DD642765ABA1 Search Results

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1669 May-97 9706 B3 OMEDATA DD642765ABA1 1.2µ OX/NI EEPROM 08 SOIC 208 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C):

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1669 May-97 9706 B3 OMEDATA DD642765ABA1 1.2µ OX/NI EEPROM 08 SOIC 208 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C):

P-20606

Abstract: c19643 DS1868 p19500 p1908 DD642 P19-50 B59728 P2050
Contextual Info: RELIABILITY MONITOR STRESS: Infant / High Voltage Life 125°C, 7.0 V. 6.0 V. DS1302 PRODUCT DS1302 DS1302 DS1302 DS1868 DS21S07A DS21S07A DS21S07A DS2401 DS2401 DS2401 DS80C320 DS80C320 DS80C320 DS80C320 MONITOR DATE JOB NO. Mar-97 Jun-97 Sep-97 Feb-97 Feb-97