DGG174 Search Results

Contextual Info: DENSE PAC 4 Megabit High Speed CMOS SRAM DPS256X16Cn3/DPS256X16Bn3 MICROSYSTEMS DESCRIPTION: The DPS256X16Cn3/DPS256X16Bn3 High Speed SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC .

IT16B

Contextual Info: IMP23216 IMP23416 23000 Series ROMS HIGH PERFORMANCE WORD/BYTE ORGANIZED ROMS Features • JEDEC Standard Versions: IMP23216 40 Pin 2Meg 131,072 word x 16 Bit or 262,144 word x 8 Bit IMP23416 40 Pin 4Meg (262,144 word x 16 Bit or 524,288 word x 8 Bit) • Fast Access Times: