DIP IC 7 TERMINAL Search Results

HB2E-DC12V

Abstract: HB2E-DC24V hb1e-dc5v HB2E-DC5V MATSUA HB2E-DC12V HB1E-DC24V HB1E-DC12V HB2E-12VDC HB2E-DC24 MATSUSHITA HB2E-DC12V
Contextual Info: HB COST SAVING SUBMINATURE DIP RELAY 20 .787 HB-RELAYS UL File No.: E43028 CSA File No.: LR26550 11 .433 • Small size for increased packaging density • Sensitive - Very low operating power • Simple mechanism for stable quality - only 7 pieceparts • DIP matching 16 pin IC socket

Contextual Info: &AEC DIP SWITCHES SERIES 923 AUTO INSERTION TYPE INTERCONNECTION SPECIALISTS FEATURES • SAME SIZE WITH IC CAN BE ASSEMBLED BY ANY AUTOMATIC IC INSERTER. • MOLDED .300 [7 .6 2 ] INTEGRATED CIRCUIT PACKING OUTLINE ALLOWING AUTOMATIC INSERTION. • SMALLER SIZE MAKE BETTER HEAT CONVECTION DURING PC

Contextual Info: 1 2 / 1 5 /0 0 1 4 : 1 2 FAX 9 7 8 7 6 2 3 5 3 5 OMRON ELEC TRO N IC S, IN C. 003 48_XC5 DIN Connectors Twin-contact XC5C Triple-row Plugs DIN-C Type (Standard) XC5C-_ 22 (Right-angle dip terminals) (bottom view) • Ordering Information

IC140-4006-BF4

Abstract: PA 4006
Contextual Info: IC140 Serìes DIP YAMAICHI 2.54mm Pitch ELECTRONICS Features 7 s ) l- 7 t v - ; i^ l P-7 P 7 7^ A m (m m& £ 0.8mm) R o H S it^ W Five-poirrt contact design supporting circular or rectangular IC-lead Compatible with 1-mm-dia. through holes Low-profile design mountable on PCB at height 0.8mm

KS5313Q

Abstract: KS5313T KS5313S KS5313 KS5313N melody ks531 F r Elise
Contextual Info: SAnsUNb SEMICONDUCTOR INC 05 KS5313 F e | 7*11,414 d U005Ö33 b ^ " * ' •■. t - ~ n - * CMOS DIGITAL INTEGRATED CIRCUIT SIMPLE MELODY IC 8 DIP The KS5313 series is a CMOS LSI chip which electronically plays a prear­ ranged melody. FUNCTIONS

LA7755

Abstract: 3012A LA7751 LA7710
Contextual Info: SA NY O S E M I C O N D U C T O R COR-P 7b »ÌF| 7 ^ 7 D 7 b DODlflflT 5 j ~ » 7997076 SANYO SEMICONDUCTOR CORP |- A 7 7 ,1 0 76C 01889 m o n o lith ic lin ea r 1C D "t~77-07-0 7 C IR C U IT D R A W IN G N o .S IT G PAL/SECAM DUAL SYSTEM SIF 3006A The LA 7710 is a PAL/SECAM dual system SIF IC that is packaged in a 16-pin DIP plastic package and

Contextual Info: JAN 7 1993 BURR-BROW N VCA610 W IDEBAND VOLTAGE CONTROLLED AMPLIFIER FEATURES APPLICATIONS • WIDE GAIN CONTROL RANGE: 80dB • ULTRASOUND • • • • • AGC AMPLIFIER • ANALYTICAL INSTRUMENTATION SM ALL PACKAGE: 8-pin SO IC or DIP WIDE BANDWIDTH: 30MHz

7705F

Abstract: TA7405P TA7705F 7705P TA7405 1734i TAI40 1734-I
Contextual Info: TOSHIBA-. E L E C T R O N I C ! ^ 9097247 lOTTaM? 0017333 S J T -7 7 -2 1 JA7405P ÏA7705P TA7705F T O S H IB A . E L E C T R O N IC 02E 17333 D TENTATIVE LOW NOISE DUAL PREAMPLIFIER FOR AUTOREVERSE CAR STEREO. Unit in mm The TA7405P ZIP , TA7705P(DIP), TA7705F(MFP-S0)

Z86E3012PSC

Abstract: EPROM 2764a wv passat Z86E30 4FV diode IRC30
Contextual Info: ZILOG INC 3 QE D E l ‘HÛMOMB DG1 7 S 7 S □ E3 ZIL P r o d u c t S p e c if ic a t io n ‘ìSHti CMOS Z8 OTP CCP MICROCONTROLLER FEATURES • 8-bit CMOS microcomputer, 28-pin DIP All digital inputs, CMOS levels, Schmitt triggered ■ Low cost 4 Kbytes of one-time PROM

Contextual Info: 3179 SERIES SLIM D-SUB H/D 15P FEMALE R/A DIP TYPE 9th Shorter LOGO REV A E F ECN NO. DATE DESCRIPTION NAME 0 0 .1 0 .2 7 NEW RELEASE ROSY 0 2 .1 2 .0 6 A VARIATIONS 10212001 JASMINE 0 4 .0 7 .2 6 A m o d if ic a t io n CEC R03000620 JING OPTIONAL MATERIAL

es 1h

Contextual Info: H D -4702/883 O HARRIS January CM O S Program m able Bit Rate G enerator 1992 Features Pinout HD1 - 4 7 0 2 / 8 8 3 C E R A M IC DIP This Circuit is Processed in Accordance to MIL-STD883 and is Fully Conformant Under the Provisions of Paragraph 1 .2 . 1.

FM multiplex Stereo Demodulator

Abstract: 3006A
Contextual Info: SANYO SEMICONDUCTOR CORP 7b 7 9 9 7 0 7 6 SANYO SE MI CON DU CT OR CORP LA2113 ì È f| T W G T b 0 0 0 1 fl 4 3 3 76C 0 1 8 4 3 m o n o lit h ic lin e a r IC 0 f^äs'-üß' C IR C U IT D R A W I N G N O .S 0 3 3 FM NOISE CANCELER 3006A The L A 2 1 1 3 is a DIP-16 version of the LA2110. It has the capability to effectively remove external noise

Contextual Info: M 8 5 C 7 2 /8 2 /9 2 ic r o c h ip 1K/2K/4K 5.0V CMOS Serial EEPROM PACKAGETYPE FEATURES • Low power CMOS technology • Two wire serial interface bus, l2C compatible DIP O ' A0 C 1 8 ^ Vcc • 5 volt only operation • Self-timed write cycle including auto-erase

M5L27128

Contextual Info: M IT S U B IS H I M IC RO CO M PUTERS M 3 7 4 2 0 E 6 -X X X S P M 374 20E 6S S PROM VER SIO N of M 3 7 4 2 0 M 6 -X X X S P DESCRIPTION The M37420E6-XXXSP is a single-chip microcomputer de­ signed with CMOS silicon gate technology. It is housed in a 52-pin shrink plastic molded DIP. The features of this chip

Contextual Info: HARRIS SEMICOND SECTOR IbE • 4302271 0014382 3 ■ 82C52/883 JäJ HARRIS - - * * D ‘ i- ' ‘ T ''2 S ''3 7 “ ö s r June 1989 CMOS Serial Controller Interface Pinouts Features 8 2 C 5 2 /8 8 3 C E R A M IC DIP • This C ircuit is Processed in Accordance to M il-S td -8 8 3 and is Fully

Contextual Info: M 2 4 C 0 8 B/ 1 6 B ic r o c h ip 8K/16K 5.0V E-Temperature Serial EEPROMs PACKAGE TYPE FEATURES • Single supply with operation from 4.5-5.5V DIP • Low power CMOS technology A0 C 1 8 H Vcc Al C 2 7 □ WP A2 C 3 6 □ SCL [I 5 □ SDA - 1 mA active current typical

Contextual Info: P r e l im in a r y P r o d u c t S p e c if ic a t io a i CD O —I • Z86144 N Totally Logical IK ROM CMOS Z8 MCU W ITH EEPROM FEATURES D evice EEPROM Bytes ROM (KB) RAM* (Bytes) Speed (M H z) Z 86144 16 7 60 8 N ote: * General-Purpose • 18-Pin DIP and SOIC Packages

M7602

Abstract: ha 7681 7602 prom Harris 7603 harris 7602 HM-7603 Harris Semiconductor HM7603 ci la 7610 la 7610 HM-7602
Contextual Info: H 3 A R R H M -7602/03 IS SE M IC O N D U C T O R P R O D U C T S D IVISIO N 32 x 8 PROM A DIVISION OF H A R R IS CORPORATION H M -7602 — Open Collector Outputs H M -7 6 0 3 — "Three State" Outputs Pinouts Features TOP VIEW - DIP 50ns M AXIM U M ADDRESS ACCESS TIME

12 position DIP switch

Abstract: omron 16 position rotary DIP switch
Contextual Info: Rotary DIP Switch IA6C Internally Sealed DIL-IC Type Rotary DIP Switches Precision rotary cam/contact mechanism provides high reliability. Insert-moulded terminals and O-ring sealed rotor make sealing with tape unnecessary. Offset between terminal pins and side of case

OMRON DIP switch

Abstract: 16 position dip rotary switches
Contextual Info: Rotary DIP Switch A6C Internally Sealed DIL-IC Type Rotary DIP Switches Precision rotary cam/contact mechanism provides high reliability. Insert-moulded terminals and O-ring sealed rotor make sealing with tape unnecessary. Offset between terminal pins and side of case

8 pin ic base socket round pin type lead

Abstract: OMRON DIP switch ic 6602 rotary coded switch 16 positions DIP SWITCH OMRON DIP mounting 4 pin dip switch push switch 6mm rotary coded switch 12 positions
Contextual Info: Back Rotary DIP Switch A6C Internally Sealed DIL-IC Type Rotary DIP Switches Precision rotary cam/contact mechanism provides high reliability. Insert-moulded terminals and O-ring sealed rotor make sealing with tape unnecessary. Offset between terminal pins and side of case

OMRON DIP mounting

Abstract: OMRON DIP switch binarycoded
Contextual Info: omRon A6C Rotary DIP Switch ! _ I Internally Sealed DIL-IC Type Rotary DIP Switches • Precision rotary cam/contact mechanism provides high reliability. ■ Insert-moulded terminals and O-ring sealed rotor make sealing with tape unnecessary. Ordering

Contextual Info: M O DEL 3 0 0 P rin ted C irc u it Board C o n n ecto rs Dip Solder FEA TU R ES • • • • • • Right angle or straight through dip solder terminals Threaded mounting studs Male contacts molded in Mating connector has solder cup or dip solder terminals

LM 3558

Abstract: 49/LM 3558
Contextual Info: IC 160 SERIES P tC C O ,27m m pitch •Term inal Type Solder dip) (Long terminal SMT) FEATURES • Low profile design with package height 3.8 to 5.0mm (SMT type) or (IC identical pattern) 6.0mm (solder dip type). • SMT (IC identical foot pattern and long terminal type) and solder