DDR3 VDDQ VTT I2C Search Results

Contextual Info: Data Sheet Rev.1.1 17.11.2010 4096MB DDR3 – SDRAM RDIMM 240 Pin registered DIMM Features: • SGP04G72D1BD2MT-CCRT 4096MB PC3-10600 in FBGA Technology RoHS compliant Options: • Data Rate / Latency DDR3 1333 MT/s CL9 DDR3 1066 MT/s CL7 Marking -CC -BB 

Contextual Info: Data Sheet Rev. 1.00 25.07.2012 4096MB DDR3 – SDRAM unbuffered ECC VLP Mini-UDIMM 244 Pin ECC Mini-UDIMM Features: SGL04G72C1BB1SA-xxRT • •     Options:  Data Rate / Latency DDR3 1333 MT/s CL9 DDR3 1600 MT/s CL11 Marking -CC -DC  Module density

Contextual Info: Data Sheet Rev.1.1 17.11.2010 4096MB DDR3 – SDRAM RDIMM 240 Pin registered DIMM Features: • SGP04G72D1BD2MT-CCRT 4096MB PC3-10600 in FBGA Technology RoHS compliant Options: • Data Rate / Latency DDR3 1333 MT/s CL9 DDR3 1066 MT/s CL7 Marking -CC -BB 

Contextual Info: preliminary Data Sheet Rev.0.8 21.06.2012 8GB DDR3 – SDRAM ECC XR-DIMMTM 240 Pin ECC XR-DIMMTM Features: SGV08G72B1BB2SA-xx W RT • 8GByte in FBGA Technology • RoHS compliant Options:  Data Rate / Latency DDR3 1333 MT/s CL9 DDR3 1600 MT/s CL11 

Contextual Info: Data Sheet Rev.1.0 20.06.2011 2048MB DDR3 – SDRAM ECC XR-DIMMTM 240 Pin ECC XR-DIMMTM Features: SGV02G72A1BC1SA-xxRT • 2GB in FBGA Technology • RoHS compliant Options:  Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9  Module density 2048MB with 9 dies and 1 rank

Contextual Info: Data Sheet Rev. 1.00 25.07.2012 4096MB DDR3 – SDRAM unbuffered ECC VLP Mini-UDIMM 244 Pin ECC Mini-UDIMM Features: SGL04G72C1BB1SA-xxRT • •     Options:  Data Rate / Latency DDR3 1333 MT/s CL9 DDR3 1600 MT/s CL11 Marking -CC -DC  Module density

M378B5273BH1-CF8

Abstract: DDR3 DIMM SPD JEDEC M378B5273 DDR3 DIMM SPD M378B5273BH DDR3 udimm jedec M391B5273BH1-CF8 DDR3 DIMM DDR3 DIMM spec samsung K4B2G0846B
Contextual Info: Unbuffered DIMM DDR3 SDRAM DDR3 SDRAM Specification 240pin Unbuffered DIMM based on 2Gb B-die 64/72-bit Non-ECC/ECC 78FBGA with Lead-Free & Halogen-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE

Contextual Info: Unbuffered DIMM DDR3 SDRAM DDR3 SDRAM Specification 240pin Unbuffered DIMM based on 1Gb D-die 64/72-bit Non-ECC/ECC 82FBGA with Lead-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.

Contextual Info: Unbuffered DIMM DDR3 SDRAM DDR3 SDRAM Specification 240pin Unbuffered DIMM based on 1Gb D-die 64/72-bit Non-ECC/ECC 82/100FBGA with Lead-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE

Contextual Info: Data Sheet Rev.1.0 25.07.2012 8GB DDR3 – SDRAM unbuffered ECC Mini-UDIMM 244 Pin ECC Mini-UDIMM Features: SGL08G72B1BE2MT-CCRT • •     8GB in FBGA Technology RoHS compliant Options:  Data Rate / Latency DDR3 1333 MT/s CL9 DDR3 1066 MT/s CL7

M391B5673EH1-CF8

Abstract: k4b1g1646 M378B2873EH1-CF8 K4B1G0846E m391b M391B2873EH1 m391b5673 M378B5673EH1-CF8 M378B2873EH1-C m391b2873eh1-cf8
Contextual Info: DDR3 SDRAM Unbuffered DIMM DDR3 SDRAM Specification 240pin Unbuffered DIMM based on 1Gb E-die 64/72-bit Non-ECC/ECC 78FBGA with Lead-Free & Halogen-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE

Contextual Info: Data Sheet Rev.1.0 25.07.2012 8GB DDR3 – SDRAM unbuffered ECC Mini-UDIMM 244 Pin ECC Mini-UDIMM Features: SGL08G72B1BE2MT-CCRT • •     8GB in FBGA Technology RoHS compliant Options:  Data Rate / Latency DDR3 1333 MT/s CL9 DDR3 1066 MT/s CL7

MT8KTF25664

Abstract: MT8KTF25664AZ-1G4
Contextual Info: 1GB, 2GB x64, SR 240-Pin 1.35V DDR3L UDIMM Features 1.35V DDR3L SDRAM UDIMM MT8KTF12864AZ – 1GB MT8KTF25664AZ – 2GB Features Figure 1: 240-Pin UDIMM (MO-269 R/C A) • DDR3L functionality and operations supported as defined in the component data sheet

Contextual Info: Data Sheet Rev.1.0 14.01.2011 1024MB DDR3 – SDRAM UDIMM 240 Pin UDIMM Features: SGU01G64A1BG1MT-xxR • 1GByte in FBGA Technology •     RoHS compliant Options:  Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9  Module Density

MT4JSF6464HY-1G1B1

Abstract: MT41J64M16 MT4JSF6464HY-1G1 DDR3 ECC SODIMM Fly-By Topology mt4jsf6464 micron DDR3 SODIMM address mapping edge connector
Contextual Info: 512MB x64, SR 204-Pin DDR3 SDRAM SODIMM Features DDR3 SDRAM SODIMM MT4JTF6464HY – 512MB For component data sheets, refer to Micron’s Web site: www.micron.com Features Figure 1: • DDR3 functionality and operations supported as per component data sheet

Contextual Info: Data Sheet Rev.1.1 27.05.2011 2048MB DDR3 – SDRAM ECC SO-UDIMM Features: 204 Pin ECC SO-DIMM SGN02G72F1BD1SA-xxRT • 2GByte in FBGA Technology •     RoHS compliant Options:  Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9 

Contextual Info: Data Sheet Rev.1.0 01.02.2011 1024MB DDR3 – SDRAM ECC SO-DIMM Features: 204 Pin ECC SO-DIMM SGN01G72F1BG1SA-xxRT • 1GByte in FBGA Technology •     RoHS compliant Options:  Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9  Module Density

Contextual Info: Data Sheet Rev.1.1 29.03.2010 4096MB DDR3 – SDRAM ECC SO-DIMM 204 Pin ECC SO-DIMM Features: SGN04G72G1BD2MT-CCRT • 4096MB PC3-10600 in FBGA Technique • RoHS compliant   Options:  Frequency / Latency DDR3 1333 MHz CL9 DDR3 1066 MHz CL7  Module densities

Contextual Info: Data Sheet Rev.1.0 04.05.2011 1024MB DDR3 – SDRAM SO-DIMM 204 Pin SO-DIMM Features: SGN01G64D2BG1MT-xxRT • 1GByte in FBGA Technology •  RoHS compliant   Options:   Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9 Marking -BB -CC

Contextual Info: Data Sheet Rev.1.2 01.04.2011 2048MB DDR3 – SDRAM SO-DIMM 204 Pin SO-DIMM Features: SGN02G64D2BD1MT-xxRT • 2GByte in FBGA Technology •     RoHS compliant Options:  Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9  Module Density

Contextual Info: Data Sheet Rev.1.1 29.03.2010 4096MB DDR3 – SDRAM ECC SO-DIMM 204 Pin ECC SO-DIMM Features: SGN04G72G1BD2MT-CCRT • 4096MB PC3-10600 in FBGA Technique • RoHS compliant   Options:  Frequency / Latency DDR3 1333 MHz CL9 DDR3 1066 MHz CL7  Module densities

Contextual Info: 2GB, 4GB x64, DR 240-Pin 1.35V DDR3L UDIMM Features 1.35V DDR3L SDRAM UDIMM MT16KTF25664AZ – 2GB MT16KTF51264AZ – 4GB Features Figure 1: 240-Pin UDIMM (MO-269 R/C B) • DDR3L functionality and operations supported as defined in the component data sheet

DDR3 pcb layout guide

Abstract: MLPQ-20 MLPQ-40 MLPQ20 X-PHASE
Contextual Info: Product Line Overview Applications Key Products Energy Saving Products • Appliances • Digital Control ICs Integrated design platforms that enable customers to add energyconserving features that achieve lower operating energy costs and manufacturing Bill of Material

M378B5273BH1-CF8

Abstract: samsung dimm DDR3 SPD M391B5273BH1-CF8 M378B5273BH
Contextual Info: DDR3 SDRAM Unbuffered DIMM DDR3 SDRAM Specification 240pin Unbuffered DIMM based on 2Gb B-die 64/72-bit Non-ECC/ECC 78FBGA with Lead-Free & Halogen-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE