DAP 6 Search Results

Contextual Info: RGP PW PWP TPS2231 TPS2236 DAP www.ti.com. SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009 ExpressCard POWER INTERFACE SWITCH

TPS2231

Abstract: TPS2231PW TPS2231PWP TPS2231RGP TPS2236
Contextual Info: RGP PW PWP TPS2231 TPS2236 DAP www.ti.com. SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009 ExpressCard POWER INTERFACE SWITCH

Contextual Info: RGP PW PWP TPS2231 TPS2236 DAP www.ti.com. SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009 ExpressCard POWER INTERFACE SWITCH

Contextual Info: RGP PW PWP TPS2231 TPS2236 DAP www.ti.com. SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009 ExpressCard POWER INTERFACE SWITCH

9934

Contextual Info: RGP PW PWP TPS2231 TPS2236 DAP www.ti.com. SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009 ExpressCard POWER INTERFACE SWITCH

Contextual Info: RGP PW PWP TPS2231 TPS2236 DAP www.ti.com. SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009 ExpressCard POWER INTERFACE SWITCH

Contextual Info: RGP PW PWP TPS2231 TPS2236 DAP www.ti.com. SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009 ExpressCard POWER INTERFACE SWITCH

Contextual Info: RGP PW PWP TPS2231 TPS2236 DAP www.ti.com. SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009 ExpressCard POWER INTERFACE SWITCH

Contextual Info: RGP PW PWP TPS2231 TPS2236 DAP www.ti.com. SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009 ExpressCard POWER INTERFACE SWITCH

Contextual Info: RGP PW PWP TPS2231 TPS2236 DAP www.ti.com. SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009 ExpressCard POWER INTERFACE SWITCH

Contextual Info: HERMETIC CIRCULAR CONNECTOR FOR INDUSTRIAL VACUUM APPLICATIONS Positronic Industries www.connectpositronic.com CIVAC Without flange With flange TECHNICAL CHARACTERISTICS MECHANICAL CHARACTERISTICS MATERIAL AND FINISHES Insulator: Glass-filled DAP, type SDG-F, black color,

3187

Contextual Info: MATERIAL DECLARATION SHEET Material Number 6639S Product Line Precision Potentiometer Compliance Date 1991 RoHS Compliant Yes No. 1 Construction Element subpart Cover MSL Homogeneous Material DAP Compound Brass 2 3 4 N/A Material weight [g] 1.8 0.125 Terminal

dap 010

Abstract: DAN801
Contextual Info: DAN 801 / DAP 801 200 mW Small Signal Diode Arrays Dioden Sätze mit Allzweckdioden Nominal power dissipation Nenn-Verlustleistung 200 mW Repetitive peak reverse voltage Periodische Spitzensperrspannung 9 Pin-Plastic case 9 Pin-Kunststoffgehäuse 80 V 24 x 3.5 x 6.6 [mm]

SWT-1MS4T2B1M53QES-5

Contextual Info: 1 2 3 4 5 6 7 8 9 A A B B C C SPECIFICATIONS Case Material: Actuator: Bushing: Housing: Terminal: Mechanical Life: Contact Resistance: Diallyl Phthalate DAP UL94V-0 Brass, Chrome Plated Brass, Nickel Plating Stainless Steel Brass 40,000 make and break cycles

FI6 diode

Abstract: DAP803 DIODE e5
Contextual Info: DAN 803, DAP 803 200mW . power semiconductor power electronics igbt bridge rectifier diode thyristor cib rectifier ipm driver inverter converter "  Diode arrays Silicon rectifiers arrays Forward Current: 0,1 A Reverse Voltage: 80 to / V Publish Data

RL20

Contextual Info: Temperature Compensating Ceramic Capacitors Negative Temperature Coefficient NTC Radial Leaded Specifications Mechanical: Case DAP or molded high temperature Vectra Leads Solder coated copper clad steel is standard; other types available Electrical: Capacitance 1 MHz @ 25°C

Contextual Info: SOLDER TERMINALS - MOULDED DAP, TWIN TURRET Dimensions in inches mm See page 94 for recommended Anvil and Punch How to order code 572 - 4XXX - XX - XX - 16 Insulator Colour Basic Part No. Material Code Table Component Material RoHS Insulator Diallyl ✓

dap 401

Abstract: DAN401 dap401
Contextual Info: Diotec DAN 401 / DAP 401 200 mW Small Signal Diode Arrays Dioden Sätze mit Allzweckdioden Nominal power dissipation Nenn-Verlustleistung 200 mW Repetitive peak reverse voltage Periodische Spitzensperrspannung 80 V 5 Pin-Plastic case 5 Pin-Kunststoffgehäuse

Contextual Info: HIGH TEMPERATURE HIGH VOLTAGE RADIAL LEADED CAPACITORS RT XHT and NPO DIELECTRIC Consult factory for requirements above 250°C SPECIFICATIONS MECHANICAL: ALSO AVAILABLE High Temperature High Voltage Disc Capacitors Call Factory for More Information DAP up to 220°C

Contextual Info: O ctober 1990 PRELIMINARY ML2200 ML22Q8 *e,M icro Linear 12-Bit Plus Sign Data Acquisition Peripheral GENERAL DESCRIPTION FEATURES The ML2200 and ML2208 Data Acquisition Peripherals DAP are monolithic CMOS data acquisition subsystems. These data acquisition peripherals feature an input multiplexer, a

Contextual Info: SOLDER TERMINALS - MOULDED DAP, SINGLE TURRET Dimensions in inches mm See page 94 for recommended Anvil and Punch How to order code 572 - 4XXX - XX - XX - 16 Insulator Colour Basic Part No. Material Code Table Component Material RoHS Insulator Diallyl ✓

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L7.2.0x3.4 7 LEAD OPTICAL CO-PACKAGE Rev 0, 5/14 2.0 ±0.050 0.25 INCLUDED L/F THICKNESS 0.2mm 1 ±0.100 0.373 R 0.25 0.45 0.75 0.45 7 1.2 3.4 ±0.050 1.365 83° DAP 0.808 6 0.3 1 2 5 1.55 7x 0.2

RT5854

Contextual Info: HIGH TEMPERATURE HIGH VOLTAGE RADIAL LEADED CAPACITORS RT XHT and NPO DIELECTRIC Consult factory for requirements above 250°C SPECIFICATIONS MECHANICAL: Case DAP or molded high temperature Vectra Consult factory for packaging above 200°C Leads Solder coated copper clad steel is standard;

Contextual Info: HIGH TEMPERATURE HIGH VOLTAGE RADIAL LEADED CAPACITORS RT XHT and NPO DIELECTRIC Consult factory for requirements above 250°C SPECIFICATIONS MECHANICAL: Case DAP or molded high temperature Vectra Consult factory for packaging above 200°C Leads Solder coated copper clad steel is standard;