C-C01) D14005SC-2-4 DIP-14C-C01 PDF

    28 pin ceramic dip

    Abstract: 28-pin
    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC To Top / Package Lineup / Package Index DIP-28C-A01 EIAJ code :∗DIP028-C-0600-1 28-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-28C-A01 28-pin ceramic DIP


    Original     		DIP-28C-A01 DIP028-C-0600-1 28-pin DIP-28C-A01) D28005SC-2-3 28 pin ceramic dip PDF

    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 20 PIN CERAMIC To Top / Package Lineup / Package Index DIP-20C-C02 EIAJ code :∗DIP020-G-0400-1 20-pin ceramic DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Cerdip DIP-20C-C02 20-pin ceramic DIP


    Original     		DIP-20C-C02 DIP020-G-0400-1 20-pin DIP-20C-C02) D20007SC-2-3 PDF