D2 PACKAGE DIAGRAM Search Results

Contextual Info: Formosa MS SGFM101C-D2 THRU SGFM108C-D2 Chip Silicon Rectifier List List. 1 Package outline. 2

Contextual Info: SMD Super Fast Rectifiers Formosa MS SGFM161C-D2 THRU SGFM168C-D2 List List. 1 Package outline. 2

T74LS40B1

Abstract: T54LS40D2 T74LS40
Contextual Info: DUAL 4-INPUT NAND BUFFER DESCRIPTION The T54LS40/T74LS40 is a high speed DUAL 4-INPUT NAND BUFFER fabricated in LOW PO­ WER SCHOTTKY technology. B1 Plastic Package i D1/D2 Ceramic Package M1 Micro Package Cl Plastic Chip Carrier ORDERING NUMBERS: T54LS40 D2

Fairchild 9614

Abstract: Fairchild 9615 JM38510 Fairchild 9582 Fairchild 9614 line driver 9614
Contextual Info: FAIRCHILD INTERFACE LINE DRIVERS/RECEIVERS/TRANSCEIVERS Drivers per Package Logic/Connection Diagram s Package(s) 4 I49 6A.9A 10 +5 0 108 4 D2 3I, 6A,9A 48 13 +5 0 98 4 D2 3I, 6A,9A Single Ended 48 11 +5 0 52 2 D5 3I, 6A.9A Volt Single Ended 48 70 +5 0 88

C67076-A2506-A17

Contextual Info: BSM 35 GD 120 D2 IGBT Power Module Preliminary data • Power module • 3-phase full-bridge • Including fast free-wheel diodes • Package with insulated metal base plate Type VCE IC BSM 35 GD 120 D2 1200V 50A Package Ordering Code SIXPACK 1 C67076-A2506-A17

C67076-A2505-A17

Contextual Info: BSM 25 GD 120 D2 IGBT Power Module • Power module • 3-phase full-bridge • Including fast free-wheel diodes • Package with insulated metal base plate Type VCE IC BSM 25 GD 120 D2 1200V 35A Package Ordering Code SIXPACK 1 C67076-A2505-A17 Maximum Ratings

PC017

Abstract: T74LS01B1 T54LS01D2 T74LS01 A23Y
Contextual Info: as QUAD 2-INPUT NAND GATE DESCRIPTION The T54LS01 /T74LS01 is a high speed QUAD 2-INPUT NAND GATE with open collector output fabricated in LOW POWER SCHOTTKY tech­ nology. B1 Plastic Package D1/D2 Ceramic Package M1 C1 Micro Package Plastic Chip Carrier

Contextual Info: CY54FCT574T, CY74FCT574T 8-BIT REGISTERS WITH 3-STATE OUTPUTS SCCS073 – OCTOBER 2001 D D D D D D D D 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC O0 O1 O2 O3 O4 O5 O6 O7 CP CY54FCT574T . . . L PACKAGE TOP VIEW D2 D3 D4 D5 D6 O0 D OE D0 D1 D2

Contextual Info: CY54FCT574T, CY74FCT574T 8-BIT REGISTERS WITH 3-STATE OUTPUTS SCCS073 – OCTOBER 2001 D D D D D D D D 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC O0 O1 O2 O3 O4 O5 O6 O7 CP CY54FCT574T . . . L PACKAGE TOP VIEW D2 D3 D4 D5 D6 O0 D OE D0 D1 D2

fct574c

Abstract: FCT574A A115-A CY54FCT574T CY74FCT574T
Contextual Info: CY54FCT574T, CY74FCT574T 8-BIT REGISTERS WITH 3-STATE OUTPUTS SCCS073 – OCTOBER 2001 D D D D D D D D 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC O0 O1 O2 O3 O4 O5 O6 O7 CP CY54FCT574T . . . L PACKAGE TOP VIEW D2 D3 D4 D5 D6 O0 D OE D0 D1 D2

WED3DG6433V-D2

Contextual Info: WED3DG6433V-D2 256MB- 32Mx64 SDRAM UNBUFFERED FEATURES DESCRIPTION n PC100 and PC133 compatible The WED3DG6433V is a 32Mx64 synchronous DRAM module which consists of four 32Mx16 SDRAM components in TSOP- 11 package and one 2K EEPROM in an 8- pin TSSOP package for

T74LS21

Contextual Info: ss T54LS21 ra ü & i DUAL 4-INPUT AND GATE DESCRIPTION The T54LS21 /T74LS21 is a high speed DUAL 4-INPUT AND GATE fabricated in LOW POWER SCH OTTKY technology. 1 1 B1 Plastic Package D1/D2 Ceramic Package o y * * “ M1 Micro Package C1 Plastic Chip Carrier

Contextual Info: SN74ALS166 PARALLEL-LOAD 8-BIT SHIFT REGISTERS D2«»1, APRIL 1982 - REVISED OCTOBER 1988 Synchronous Load Direct Overriding Clear Parallel to Serial Conversion SN74ALS106 D O R N PACKAGE TOP VIEW U i 6 ] v Cc SE F » C Package Options Include Plastic 'Small

T74LS266B1

Abstract: n70v T54LS266D2 T74LS266
Contextual Info: ses T§|LjS206 TMS286 QUAD 2-INPUT EXCLUSIVE NOR GATE DESCRIPTION The T54LS266/T74LS266 is a high speed QUAD 2-INPUT EXCLUSIVE NOR GATE with open col­ lector output fabricated in LOW POWER SCHOTTKY technology. 1 1 B1 Plastic Package D1/D2 Ceramic Package

T74LS51B1

Abstract: T54LS51D2 T74LS51 pc-s004
Contextual Info: Mi 1 I DUAL 2-WIDE 2-INPUT / 3-INPUT AND-OR- INVERT GATE DESCRIPTION The T54LS51/T74LS51 is a high speed DUAL 2-WIDE 2-INPUT / 3-INPUT AND-OR INVERT GA­ TE fabricated in LOW POWER SCHOTTKY tech­ nology. 1 B1 Plastic Package 1 D1/D2 Ceramic Package s M1 Micro Package

HDMP-1636

Abstract: HFBR-0535 E121562 HFBR-5303 HFBR-5305 HFBR-5315 HFCT-5305 R3829
Contextual Info: Gb/s Gigabit Ethernet: 1.25 GBd 850 nm VCSEL Transceiver in Low Cost 1x9 Package Style Preliminary Technical Data Features Applications • Compliant with Proposed Specifications for IEEE802.3z/D2 Gigabit Ethernet (1000Base-SX) • 850 nm Vertical Cavity

W3DG6463V-D2

Contextual Info: White Electronic Designs W3DG6463V-D2 PRELIMINARY* 512MB – 2x32Mx64 SDRAM UNBUFFERED FEATURES DESCRIPTION Burst Mode Operation The W3DG6463V is a 2x32Mx64 synchronous DRAM module which consists of sixteen 32Mx8 SDRAM components in TSOP II package and one 2K EEPROM

W3DG7267V-D2

Contextual Info: White Electronic Designs W3DG7267V-D2 PRELIMINARY* 512MB – 2x32Mx72, SDRAM UNBUFFERED FEATURES DESCRIPTION Burst Mode Operation The W3DG7267V is organized as a 2x32Mx72 synchronous DRAM module which consists of eighteen 32Mx8 SDRAM components in TSOP II package, and one 2K EEPROM

WED3DG727V-D2

Contextual Info: WED3DG727V-D2 64MB- 8Mx72 SDRAM UNBUFFERED FEATURES DESCRIPTION n Burst Mode Operation The WED3DG727V is a 8Mx72 synchronous DRAM module which consists of nine 8Mx8 SDRAM components in TSOP- 11 package, and one 2K EEPROM in an 8- pin TSSOP package for Serial Presence Detect which are mounted on a 168 Pin DIMM

Contextual Info: ses DUAL 4-INPUT NAND BUFFER DESCRIPTION The T54LS40/T74LS40 is a high speed DUAL 4-IN PUT NAND BUFFER fabricated in LOW PO­ WER SCH OTTKY technology. 1 i D1/D2 B1 P lastic Package C eram ic Package S S M1 C1 P lastic C hip C arrier M icro Package O R D ER IN G N UM B E R S :

Contextual Info: CY74FCT2541T 8ĆBIT BUFFER/LINE DRIVER WITH 3ĆSTATE OUTPUTS SCCS041B – SEPTEMBER 1994 – REVISED SEPTEMBER 2001 D Function and Pinout Compatible With FCT Q OR SO PACKAGE TOP VIEW and F Logic D 25-Ω Output Series Resistors to Reduce OEA D0 D1 D2 D3

WED3DG7232V-D2

Contextual Info: WED3DG7232V-D2 256MB- 32Mx72 SDRAM W/ PLL, REGISTER AND SPD FEATURES DESCRIPTION n Burst Mode Operation The WED3DG7232V is a 32Mx72 synchronous DRAM module which consists of nine 32Meg x 8 SDRAM components in TSOP11 package, two 18- bit Drive ICs for input control signal and one

D2300-TYPE

Abstract: Lucent D2304G transistor d2300 D2304G TR-NWT-000468 Lucent 1310 Research Center Module D2304 lucent DFB laser application
Contextual Info: Data Sheet February 2000 1.3 µm D2300-Type Laser Isolated DFB Laser Module Features D2 30 The 1.3 µm D2300-Type Laser Module is offered in a 14-pin, hermetic, butterfly package. • Integrated optical isolator ■ SONET/SDH compatible up to OC-48/STM-16

MX23L3222

Abstract: MX23L3222MC-10 MX23L3222MC-12
Contextual Info: MX23L3222 32M-BIT MASK ROM 16/32 BIT OUTPUT FEATURES • Current - Operating:60mA - Standby:50uA • Supply voltage - 3.3V±10% • Package - 70 pin SSOP (500mil) PIN CONFIGURATION PIN DESCRIPTION A0 A1 A2 A3 A4 A5 VCC D0 D16 D1 D17 VSS VCC D2 D18 D3 D19