DIM1200ESM33F00 Search Results

DIM1200ESM33F00 Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Datasheet Type	PDF	PDF Size	Page count
DIM1200ESM33-F000		Linear Integrated Systems	IGBT Modules - 3300V	Original	PDF	978.87KB	9

DIM1200ESM33F00 Price and Stock

Filter by Manufacturer

Power Integrations


Power Integrations 1SP0635D2S1C-DIM1200ESM33-F000 Gate Drivers Conformal Coded PI Gate Driver Only
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Mouser Electronics	1SP0635D2S1C-DIM1200ESM33-F000					1 - 10 $202.10 100 $181.26 1000 $181.26 10000 $181.26	Get Quote
Power Integrations 1SP0635V2M1C-DIM1200ESM33-F000 Gate Drivers Plug-and-Play Gate Driver, SCALE-2, master, fiber optic interface with versatile link
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Mouser Electronics	1SP0635V2M1C-DIM1200ESM33-F000					1 - 10 $402.07 100 $389.69 1000 $389.69 10000 $389.69	Get Quote
Power Integrations 1SD536F2-DIM1200ESM33-F000 Power Management Modules ONLY for Dynex DIM1200ESM33-F000 module
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Mouser Electronics	1SD536F2-DIM1200ESM33-F000					1 - 10 - 100 - 1000 - 10000 -	Get Quote
Power Integrations 1SP0635D2S1-DIM1200ESM33-F000 Gate Drivers ONLY for Dynex DIM1200ESM33-F000 module
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Mouser Electronics	1SP0635D2S1-DIM1200ESM33-F000					1 - 10 $141.90 100 $127.27 1000 $127.27 10000 $127.27	Get Quote
Power Integrations 1SP0635V2M1-DIM1200ESM33-F000 Gate Drivers ONLY for Dynex DIM1200ESM33-F000 module
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Mouser Electronics	1SP0635V2M1-DIM1200ESM33-F000					1 - 10 $327.46 100 $317.38 1000 $317.38 10000 $317.38	Get Quote

Find more DIM1200ESM33F00 price and stock on Findchips.com

DIM1200ESM33F00 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
Contextual Info: DIM1200ESM33-F000 Single Switch IGBT Module DS5831-1.0 JULY. 2005 LN23824 FEATURES • 10µs Short Circuit Withstand • Soft Punch Through Silicon • Isolated MMC Base with AIN Substrates • Lead Free construction • High Thermal Cycling Capability KEY PARAMETERS	Original	DIM1200ESM33-F000 DS5831-1 LN23824)	PDF
DIM1200ESM33-F000 Contextual Info: DIM1200ESM33-F000 Single Switch IGBT Module DS5831-1.0 JULY. 2005 LN23824 FEATURES • 10µs Short Circuit Withstand • Soft Punch Through Silicon • Isolated MMC Base with AIN Substrates • Lead Free construction • High Thermal Cycling Capability KEY PARAMETERS	Original	DIM1200ESM33-F000 DS5831-1 LN23824) DIM1200ESM33-F000	PDF
Contextual Info: DIM1200ESM33-F000 DIM1200ESM33-F000 Single Switch IGBT Module PDS5614-3.0 June 2004 FEATURES • Soft Punch Through Silicon ■ 10µs Short Circuit Withstand ■ Isolated MMC Base with AlN Substrates ■ High Thermal Cycling Capability KEY PARAMETERS VCES	Original	DIM1200ESM33-F000 PDS5614-3 DIM1200ESM33-F000	PDF
DIM1200ESM33-F000 Abstract: DIM1200ESM33-F Contextual Info: DIM1200ESM33-F000 Single Switch IGBT Module Replaces DS5831-2 DS5831-3 May 2011 LN28347 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Soft Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK) (max)	Original	DIM1200ESM33-F000 DS5831-2 DS5831-3 LN28347) DIM1200ESM33-F000 DIM1200ESM33-F	PDF
Contextual Info: DIM1200ESM33-F000 DIM1200ESM33-F000 Single Switch IGBT Module PDS55614-1.1 June 2003 FEATURES • Soft Punch Through Silicon ■ 10µs Short Circuit Withstand ■ Isolated MMC Base with AlN Substrates ■ High Thermal Cycling Capability KEY PARAMETERS VCES	Original	DIM1200ESM33-F000 PDS55614-1 DIM1200ESM33-F000	PDF
Contextual Info: DIM1200ESM33-F000 DIM1200ESM33-F000 Single Switch IGBT Module PDS5614-2.1 April 2004 FEATURES • Soft Punch Through Silicon ■ 10µs Short Circuit Withstand ■ Isolated MMC Base with AlN Substrates ■ High Thermal Cycling Capability KEY PARAMETERS VCES	Original	DIM1200ESM33-F000 PDS5614-2 DIM1200ESM33-F000	PDF
DIM1200ESM33F00 Abstract: MJ480 DIM1200ESM33-F000 Contextual Info: DIM1200ESM33-F000 Single Switch IGBT Module Replaces DS5831-1.1 FEATURES 10µs Short Circuit Withstand High Thermal Cycling Capability Soft Punch Through Silicon Isolated AlSiC Base with AlN Substrates DS5831-2 March 2010 LN27122 KEY PARAMETERS VCES VCE(sat) * (typ)	Original	DIM1200ESM33-F000 DS5831-1 DS5831-2 LN27122) DIM1200ESM33F00 MJ480 DIM1200ESM33-F000	PDF
bi-directional switches IGBT Abstract: DIM1200ESM33-F000 Contextual Info: DIM1200ESM33-F000 Single Switch IGBT Module DS5831-1.1 January. 2008 LN25870 FEATURES 10µs Short Circuit Withstand Soft Punch Through Silicon Isolated MMC Base with AIN Substrates Lead Free construction KEY PARAMETERS VCES VCE (sat)* (typ) IC (max) IC(PK)	Original	DIM1200ESM33-F000 DS5831-1 LN25870) DIM1200ESM33-F000 bi-directional switches IGBT	PDF
Contextual Info: DIM1200ESM33-F000 Single Switch IGBT Module Replaces DS5831-2 DS5831-3 May 2011 LN28347 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Soft Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK) (max)	Original	DIM1200ESM33-F000 DS5831-2 DS5831-3 LN28347)	PDF