DEAD BUG Search Results

Contextual Info: DEAD BUG LOADING S.OJ. Testing & Bum-In_ YAMAICHI IC100 SEC A -A mm [INCH] - Controlling Dimension is mm Body Material; Polyetherimide P.E.I glass filled. Contact Material; Beryllium Copper Contact Plating; Gold over Nickel Insulation Resistance

IC1002

Abstract: IC100 dead bug 300MIL
Contextual Info: IC100 Series Dead Bug Insertion Small Outline J-Lead Package (SOJ) Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Current Rating: Operating Temperature Range: Mating Cycles: 1,000M Ω min. at 500V DC 700V AC for 1 minute

IC100

Abstract: dead bug
Contextual Info: Yamaichi's IC100 Dead Bug Style SOJ Socket for Test & Burn-In Specifications: Insulation Resistance: 1,000M ohms minimum @ 500VDC Withstanding Voltage: 700 VAC for one minute Contact Resistance: 30 ohms max. @ 10mA/20mV Operating Temperature: -55 to +170C

Contextual Info: SOJ Dead Bug IC100 Series CHARACTERISTICS Insulation Resistance Withstanding Voltage Contact Resistance Operating Temperature Mechanical Life ORDERING PROCEDURE IC 00-26 03-* MF-G Contact plating specification Add "MF" if mounting flanges are required Specify the number of contact for

dead bug

Abstract: IC107-26035-20-G AE28 300MIL IC100 IC1004 G005 IC107-3203
Contextual Info: IC100 Series Small Outline J-Lead Package SOJ - Dead Bug Insertion Specifications Part Number (Details) 1,000M W min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 700V AC for 1 minute 30m W max. at 10mA/20mV max. Contact Resistance:

Contextual Info: 1C 255 SERIES soj • • • • Sockets for inserting SOJ packages in dead-bug orientation. Outstanding durability with low insertion-extraction forces. Guides for automated operation. LOC packages are accepted. App.icdtJe D-roctio" of - SPECIFICATIONS PERFORMANCE

Contextual Info: SOJ Dead Bug IC100 Series CHARACTERISTICS Insulation Resistance Withstanding Voltage Contact Resistance Operating Temperature Mechanical Life ORDERING PROCEDURE IC100-26 03-* MF-G Contact plating specification Add "MF" if mounting flanges are required Specify the number of contact for

300MIL

Abstract: IC100 dead bug gic-100
Contextual Info: IC100 Series Small Outline J-Lead Package SOJ - Dead Bug Insertion Specifications Part Number (Details) 1,000M Ω min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 700V AC for 1 minute 30m Ω max. at 10mA/20mV max. Contact Resistance:

Contextual Info: 1C 268 SERIES soj i ^O utline Dimensions FEATURES □u • Sockets for inserting 0.8mm pitch SOJ packages in dead-bug orientation. • Unique contact design ensures outstanding contact reliability. ° d CST* 1 T PERFORMANCE 1.000MQ min. at500VDC Dielectric Withstanding Voltage

Contextual Info: 1C 100 SERIES soj •O u tlin e Dimensions FEATURES • Sockets for inserting SOJ packages in dead-bug orientation. • The larger contact area and two-point contact design ensure high contact reliability. • Outstanding durability with low insertion-extraction forces.

dead bug

Abstract: PA-QFJ196SB-P-Z-02 QFJ196SA QFJ196SB 23X23
Contextual Info: 2.754" 196 pin QFP top carrier/socket QFJ196SA, and QFJ196SB foot prints Top socket compatibility options: -L live bug , -D (dead Bug), -N (non formed) substitute for X. 3.149" 2.754" 1.207" 1.083" 1.009" Base (default): Plugable base Socket 196 pin 23x23 PGA female interface

IC1002

Contextual Info: SOJ Dead Bug IC100 Series Socket Series Insulator: Contact: Plating: Material PEI (Glass Filled) Beryllium Copper Gold over Nickel No. of Leads Row Spacing for Leads (Ò03Ó=300 Mil) Required Number of Leads for Depopulated Version Add MF if Mounting Flanges are Required

IC120-0684-004

Contextual Info: P LCC C Open Top IC120 Series No. of Leads Direction of Contact Terminal Arrangement & IC Orientation (Shown Below) Material PPS/PEI (Glass Filled) Beryllium Copper Gold over Nickel Design No. Dead-bug type (DB) Quad Flat Packages 0.35 x 0.25 No Mark: Without Mounting Flange

dead bug

Abstract: PSOP wells 28F001BX 28F002BC 28F002BX 28F010 28F020 28F200BX
Contextual Info: SOCKETS WELLS ELECTRONICS Burn-In and Test Sockets • ■ ■ ■ ■ ■ ■ ■ ■ ■ TSOP, PSOP & DIP sockets for test and burn-in High force, high reliability contacts Open top, compact design TSOP & PSOP Long life (10,000 cycles minimum) Live and dead bug insertion (TSOP)

IC A 2388

Abstract: 647c dead bug 780 AC phoenix contacts 30 03 34 7 socket 940 4166 ic equivalent
Contextual Info: Burn-In Test Sockets 647 Series A&C Plastic Leaded Chip Carrier Socket • • • • • • Direct entry with Zero Insertion Force Series 647A dead bug device insertion Series 647C live bug device insertion Heat evenly dissipates on all four sides Designed-in contact over-stress protection

Contextual Info: Dead IC100-26 03-* MF-G Socket Series Characteristics No. of Leads Insulation Resistance: Withstanding Voltage: 1,000MC2minimum at 500 VDC 700 VAC for 1 Minute Contact Resistance: Operating Temperature: 30mQ max. at 10mA/20mV (Initial -55'C ~ +170"C H Row Spacing for Leads

Contextual Info: PA20-08-4PD Z 3(6) Data Sheet 20 pin PLCC Auto-eject Dead-Bug socket/8 pin DIP 0.3” (0.6") plug or 20 pin PLCC Lidded ZIF Live-Bug socket/8 pin DIP 0.3" (0.6") plug Supported Device/Footprints Adapter Part Numbers This adapter allows several Altera devices in the PLCC package

Contextual Info: PA20-08-2PD Z 3(6) Data Sheet 20 pin PLCC Auto-eject Dead-Bug socket/8 pin DIP 0.3” (0.6") plug or 20 pin PLCC Lidded ZIF Live-Bug socket/8 pin DIP 0.3" (0.6") plug Supported Device/Footprints Adapter Part Numbers This adapter allows several Xilinx devices in the PLCC package

amd athlon 64 socket 939

Abstract: k A1659A LSI 53C710 1FT1-0002 PA-7200 intel 8042 RTL8150 MPC6041 3050RX PA-8900
Contextual Info: The OpenPA Project First Edition Paul Weissmann Berlin Preface This is the dead-tree, made-for-printing edition of The OpenPA Project openpa.net . The content is based on the online version’s content from mid-June 2006, parts and pieces were removed and modified

D86S

Abstract: 68b1 6.2B2 56B2 5.6B2 D158S 54B2 62b1 D33SH 62B2
Contextual Info: A B C D REVISIONS ENGINEERING NOTES 1. Device is dead bug laid out 2. Pin 1 is pointing south 3. A 0.01uf chip capacitor in parallel 4. Use an odd channel, also reserve an 5. Use an odd and even chan. Tie them 6. DUT Analog star GND pin 51, 54 7. Supertex Inc.

PA20-20-1PD3

Abstract: PA20-20-1PZ3 PA20-20-1PD6 PA20-20-1PZ6 20201PSM 16V8
Contextual Info: PA20-20-1Psw Data Sheet 20 pin PLCC Auto-eject Dead-Bug socket/20 pin DIP 0.3” or 0.6” plug or 20 pin PLCC Lidded ZIF Live-Bug socket/20 pin DIP 0.3” or 0.6” plug Supported Device/Footprints Adapter Construction These adapters allows programming of many PLCC and CLCC

PA20-16-1PD3

Abstract: PA20-16-1PZ3 PA20-16-1PD6 PA20-16-1PZ6 2016-1P 74S288 PROGRAMMING 74s288 74S288 16 pin AM2719
Contextual Info: PA20-16-1PD Z 3(6) Data Sheet 20 pin PLCC Auto-eject Dead-Bug socket/16 pin DIP 0.3” or (0.6") plug or 20 pin PLCC (Lidded ZIF Live-Bug) socket/16 pin DIP 0.3" or (0.6") plug Supported Device/Footprints Adapter Part Numbers These adapters allow programming of many 20 pin PLCC and

dead bug

Abstract: ZIF pga 84 CLAMSHELL
Contextual Info: U M 1 V £ S P L C 2 1 ? p ARIES 130 F re n c h to w n , N J 08825 TEST SOCKET p«îî:”S:S£SEi1 This Universal PLCC ZIF Test Socket will take all seven sizes of PLCC footprints. The PLCC is placed in the top half of the clamshell “ dead bug” pins up fashion.

MO-044AA-AB

Abstract: dead bug
Contextual Info: Series 537 Universal PLCC ZIF Test Socket “Dead Bug” Type FEATURES: • This Universal PLCC ZIF zero insertion force Test Socket will take seven sizes of PLCC footprints. • The PLCC is placed in the top half of the clamshell “dead bug” (pins up) fashion. Even the rectangular 32