CU 53 Search Results

17 01 154 2203

Contextual Info: Kontakt-Maße c o n ta c t dimensions fix Ì = 1 9 1 Kontakt-Typ pin type — ABC G H J K L M CU u— N P Q CU _ 1- R S T -c : Qi QJ Œ. OJ r-\ CU INJ e QJ C_ CU u— CU Qj Cr 53 àL CM o -H i_n r*- -f f ¥ Mit Rechte Vorbehalten/ ill rights reserved

Contextual Info: solution copper wire bonding technology Copper Cu Wire Bonding Copper (Cu) wire has long been used as a method of connecting a silicon die to the package terminals. With the recent increase in gold (Au) wire cost, Cu wire is an attractive way to manage overall package cost.

uPD70F3025A

Abstract: 74G4
Contextual Info: IC dependence of oscillating characteristics uPD70F3025A FCR6.0MC5 - S a. [U] UIH/UIL Room Temp. Udd [U] 5 b. CU] U2H/U2L c. [MHz] d. [uS] item a~e e. C/] f. CU] g. CU] Fosc Trise Duty Ustart Uhold LLC 6.0104 60 50.9 1.81 1.68 HLC 6.01 65 51 2 1.93 CCC 6.0096

uPD784218A

Contextual Info: IC dependence of osc i11 at inq character ist ics uPD784218A Room Temp. FCR4.0MC5 - S Udd a. CU] UIH/UIL LLM 5.2 HLM 5.2 HHH 5.2 LHM 5.2 HHH 5.1 -.5 -.6 -.5 -.5 b. CU] U2H/U2L c. [MHz] CU] 5 d. [uS] e. item cfe M f. [U] g. [U] Fosc Trise Duty Ustart Uhold

80028

Abstract: 9806 M50747 8B428
Contextual Info: M50747 - 1 Rf CMohm] 1 FCRB.0MC5 Ta= 20 Cdeg] o a. UIH/U1L CU] b. U2H/U2L CU] 0 Tupical «- » lilnrftt._ 5 3 5 3 U2H * U2L t- c. Fosc [/] 3 C 3 400 d. Trise EuSl 300 200 100 00 e. Duty [/] 55 50 45 40 4.5 5 Udd f. Ustart CU] Typical = I.55

Contextual Info: SK25GH063 C- R PO S$@ 407,- %*8,23.-, -', .6.,+ Absolute Maximum Ratings Symbol Conditions IGBT T$LA CU R PO S$ E$ CU R XPO S$ E$[¥ IGBT Module SK25GH063 *'-) MWW T NW Y C- R ZW S$ PX Y MW Y ] PW T CU R XPO S$ XW a- C- R PO S$ NM Y C- R ZW S$ Pc Y E$[¥R P : E$0%&

Contextual Info: 53 SPECIFICATION SHEET 6559407 RS Stock No. DRAWING - 1 -TT cu LO CU U nit : mm Bulb Type 1. Structure Bulb D iam eter 0 4Max. Length 37Max Base Type W.T. Voltage 2. Design Characteristics T l.25 100/120/220/250V Amperage 0.6mA+10% Gas Type Neon gas-filled

Contextual Info: SK25GD063 C- R PO S$@ 407,- %*8,23.-, -', .6.,+ Absolute Maximum Ratings Symbol Conditions IGBT T$LA CU R PO S$ E$ CU R XPO S$ E$[¥ *'-) MWW T NW Y C- R ZW S$ PX Y MW Y ] PW T CU R XPO S$ XW a- C- R PO S$ NM Y C- R ZW S$ Pc Y E$[¥R P : E$0%& T$$ R NWW T^ TFL _ PW T^

Contextual Info: SK13GD063 C- R PO S$@ 407,- %*8,23.-, -', .6.,+ Absolute Maximum Ratings Symbol Conditions IGBT T$LA CU R PO S$ E$ CU R XPO S$ E$[¥ *'-) MWW T XY Z C- R YW S$ XN Z PW Z ] PW T CU R XPO S$ XW a- C- R PO S$ PP Z C- R YW S$ XO Z E$[¥R P : E$0%& T$$ R NWW T^ TFL _ PW T^

Contextual Info: SK15GH063 C- R PO S$@ 407,- %*8,23.-, -', .6.,+ Absolute Maximum Ratings Symbol Conditions IGBT T$LA CU R PO S$ E$ CU R XPO S$ E$¥] IGBT Module SK15GH063 *'-) MWW T PW Y C- R ZW S$ X[ Y NW Y ^ PW T CU R XPO S$ XW b- C- R PO S$ PW Y C- R ZW S$ XO Y PZ Y XWW

Contextual Info: CERAMIC DISC CAPACITORS SPECIAL LEAD STYLE SPECIFICATIONS TYPE CU or CJ “ CU” Type: 100V to 1KV, Class 3 Lead Length L : 5.0 ± ,8mm (.196 ± .031) Lead Space (S): 6.35 ± .8mm (.250 ± .031) for under dia max 13.0mm (.492) 9.5 ± .8mm (.375 ± .031) for over dia max 13.5mm (.531)

Contextual Info: SK45GH063 C- R PO S$@ 407,- %*8,23.-, -', .6.,+ Absolute Maximum Ratings Symbol Conditions IGBT T$LA CU R PO S$ E$ CU R XPO S$ E$¥] *'-) MWW T YO Z C- R [W S$ NW Z XWW Z ^ PW T CU R XPO S$ XW b- C- R PO S$ Od Z C- R [W S$ N[ Z XWW Z YYW Z E$¥]R P : E$0%&

Contextual Info: SK45GD063 C- R PO S$@ 407,- %*8,23.-, -', .6.,+ Absolute Maximum Ratings Symbol Conditions IGBT T$LA CU R PO S$ E$ CU R XPO S$ E$¥] *'-) MWW T YO Z C- R [W S$ NW Z XWW Z ^ PW T CU R XPO S$ XW b- C- R PO S$ NM Z C- R [W S$ PY Z E$¥]R P : E$0%& T$$ R NWW T_ TFL ` PW T_

D 9969

Abstract: uPD78F1
Contextual Info: IC dependence of osci Ma t i n g characteristics uPD78F0988GC-2 FCR8.0MC5 - S Room Temp. Udd CU] 5 item a~e UPD78F0988GC-2 - U-7 FCR8.0MC5 (Fig.a~e) Udd= 5 [U] e Typical o a. UIH/U1L [U] "575- 53" - 5 1 - 5 T UIH i I U2H/U^ I I I I CU] I

Am186TMCC

Abstract: register
Contextual Info: AMENDMENT Am186 CC/CH/CU Microcontrollers Register Set Manual This document amends the Am186™CC/CH/CU Microcontrollers Register Set Manual, order #21916B. It consists of these parts: • “Documentation Defects and Corrections” on page 1 lists corrections to be made in page number order.

Contextual Info: SOD123F Rectifier Material Content Declaration Material name Lead Frame 24.41% Substance name Substance CAS no., if mass e.g. Copper Cu , known Gold (Au) (mg) Copper (Cu) 7440-50-8 Phosphorus (P) 7723-14-0 Arsenic (As) 7440-38-2 Tin (Sn) 7440-31-5 Oxygen (O)

MN101C66D

Contextual Info: MNI01C66D FCR8.0MC5 Udd= 5 EU] Fig.cTe G Typical B u i H / u y _ 7 CU] -5t 8UIH ^ b. U2H , ,u?i, ~'iF J I "53­ Ó— - 5 3 - 5 3 £ c. Fosc .3 .1 -.1 -.3 -.5 400 CU] U2H/U^_ -5i9- i i' { I I "575" — i • 7o4 . ■~'(P i t "'-4 S_L. I I I I I I

uPD63630

Contextual Info: IC dependence of osci Mating characteristics uPD63630 CCRI6.93MXC7 - S Room Temp. Udd CU] 3.3 item a~e uPD63630 - HHLC CCR16.93MXC7 Ta= 25 [deg] a. U1H/U1L CU] o 0 Tupica I — — IJnrfit. U1H W- -8 U1L 9- -8— b. U2H/U2L c, Fosc — 0 -8

UPD703111

Abstract: CCR18 UPD703111GM
Contextual Info: IC dependence of osci Ma t i n g characteristics uPD703H1GM CCRI8.0MXC7 - S Room Temp. Udd CU] 3.3 item a~e uPD703111GM - HHH CCRI8.0MXC7 Ta= 20 Udeg] a. U1H/U1L o 0 Tupical — — Unrfit CU] U1H B» U1L _l_ b. U2H/U2L c, Fosc 3 b— - - - - a - - 1

tRAS.MAX is calculated from the maximum amount of

Contextual Info: Data Sheet, Rev. 1.0, Apr. 2006 Cover Page sto me rs HYS72T512022HP–[3S/3.7]–A No tV or ali dF RDIMM DDR2 SDRAM RoHS Compliant Cu 240-Pin Registered DDR SDRAM Modules Memory Products sto me rs Cu or dF Edition 2006-04 Attention please! ali Published by Infineon Technologies AG,

PE4714

Abstract: RG142 RG223 RG400
Contextual Info: BODY CONTACT INSULATOR MATERIALS BRASS NICKEL PLATED GOLD PLATED PTFE ASSEMBLY PROCEDURES 1. SLIDE CLAMP NUT 1 , WASHER (2 ) & GASKET (3 ) OVER CABLE. STRIP CABLE AS SHOWN. DO NOT NICK BRAID WHILE CUTTING JACKET. TAPER END OF BRAID TO PERMIT ASSEMBLY OF BRAID CU\MP (4 ). SLIDE BRAID CU\MP ( 4 ) OVER BRAID &

PE4952

Abstract: RG62
Contextual Info: BODY CONTACT INSULATOR MATERIALS BRASS NICKEL PLATED SILVER PLATED PTFE ASSEMBLY PROCEDURES 1. SLIDE CLAMP NUT 1 , WASHER (2 ) & GASKET (3 ) OVER CABLE. STRIP CABLE AS SHOWN. DO NOT NICK BRAID WHILE CUTTING JACKET. TAPER END OF BRAID TO PERMIT ASSEMBLY OF BRAID CU\MP (4 ). SLIDE BRAID CU\MP (4 ) OVER BRAID &

Contextual Info: Alle Rechte vorbehalten/ i ll tights restmd CD -5 = 0 2 , 8 5 ±0,05 Qj m os ro ^ — rD \ n Qj CU un x 05 to ro ro CD Cu X ii • . CTn hO © L ro to uu > - 'CD “O CD O 2 , 5 4 ±o, 1 to to 5 , 3 ±0,1 C5 O 53 = CD O CD => 2,54 2x 2,54 = 5 ,0 8 -P -

PE44104

Abstract: RG316
Contextual Info: BODY CONTACT INSULATOR MATERIALS BRASS NICKEL PLATED GOLD PLATED PTFE ASSEMBLY PROCEDURES 1. SLIDE CLAMP NUT 1 , WASHER (2 ) & GASKET (3 ) OVER CABLE. STRIP CABLE AS SHOWN. DO NOT NICK BRAID WHILE CUTTING JACKET. TAPER END OF BRAID TO PERMIT ASSEMBLY OF BRAID CU\MP (4 ). SLIDE BRAID CU\MP (4 ) OVER BRAID &