DIAMOND CHIP TERMINATION Search Results

CA0505D

Abstract: ca0505
Contextual Info: ATTENUATOR, TABBED CVD DIAMOND CHIP 20 WATT DATA SHEET PART NUMBER: CA0505D XXT FEATURES DC – 18 GHz CVD Diamond Substrate Small Size Highest Thermal Performance Excellent Peak Power Capability Self Passivated Tantalum Nitride Film Unaffected By Moisture

CA0505D

Contextual Info: ATTENUATOR, FLANGE MOUNT CVD DIAMOND CHIP 20 WATT DATA SHEET PART NUMBER: CA0505D XXFT FEATURES DC – 18 GHz CVD Diamond Substrate Small Size Highest Thermal Performance Excellent Peak Power Capability Self Passivated Tantalum Nitride Film Unaffected By Moisture

Contextual Info: ATTENUATOR CVD DIAMOND CHIP 20 WATT DATA SHEET PART NUMBER: CA0505D XX FEATURES EN 12-1966 11/05/2012 SHEET 1 OF 2 APPLICATIONS DC – 26.5 GHz CVD Diamond Substrate Small Size Highest Thermal Performance Excellent Peak Power Capability Self Passivated Tantalum Nitride Film

waffle

Abstract: CA0505D
Contextual Info: ATTENUATOR CVD DIAMOND CHIP 20 WATT DATA SHEET PART NUMBER: CA0505D XX FEATURES EN 12-0442 04/23/2012 SHEET 1 OF 2 APPLICATIONS DC – 26.5 GHz CVD Diamond Substrate Small Size Highest Thermal Performance Excellent Peak Power Capability Self Passivated Tantalum Nitride Film

Contextual Info: ATTENUATOR CVD DIAMOND CHIP 20 WATT DATA SHEET PART NUMBER: CA0505D XX FEATURES EN 13-0252 1/29/2013 SHEET 1 OF 2 APPLICATIONS DC – 26.5 GHz CVD Diamond Substrate Small Size Highest Thermal Performance Excellent Peak Power Capability Self Passivated Tantalum Nitride Film

A-1297

Contextual Info: THICK FILM CHIP ATTENUATORS DESCRIPTION Wire and ribbon bondable and Flipchip thick film chip attenuators, printed and fired on 96% alumina. Provides attenuation accuracy for frequencies through 10Ghz. Double layer terminations provide additional bonding surface. Abrasive trimming ensures optimum resistor stability. Diamond sawed for dimensional

Contextual Info: THICK FILM CHIP ATTENUATORS DESCRIPTION Wire and ribbon bondable and Flipchip thick film chip attenuators, printed and fired on 96% alumina. Provides attenuation accuracy for frequencies through lOGhz. Double layer terminations provide additional bonding surface. Abrasive trimming ensures optimum resistor stability. Diamond sawed for dimensional

CT0402D

Abstract: Diamond Chip Termination
Contextual Info: TERMINATION CVD DIAMOND CHIP 10 WATT DATA SHEET SHEET 1 OF 2 Dwg 1011105 PART SERIES: CT0402D FEATURES EN 13-3904 Revision - APPLICATIONS Small Size - Light Weight Highest Thermal Performance Possible Excellent Peak Power Capability Rugged Passivated TaN Film

CT1310D

Abstract: Diamond Chip Termination
Contextual Info: TERMINATION CVD DIAMOND CHIP 125 WATTS DATA SHEET PART SERIES: CT1310D FEATURES SHEET 1 OF 2 Dwg 1010545 EN 13-3904 Revision - APPLICATIONS Small Size - Light Weight Highest Thermal Performance Possible Excellent Peak Power Capability Rugged Passivated TaN Film

CT0603D

Abstract: Diamond Chip Termination
Contextual Info: TERMINATION CVD DIAMOND CHIP 50 WATTS DATA SHEET PART SERIES: CT0603D FEATURES SHEET 1 OF 2 Dwg 1011535 EN 13-3904 Revision - APPLICATIONS Small Size - Light Weight Highest Thermal Performance Possible Excellent Peak Power Capability Rugged Passivated TaN Film

CT0505D

Abstract: Diamond Chip Termination
Contextual Info: TERMINATION CVD DIAMOND CHIP 50 WATTS DATA SHEET PART SERIES: CT0505D FEATURES SHEET 1 OF 2 Dwg 1010525 EN 13-3904 Revision - APPLICATIONS Small Size - Light Weight Highest Thermal Performance Possible Excellent Peak Power Capability Rugged Passivated TaN Film

CT0505D

Abstract: CT1310D CR0505D SN95 solder diamond circuit flange RF resistor 50
Contextual Info: CVD Diamond High Power Resistors and Terminations Application Note 0022 General Description: There are many applications in RF design where it is necessary to absorb large amounts of RF power. In order to effectively absorb large amounts of power, resistors and terminations

CT1310D

Contextual Info: CVD DIAMOND FLANGE TERMINATION RoHS COMPLIANT D AT A S H E E T PART NUMBER: CT1310D HT FEATURES SHEET 1 OF 1 06/02/2011 APPLICATIONS DC – 20 GHz 125 Watts 50 Ohms Nominal CVD Diamond Substrate Small Size Highest Thermal Performance Excellent Peak Power Capability

power combiner broadband transformers

Abstract: 4 port circulator high power duplexer HIGH POWER HIGH FREQUENCY CVD DIAMOND CHIP RESISTORS footprint X-band Gan Hemt resistor parasitic capacitance DIAMOND TECHNOLOGIES DUAL JUNCTION CIRCULATOR CT1310D RFTM 9926 transistor
Contextual Info: Diamond Rf Resistives: The Answer to High Power and Low Capacitance | Novembe. Page 1 of 6 November 2011 issue: Technical Feature Diamond Rf™ Resistives: The Answer to High Power and Low Capacitance A single 0402 resistor, manufactured on a CVD diamond substrate, can dissipate 20 W of continuous

Contextual Info: LED Indicators ~ Panel ~ Dome Lens SSI-LXR4915XD-150 Series PANEL THICKNESS: 7.0mm MAX TERMINATION: 6” 24 AWG Leads T10mm Chrome Indicator, Recessed LED 6” Leads FEATURES / OPTIONS ►State-of-the-Art, High Brightness LED Chip Technology ►Choice of LED Colors and Lens Finishes

MTVA0300N07

Abstract: MTVA0300
Contextual Info: EMC Technology RF & MICROWAVE CABLE ASSEMBLIES & COAXIAL COMPONENTS CATALOG ASR Lab-­Flex Lab-­Flex® S Lab-­Flex® AF Semi-­Rigid, Conformable & Flexible Semi-­Rigid Low Loss RG Series Test Cable Assemblies DQG&RD[LDO3DVVLYH&RPSRQHQWV

trm a55

Contextual Info: EMC Technology RF & MICROWAVE CABLE ASSEMBLIES & COAXIAL COMPONENTS CATALOG ASR Lab-­Flex Lab-­Flex® S Lab-­Flex® AF Semi-­Rigid, Conformable & Flexible Semi-­Rigid Low Loss RG Series Test Cable Assemblies DQG&RD[LDO3DVVLYH&RPSRQHQWV

CT2335TALNF

Abstract: 1010765
Contextual Info: TERMINATION CHIP 120 WATT DATA SHEET PART SERIES: CT2335TALNF FEATURES SHEET 1 OF 2 Dwg 1010765 EN 14-0941 Revision A APPLICATIONS Wide Band Operation High Power Direct Attached Low VSWR Easy installation Mobile Networks Broadcast High Power Amplifiers Isolators

CT2335TALN

Abstract: 1010515
Contextual Info: TERMINATION CHIP 120 WATT DATA SHEET PART SERIES: CT2335TALN FEATURES SHEET 1 OF 2 Dwg 1010515 EN 14-0941 Revision A APPLICATIONS Wide Band Operation High Power Direct Attached Low VSWR Easy installation Mobile Networks Broadcast High Power Amplifiers Isolators

82A3031F

Contextual Info: TERMINATION CHIP 150 WATT DATA SHEET PART SERIES: 82A3031F FEATURES EN 13-3450 Revision- SHEET 1 OF 2 Dwg 82A3031F APPLICATIONS Wide Band Operation High Power Direct Attached Low VSWR Easy Installation Mobile Networks Broadcast High Power Amplifiers Isolators

82-7027

Contextual Info: TERMINATION CHIP 100 WATT DATA SHEET PART SERIES: 82-7027 FEATURES EN 13-3450 Revision- SHEET 1 OF 2 Dwg 82-7027 APPLICATIONS Wide Band Operation High Power Direct Attached Low VSWR Easy Installation Mobile Networks Broadcast High Power Amplifiers Isolators

Vitramon

Abstract: Fabrication process steps PERMITTIVITY BOX BUILD FABRICATION PROCESS dryer types front of fabrication process
Contextual Info: High Volume Manufacturing of Ceramic Chip Capacitors Wet vs Dry Fabrication V I S H A Y By Patrick M. Gormally, Product Marketing Manager At first glance, all ceramic chip capacitors appear identical. Side by side comparisons of various manufacturers, E.I.A. 1206 size

Contextual Info: TERMINATION CHIP 120 WATT DATA SHEET PART SERIES: CT2335TALNF FEATURES SHEET 1 OF 2 Dwg 1010765 EN 14-0409 Revision - APPLICATIONS Wide Band Operation High Power Direct Attached Low VSWR Easy installation Mobile Networks Broadcast High Power Amplifiers Isolators

82-8001

Contextual Info: TERMINATION CHIP 5 WATT DATA SHEET PART SERIES: 82-8001 FEATURES EN 13-3450 Revision- SHEET 1 OF 2 Dwg 82-8001 APPLICATIONS Wide Band Operation High Power Direct Attached Low VSWR Easy Installation Mobile Networks Broadcast High Power Amplifiers Isolators