DATA SHEET UM 66 IN Search Results

Contextual Info: SECTION 2 SPECIFICATIONS GENERAL CHARACTERISTICS The DSP56002 is fabricated in high-density HCMOS w ith TTL com patible inputs and outputs. MAXIMUM RATINGS CAUTION This device contains circuitry protecting against damage due to high static voltage or electrical fields; however, normal precautions

that hr 7245

Abstract: AA0362 AA0361 AA051 2TC2-1 th46
Contextual Info: SECTION 2 SPECIFICATIONS GENERAL CHARACTERISTICS The DSP56002 is fabricated in high-density HCMOS w ith TTL compatible inputs and outputs. MAXIMUM RATINGS CAUTION This device contains circuitry protecting against damage due to high static voltage or electrical fields; however, normal precautions

931c66

Abstract: ic 8pin C66
Contextual Info: 93LC46/56/66 M ic ro c h ip 1K/2K/4K 2.0V CMOS Serial EEPROM FEATURES DESCRIPTION • Single supply with program m ing operation dow n to 2.0V Com m ercial only • Low pow er C M OS technology - 1 m A active current typical - 5 nA standby current (typical) at 3.0V

Contextual Info: MAX 7000 Includes MAX 7000E & MAX 7000S Programmable Logic Device Family April 1998. ver. 5.02 Data Sheet Features. . P ^ ^ * ^ P ^ High-performance, EEPROM-based programmable logic devices PLDs based on second-generation Multiple Array M atrix (MAX) architecture

Contextual Info: Includes MAX 70 0 0 E & MAX 7000S M A X 7000 Programmable Logic Device Family February 1998. ver. 5.01 Features Data Sheet • ■ ■ ■ ■ ■ ■ High-performance, EEPROM-basedprogrammable logic devices PLDs based on second-generation Multiple Array Matrix (MAX)

TRIPLEXER

Abstract: passive filter 1550nm BH12928 GPON ONU
Contextual Info: Data Sheet PON Filter for FTTx 1310/1490/1550nm Bookham filters leverage the proprietary Advanced Energetic Deposition AED process to produce the industry’s best PON filter solutions. The AED process features state-of-the-art layer thickness control to produce thin-film interference filters that

Contextual Info: 93AA46/56/66 1K/2K/4K 1.8V CMOS Serial EEPROM FEATURES • Single supply with program m ing operation down to 1,8V PACKAGETYPE DIP • Low power CMOS technology - 70 nA typical active READ current at 1,8V cs E CLK c 1 ? - 2 nA typical standby current at 1,8V

1307C

Contextual Info: Dialight 550>xx07 Sloped Back Housing with Standoffs LED PA R T NO. CO LO R DATA S H E E T S T A N D A R D EFFICIEN CY 550-0207 Green 550-0307 550-0407 Yellow Red 5ND-XXXX IN TEG R A L R ESISTO R 550-0507 550-0607 550-0707 550-0807 Red, 5V Red, 12V Green, 5V

Contextual Info: 5mm L E D CBI Circuit Board Indicator Top View, Quad Block D ia lig h t] 5 5 0 -x x 0 4 -0 0 4 PART NO. STANDARD EFFICIENCY 550-0204-004 550-0304-004 550-0404-004 Benefits • A v a ila b le w ith a v a rie ty of L E D s • H o u s in g m a te ria l m e e ts U L 9 4 V-0

73d12

Abstract: epm7032 algorithm
Contextual Info: Includes MAX 7000E & MAX 7000S M A X 7000 Programmable Logic Device Family May 1999. ver. 6 Data Sheet Featll res • ■ ■ ■ ■ ■ H igh-perform ance, EEPROM -based p rogram m able logic devices PLDs based on second-generation M ultiple A rray M a trix (MAX®)

Contextual Info: 93LC46/56/66 M ic ro c h ip 1K/2K/4K 2.0V CMOS Serial EEPROM FEATURES DESCRIPTION Single supply with program m ing operation down to 2.0V Com m ercial only Low pow er CMOS technology - 1 m A active current typical - 5 |iA standby current (typical) at 3.0V

Contextual Info: M AX 3000A M Ï Ï I 3 Â Programmable Logic Device Family . July 1999. ver. 1. Features. P re lim in a r y In fo rm a tio n Data Sheet High-performance, low-cost CMOS EEPROM-based program m able logic devices PLDs built on a M ultiple A rray M atrix (MAX )

5569C

Contextual Info: IB IL 24 PWR IN/F-D IB IL 24 PWR IN/F-D-PAC Inline Power Terminal With Fuse and Diagnostics Data Sheet 5569C 5 5 6 9 A 0 0 1 02/2003 The IB IL 24 PWR IN/F-D and IB IL 24 PWR IN/F-D-PAC only differ in the scope of supply see "Ordering Data" on page 11 . Their function and

Contextual Info: $ M ic r o c h ip 93LCS56/66 2K/4K 2.5V CMOS Serial EEPROM with Software Write Protect FEATURES DESCRIPTION • Single supply w ith program m ing operation down to 2.5V The Microchip Technology Inc. 93LCS56/66 are low volt­ age Serial Electrically Erasable PROMs with memory

B200

Contextual Info: D Band Filters for 200GHz Add/Drop Multiplexing Bookham band skip filters leverage the proprietary Advanced Energetic Deposition AED process to produce the industry’s best banded filter solution. The AED process features state-of-the-art layer thickness control to produce thin-film interference

9093 dtl

Abstract: fairchild 9946 dtl 9936 Fairchild 9945 DTL 9930 k2373 CCSL ScansUX979 Fairchild Semiconductor dtul
Contextual Info: M ARC H 1967 • CCSL COMPOSITE CCSL COMPOSITE DATA SHEET C O M P A T I B L E C U R R E N T S IN K IN G LOGIC DATA -55°C TO + 1 2 5 ° C T E M P E R A T U R E R A N G E SH EET CCSL LOADING RU LES The fir s t step tow ards rea liz atio n of a com patable logic fa m ily is to establish optim ized input-output logic le v e ls .

C93LC46

Abstract: 93LC46 93LC56 93LC66
Contextual Info: M 93LC46/56/66 ic r o c h ip 1K/2K/4K 2.0V Microwire Serial EEPROM BLOCK DIAGRAM FEATURES • Single supply w ith program m ing operation down to 2.0 V C om m ercial only • Low pow er C M O S tech nolog y - 1 mA active cu rre n t typical - 5 nA stan dby curre nt (typical) at 3.0V

transistor d 1556

Contextual Info: D 100GHz WDM Filter Components for OADM Features • 27.5GHz and 50GHz clear channel passbands • ITU and custom wavelengths Bookham narrowband filters leverage the proprietary Advanced Energetic Deposition AED process to produce the industry’s best banded filter

74x74

Abstract: Mifare* coil MIFARE Card Coil Design Guide
Contextual Info: MF0 IC U10 01 Bumped unsawn wafer on UV-tape Rev. 3.1 — 20 February 2007 Product data sheet 133131 PUBLIC 1. General description 1.1 Scope The MF0 IC U10 01 is contactless Smart Card IC designed for card IC coils following the mifare Card IC Coil Design Guide and is qualified to work properly in NXP´ reader

EPM 5192

Abstract: EPM5192
Contextual Info: EPM5192 EPLD Features H igh-density, 192 macrocell, general-purpose MAX 5000 EPLD, easily integrating com plete logic boards into a single package High-speed multi-LAB architecture t PD as fast as 25 ns Counter frequencies up to 50 MHz Pipelined data rates up to 62.5 MHz

EPM5130

Abstract: 100-Pin Package Pin-Out Diagram D2-3401 EPM 5130
Contextual Info: EPM5130 EPLD □ □ Features □ □ □ □ □ □ □ High-density, 128-macrocell, general-purpose MAX 5000 EPLD 128 m acrocells optim ized for pin-intensive applications, easily integrating over 60 TTL MSI and SSI components High-speed multi-LAB architecture

805-0086-02

Abstract: J0801 UltraSPARC ii Sun UltraSparc II
Contextual Info: SME5421MCZ-300 microsystems Ju ly 1998 UltraSPARC -ll/CPU Module DATA SHEET 300 M Hz CPU, 0.5 MB E-cache, UPA, 66 M Hz PCI D e s c r ip tio n '11 The UltraSPARC™-Hi CPU m odule is a h igh perform ance, SPARC V9-com pliant, sm all form -factor CPU m odule. It interfaces to the UltraSPARC P ort A rchitecture 64S UPA64S interconnect bus, m ain m em ory, and

Contextual Info: EPM 7128 E P LD □ □ □ Information □ □ Figure 21. EPM7128 Package Pin-Out Diagrams Package outlines not drawn to scale. See Tables 7 and 8 in this data sheet for pin-out information. o q o q z q q q nnnnnnn nn nn nn nn nn nn nn Pin 1 I/O c I □ I/O

M2E 052-CA

Abstract: M2E 068-DF E355E R2E 180-CB 225-AX 96359 AU64 068-BF R2E250 225-AU
Contextual Info: Radialventilatoren rückwärts gekrümmt, einseitig saugend Centrifugal Fans backward curved, single inlet Technischer Hinweis Technical features Rückwärts gekrümmte Radialventilatoren haben besonders lange Schaufeln, die rückwärts gekrümmt zur Drehrichtung stehen.