CTE TABLE IC BGA Search Results

Altera Flip Chip BGA warpage

Abstract: with or without underfill DSASW0010612 cte table epoxy substrate you ad electronics Power consumption of FCBGA 53RD
Contextual Info: Design Guidance for the Mechanical Reliability of Low-K Flip Chip BGA Package 1 Kuo-Chin Chang*, 2Yuan Li, 1Chung-Yi Lin, and 1Mirng-Ji Lii 1 Taiwan Semiconductor Manufacturing Company, Ltd. 6, Creation Rd. 2, HsinChu Science Park, HsinChu 300, TAIWAN * Tel: 886-3-5785112 Ext.6274; Fax: 886-3-5641737; E-mail: kcchange@tsmc.com

Contextual Info: ADVANCE M i m n M 2 5 b K X 1 8 , 1 2 8 K X 3 2 /3 6 I 3.3V I/O, PIPELINED, SCD SYNCBURST SRAM Q X /M f^ D I in Q T O T I M v D U l l O I MT58LC256K18D9, MT58LC128K32D9, MT58LC128K36D9 C D A M 3.3V Supply, Pipelined, Burst Counter and Single-Cycle Deselect

IPC-6012

Abstract: IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525
Contextual Info: Maxim > App Notes > General Engineering Topics Prototyping and PC- Board Layout Wireless and RF Keywords: chip scale package, flip chip, CSP, UCSP, U- CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-level packaging WLP and its applications Abstract: This application note discusses Maxim's wafer-level package (WLP). Topics include: wafer construction, tape-and-reel

Contextual Info: KM736V799 128Kx36 Synchronous SRAM Document Title 128Kx36-Bit Synchronous Pipelined Burst SRAM Revision History Rev. No 0.0 0.1 History Draft Date Remark Initial d ra ft A pril . 14. 19 98 P re lim in a ry C h a n g e U n d e rs h o o t s p e c A pril . 20. 19 98

IPC-6011

Abstract: IPC-D-279 IPC-6013 ipc 7094 IPC-6012 IPC-2223 IPC 6012 IPC-6016 IPC-2221 IPC-2222
Contextual Info: Maxim > App Notes > General Engineering Topics Prototyping and PC-Board Layout Wireless, RF, and Cable Keywords: chip scale package, flip chip, CSP, UCSP, U-CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-Level Packaging WLP and Its Applications

Contextual Info: ADVANCE M i m n M 2 5 b K X 1 8 , 1 2 8 K X 3 2 /3 6 I 2.5V I/O, PIPELINED, DCD SYNCBURST SRAM Q X /M f^ D I i n Q T O T I M v D U l l O I MT58LC256K18F1, MT58LC128K32F1, MT58LC128K36F1 C D 3.3V Supply, +2.5V I/O, Pipelined, Burst Counter and Double-Cycle Deselect

Contextual Info: ADVANCE M i m n M 2 5 b K X 1 8 , 1 2 8 K X 3 2 /3 6 I 2.5V I/O, PIPELINED, SCD SYNCBURST SRAM Q X /M f^ D I O T I M v D U i n Q T l l O I C D A I WI w n « IV I M T58LC256K18G 1, M T58LC128K32G 1, MT58LC128K36G1 3.3V Supply, +2.5V I/O, Pipelined, Burst Counter and Single-Cycle Deselect

DBGA

Abstract: cte table ic bga DIMPLE BGA FR4 0.8mm thickness 0.65mm pitch BGA BGA cte BGA Solder Ball collapse bga thermal cycling reliability
Contextual Info: 2ND LEVEL INTERCONNECT RELIABILITY OF CERAMIC AREA ARRAY PACKAGES Shingo Sato, Noriyuki Shimizu*, Shin Matsuda, Shoji Uegaki and Sachio Ninomiya Kyocera Corporation Kyoto, Japan Biography During temperature cycling test TCT , CBGAÕs failure usually occurs in the form of an

NATIONAL SEMICONDUCTOR ink MARKING

Abstract: Die Attach epoxy stamping cte table flip chip substrate cte table ic bga JESD 49 gold wire bond failures due to ultrasonic cleaning Aluminum alloys physical properties FLIP CHIP PRODUCTS micro machine thermal conductivity coefficient of thermal expansion of thermal conductive pressure sensitive adhesive
Contextual Info: September 2000 Die Products Business Unit as watches, calculators and smart cards as well as leading edge multiple die applications like cellular handsets and digital cameras. Better device performance utilizing die show up in processor modules for computers, workstations and servers as

Contextual Info: IBM041811PLA Preliminary 6 4 K x 18 P IP E L IN E S R A M Features • 6 4 K x 18 O rganization • • 0 .5 Micron C M O S Technology • Self-tim ed W rite O peration • S ynchronous Pipeline M o d e O f Operation • Byte W rite Capability • Single + 3 .3 V ± 5 % P ow er S upply and Ground

scb68459

Abstract: SA1000 floppy disk spindle controller scn68454 ISCN68454 SCN68000 SCN68454C6A52 SCN68454C6I48 SCN68454C6N48 ST506
Contextual Info: Signetics M icro p ro ce sso r P rod ucts DESCRIPTION The SCN68454 Intelligent Multiple Disk C ontroller IMDC provides the tradition­ al and advanced features required to control W inchester type rigid disks and floppy disks. It can control up to four rigid or floppy disk drives, in any com bi­

WLCSP smt

Abstract: EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition
Contextual Info: AN69061 Design, Manufacturing, and Handling Guidelines for Cypress Wafer-Level Chip Scale Packages WLCSP Author: Wynces Silvoza, Bo Chang Associated Project: No Associated Part Family: All Cypress WLCSP products Software Version: None Associated Application Notes: None

f9001

Abstract: NAFI tae 2026 CV17 LQFP32 PCD5008 PCD5013 PCD5013H 8668A X1HB
Contextual Info: P hilips S em ico n d uctors FLEX roaming decoder II C O N TE N TS 1 F E A TU R E S 2 A P P LIC A T IO N S 3 G E N E R A L D ES C R IPTIO N 4 Q U IC K R EFE R E N C E D ATA 5 O R D E R IN G IN FO R M A TIO N 6 B LO C K D IA G R AM 7 P IN NING 8 F U N C T IO N A L D ES C R IPTIO N

BGA153-1422-1

Abstract: G31D
Contextual Info: TOSHIBA TC55YK1618XB-666f-500t-400 T EN T A T IV E T O S H IB A M O S D IG IT A L IN T E G R A T E D C IR C U IT S IL IC O N G A T E C M O S 1,048,576-WORD BY 18-BIT SYNCHRONOUS STATIC RAM DESCRIPTION The TC55YK1618XB is a 18,874,368-bit synchronous static random access memory SRAM organized

Contextual Info: ADVANCE 256K x 18/128K x 36 2.5V I/O, LATCHED LATE WRITE SRAM MT59L256V18L MT59L128V36L 4.5Mb LATE WRITE SRAM FEATURES • • • • • • • • • • • • • • • • • Fast cycle times 5ns, 5.5ns and 6ns 256K x 18 or 128K x 36 configurations

Contextual Info: 1.0 Product Description The R S8228 Octal ATM Transm ission Convergence TC PH Y device dram ati­ cally increases the level o f integration for switches and access systems. The R S8228 integrates all o f the ATM Layer processing functions found in the ATM

IDT71V2576

Abstract: IDT71V2578 IDT71V3576 IDT71V3578 cte table ic bga SSIO-24 71V2578
Contextual Info: PRELIMINARY IDT71V2576 IDT71V2578 IDT71V3576 IDT71V3578 128K X 36, 256K X 18, 3.3V SYNCHRONOUS SRAMS WITH 2.5V I/O OPTION, PIPELINED OUTPUTS, BURST COUNTER, SINGLE CYCLE DESELECT FEATURES: DESCRIPTION: • 128K x 36, 256K x 18 memory configurations • Supports high system speed:

transistor smd G46

Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
Contextual Info: FBGA User’s Guide Version 4.2 -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG

Contextual Info: ADVANCE 256K x 18/128K x 36 2.5V I/O, PIPELINED LATE WRITE SRAM MICRON I TECHNOLOGY, INC. MT59L256V18P MT59L128V36P 4.5Mb LATE WRITE SRAM FEATURES • • • • • • • • • • • • • • • • Fast cycle times 4.5ns, 5ns, 6ns and 7ns 256K x 18 or 128K x 36 configurations

TDA9321H

Abstract: SAB9078HS smd transistor 2fh SAB9079HS SQFP128 TDA8310 TDA9143 TDA831 mp1192 TDA9321
Contextual Info: INTEGRATED CIRCUITS DATA SHEET SAB9079HS Multistandard Picture-In-Picture PIP controller Preliminary specification File under Integrated Circuits, IC02 2000 Jan 13 Philips Semiconductors Preliminary specification Multistandard Picture-In-Picture (PIP) controller

JESD-26

Abstract: RAI-5-039 mineral spirits bulk modulus Silicone mold release agent JESD-22 KITAGAWA MINERAL SPIRITS
Contextual Info: Package Reliability All products and packages offered by National Semiconductor Corporation meet the minimum reliability qualification requirements outlined in Table 1 and Table 2 for hermetic and plastic packages, respectively. These minimum requirements are applied to new packages as well as to existing

TB451

Abstract: intersil standard part marking wlcsp inspection
Contextual Info: Technical Brief 451 PCB Assembly Guidelines for Intersil Wafer Level Chip Scale Package Devices Introduction SOLDER BALL: Sn/Ag/Cu There is an industry-wide trend towards using the smallest package possible for a given pin count. This is driven primarily by the handheld products market where the trend towards

Contextual Info: ADVANCE M ir a r i M 2 5 5 K X I 8 /1 2 8 K X 3 6 I LVTTL, FLOW-THROUGH LATE WRITE SRAM d 5 M h ^ ,J IV IU I A T F •- MT59L256L18F MT59L128L36F WRITE SRAM Dual Clock and Single Clock FEATURES • • • • • • • • • • • • • • • •

MCM6573A

Abstract: S3888 MCM6576 MCM6575 character generator matrix pattern acab acab chip MCM66740 MCM66750 MCM6673 n25E
Contextual Info: M M O T O R O L A 8 1 9 2-B IT REA D O N L Y M EM O RIES RO W S E L E C T C H A R A C T E R G E N E R A T O R S T h e M C M 6 6 7 0 0 is a m ask-p ro g ra m m a b le 8 1 9 2 -b it h o rrzontal-scan (ro w select} c h a ra c te r gen erator. It c o n ta in s