DDD13T Search Results

Contextual Info: DENSE-PAC 1 Megabit UVEPROM M ICROSYSTEM S DPV3232VA DESCRIPTION; The DPV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

VTL3B49

Abstract: 3b49 MQ-5 VTL3B39 VTL3B19 vactrol VTL3B49/Vactec
Contextual Info: VTL3B39, 3B49 Low Cost Neon Axial Vactrols PACKAGE DIMENSIONS inch mm UL Listed File #E73B87 Dual ’center tap' element version is available tor VTL3B39 and VTL3B49. DESCRIPTION V T L 3 B 4 9 features a very low "on" resistance with a smaller temperature coefficient of resis­

Contextual Info: W83877F IVinbond Electronics Corp. WINBOND I/O GENERAL DESCRIPTION One of Winbond's popular series of I/O chips, the W83877F integrates a disk drive adapter, serial port UART , parallel port, IDE bus interface, and game port decoder onto a single chip. The

Contextual Info: EXAM PLE & ORDERING CODE R PD I - 15 H S-C D-SIIB CONNECTORS CRIMP SHELLS H NUMBER OF PINS: STANDARD = = = = HIGH DENSITY = = = = 9 15 25 37 15 26 44 62 GENDER: MALE = FEMALE = S R SPACING: STANDARD = HIGH DENSITY =H BLANK MATING FACE: 2.5mm HEX RIVET HOLE

JIS G3141

Abstract: ANS11008 G3141 JISG3141
Contextual Info: E X A M P L E & O R D E R IN G C O D E R PD I - 15 H S-C D-SIIB CONNECTORS CRIMP SHELLS H NUMBER OF PINS: STANDARD = 9 = 15 = 25 = 37 HIGH DENSITY = 15 = 26 = 44 = 62 GENDER: MALE = FEMALE = S R SPACING: STANDARD = HIGH DENSITY =H BLANK MATING FACE: 2.5mm HEX RIVET

VTL3B19

Abstract: VTL3B39 VTL3B49 K2130
Contextual Info: VTL3B39, 3B49 Low Cost Neon Axial Vactrols PACKAGE DIMENSIONS inch mm UL Listed File #E73B87 Dual ’center tap' element version is available tor VTL3B39 and VTL3B49. DESCRIPTION V T L 3 B 4 9 features a very low "on" resistance with a smaller temperature coefficient of resis­