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    DIP PACKAGE DIMENSION Search Results

    DIP PACKAGE DIMENSION Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54ACT825/QKA
    		Rochester Electronics LLC 54ACT825/QKA - Dual marked (5962-9161101MKA), D-Type Flip-Flop, 5V, 24-CFP PDF Buy
    TPH1R306PL
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Datasheet
    TPH9R00CQH
    		Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Datasheet
    TPHR8504PL
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Datasheet
    TPH9R00CQ5
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Datasheet

    DIP PACKAGE DIMENSION Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    TQFP 100 PACKAGE footprint

    Abstract: footprint 24PIN DIP 100L J-10 J-12 J-13 footprint dip 16 AD #0953
    Contextual Info: ICS Standard Package Dimensions J-1 DIP Packages 8-Pin DIP Package 14-Pin DIP Package See individual data sheets for more specific ordering information. J-3 DIP Packages 16-Pin DIP Package 20-Pin DIP Package See individual data sheets for more specific ordering information.


    Original     		14-pin16-pin20-pin24-pin+928-pintqfp 100 package footprintfootprint 24pin dip100lj-10j-12j-13footprint dip 16ad #0953 PDF

    footprint 24PIN DIP

    Abstract: 1400E AF 239 TQFP 100 PACKAGE footprint dip Package dimension 100L J-10 J-12 J-13 TQFP 80 PACKAGE footprint
    Contextual Info: DIP Packages 8-Pin DIP Package 14-Pin DIP Package See individual data sheets for more specific ordering information. J-3 DIP Packages 16-Pin DIP Package 20-Pin DIP Package See individual data sheets for more specific ordering information. J-4 DIP Packages


    Original     		14-pin16-pin20-pin24-pin+1128-pinfootprint 24pin dip1400eaf 239tqfp 100 package footprintdip package dimension100lj-10j-12j-13tqfp 80 package footprint PDF

    32-PIN

    Abstract: PD-03 745 diode dimensions PD05 32 PIN
    Contextual Info: Package Diagram DIP Modules 32-Pin DIP Module PD02 1.590 1.610 0.600 0.620 0.590 0.610 0.007 0.013 0.315 0.335 0.100 TYP 0.015 0.025 0.125 0.175 0.050 TYP 32-Pin DIP Module PD03 1 DIMENSIONSININCHES MIN. MAX. Package Diagram 32-Pin DIP Module PD05 1.745 1.755


    Original     		32-pin60-pin600typpd-03+4745 diodedimensionspd0532 pin PDF

    smd reed relay

    Abstract: DIP12
    Contextual Info: MEDER electronic DIP Series Molded DIP Reed Relays DESCRIPTION The DIP series is a very compact design having a low profile package and a high profile package. This series is compatible with all DIP relays. CHARACTERISTICS • Low profile package • Standard pin configurations


    Original     		smd reed relaydip12 PDF

    mercury wetted relay

    Abstract: DIP12 DIP SWITCH 10 PIN smd reed relay 1A72
    Contextual Info: MEDER electronic DIP Series Molded DIP Reed Relays DESCRIPTION The DIP series is a very compact design having a low profile package and a high profile package. This series is compatible with all DIP relays. CHARACTERISTICS • Low profile package • Standard pin configurations


    Original     		mercury wetted relaydip12dip switch 10 pinsmd reed relay+11a72 PDF

    SHEET24

    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC To Top / Package Lineup / Package Index DIP-24C-A07 EIAJ code :∗DIP024-C-0600-4 24-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-24C-A07 24-pin ceramic DIP


    Original     		dip-24c-a07dip024-c-0600-424-pind24021sc-1-3+1sheet24 PDF

    fujitsu

    Abstract: 20p 2.54 DIP-20P-M01
    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 20 PIN PLASTIC To Top / Package Lineup / Package Index DIP-20P-M01 EIAJ code :∗DIP020-P-0300-1 20-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-20P-M01 20-pin plastic DIP


    Original     		dip-20p-m01dip020-p-0300-120-pind20005s-3c-3+2fujitsu20p 2.54 PDF

    DIP032-P-0600-1

    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN PLASTIC To Top / Package Lineup / Package Index DIP-32P-M01 EIAJ code :∗DIP032-P-0600-1 32-pin plastic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Plastic mold DIP-32P-M01 32-pin plastic DIP


    Original     		dip-32p-m01dip032-p-0600-132-pind32007s-1c-3 PDF

    22-Pin

    Abstract: transistor 22p
    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 22 PIN PLASTIC To Top / Package Lineup / Package Index DIP-22P-M03 EIAJ code :∗DIP022-P-0400-1 22-pin plastic DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Plastic mold DIP-22P-M03 22-pin plastic DIP


    Original     		dip-22p-m03dip022-p-0400-122-pind22010s-4c-3+1transistor 22p PDF

    48-pin

    Abstract: d480 DIP048-P-0600-1
    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index DIP-48P-M02 EIAJ code :∗DIP048-P-0600-1 48-pin plastic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Plastic mold DIP-48P-M02 48-pin plastic DIP


    Original     		dip-48p-m02dip048-p-0600-148-pind48003s-3c-3+1d480 PDF

    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 14 PIN CERAMIC To Top / Package Lineup / Package Index DIP-14C-C04 EIAJ code :∗DIP014-G-0300-4 14-pin ceramic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Cerdip DIP-14C-C04 14-pin ceramic DIP


    Original     		dip-14c-c04dip014-g-0300-414-pindip-c14-c04+1d14006sc-2-3 PDF

    24-Pin Ceramic DIP

    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC To Top / Package Lineup / Package Index DIP-24C-C01 EIAJ code :∗DIP024-G-0600-2 24-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Cerdip DIP-24C-C01 24-pin ceramic DIP


    Original     		dip-24c-c01dip024-g-0600-224-pind24008sc-3-4+124-pin ceramic dip PDF

    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 14 PIN PLASTIC To Top / Package Lineup / Package Index DIP-14P-M02 EIAJ code :∗DIP014-P-0300-1 14-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-14P-M02 14-pin plastic DIP


    Original     		dip-14p-m02dip014-p-0300-114-pind14010s-4c-3 PDF

    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC To Top / Package Lineup / Package Index DIP-16C-C04 EIAJ code :∗DIP016-G-0300-5 16-pin ceramic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Cerdip DIP-16C-C04 16-pin ceramic DIP


    Original     		dip-16c-c04dip016-g-0300-516-pind16032sc-4-3 PDF

    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 42 PIN CERAMIC To Top / Package Lineup / Package Index DIP-42C-A01 EIAJ code :∗DIP042-C-0600-1 42-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-42C-A01 42-pin ceramic DIP


    Original     		dip-42c-a01dip042-c-0600-142-pind42005sc-2-3 PDF

    48-pin

    Abstract: D4800 d480
    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN CERAMIC To Top / Package Lineup / Package Index DIP-48C-A01 EIAJ code :∗DIP048-C-0600-1 48-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-48C-A01 48-pin ceramic DIP


    Original     		dip-48c-a01dip048-c-0600-148-pind48001sc-3-3+2d4800d480 PDF

    fujitsu

    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 18 PIN PLASTIC To Top / Package Lineup / Package Index DIP-18P-M04 EIAJ code :∗DIP018-P-0300-3 18-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-18P-M04 18-pin plastic DIP


    Original     		dip-18p-m04dip018-p-0300-318-pind18015s-4c-3+1fujitsu PDF

    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN PLASTIC To Top / Package Lineup / Package Index DIP-16P-M03 EIAJ code :∗DIP016-P-0300-1 16-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-16P-M03 16-pin plastic DIP


    Original     		dip-16p-m03dip016-p-0300-116-pind16030s-3c-3 PDF

    18-Pin

    Abstract: d1801 DUAL transistor M03 DIP-18P-M03 D18011
    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 18 PIN PLASTIC To Top / Package Lineup / Package Index DIP-18P-M03 EIAJ code :∗DIP018-P-0300-2 18-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-18P-M03 18-pin plastic DIP


    Original     		dip-18p-m03dip018-p-0300-218-pind18011s-3c-3+3d1801dual transistor m03d18011 PDF

    dip 24 dimension

    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC To Top / Package Lineup / Package Index DIP-24C-A04 EIAJ code :∗DIP024-C-0600-2 24-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-24C-A04 24-pin ceramic DIP


    Original     		dip-24c-a04dip024-c-0600-224-pind24013sc-2-3+1dip 24 dimension PDF

    28-pin

    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index DIP-28P-M05 EIAJ code :∗DIP028-P-0600-2 28-pin plastic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Plastic mold DIP-28P-M05 28-pin plastic DIP


    Original     		dip-28p-m05dip028-p-0600-228-pind28013s-3c-2 PDF

    18-Pin

    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 18 PIN CERAMIC To Top / Package Lineup / Package Index DIP-18C-C01 EIAJ code :∗DIP018-G-0300-2 18-pin ceramic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Cerdip DIP-18C-C01 18-pin ceramic DIP


    Original     		dip-18c-c01dip018-g-0300-218-pind18005sc-4-3 PDF

    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 18 PIN PLASTIC To Top / Package Lineup / Package Index DIP-18P-M02 EIAJ code :∗DIP018-P-0300-1 18-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-18P-M02 18-pin plastic DIP


    Original     		dip-18p-m02dip018-p-0300-118-pind18009s-3c-3 PDF

    Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 36 PIN PLASTIC To Top / Package Lineup / Package Index DIP-36P-M01 EIAJ code :∗DIP036-P-0600-1 36-pin plastic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Plastic mold DIP-36P-M01 36-pin plastic DIP


    Original     		dip-36p-m01dip036-p-0600-136-pind36001s-1c-2 PDF