D1B050000 Search Results

Contextual Info: PRODUCT SPECIFICATION DATE : REED RELAY: co sm o NO. 50R01007 SHEET 1 OF 2 D1B050000 [e l e c t r o n i c s CORPORATION 1. OUTSIDE DIMENSION : UNIT mm O CL KUAN HSI D1B050000 •o— O ' T =l— CUT 19.5 7.0 r 0.4 5.5 T 0.5 0.25 3.0 — _L 7.62 10.15 8.9max.

D1B050000

Abstract: DIB050000 Reed relay
Contextual Info: PRODUCT SPECIFICATION DATE : REED RELAY: cosmo [e l e c t r o n i c s NO. 50R01007 SHEET 1 OF 2 D1B050000 corporation 03/26/00’ REV. 1. OUTSIDE DIMENSION : UNIT mm S3 CL KUAN HSI D1B050000 •o— d TZ1— LT 19.5 0.4 5.5 T 3.0 _L 0.57.62 10.15 8.9max.

D1B050000

Abstract: KUAN HSI D1b050000 relay reed kuan DIB050000 D1B05 KUAN KUAn HSI
Contextual Info: PRODUCT SPECIFICATION cosmo REED RELAY: SHEET 1 OF 2 D1B050000 ELECTRONICS CORPORATION 1. OUTSIDE DIMENSION : UNIT nun n n n n Date Code ^ KUAN HSI » J D1B050000 ^\~ U — U U U 19 .5 7 .0 — 1 0.25 —U |I— 5 — V T. ¿0 — * 7 .6 2 — I •-

D1A050M00

Abstract: D1A050000 REED RELAY D1A050000 d1a050x00 D1A05000 D1A050D00 D1A051000 D2A120000 D2A12000 D1A051
Contextual Info: D SERIES Dual Inline Pack Reed Relay FEATURES Solid Epoxy Body Industry standard DIP spacing Automatic insertion compatible Completely sealed, Immersion cleanable Magnetic shield available Diode accross the coil available UL recognized and certified for Canada

Diode c013

Abstract: KUAN HSI D1B050000
Contextual Info: cosmo Features 1. Molded epoxy body. 2. Dip type construction with the same terminal pitch as ICs or TTLs simplifies PC board designing.In addition, the high sensitivity allows direct driving by TTL, etc. 3. Automatic insertion compatible. 4. Sealed construction permits automatic flow soldering