CST8 Search Results

FSV 052

Abstract: TC7WG00FC TC7WG02FC TC7WG04FC TC7WG08FC TC7WG125FC TC7WG14FC TC7WG17FC TC7WG32FC TC7WG34FC
Contextual Info: 東芝半導体情報誌アイ 2006年2月号 VOLUME 163 CONTENTS INFORMATION ザイリンクスと65nm FPGAの共同開発で合意 .2 新製品情報 CMOSロジックファミリー L-MOS LVPシリーズ "CST8" .2

Contextual Info: Reliability Tests Report Product Name: TC7WH34FC Package Name: CST8 1. Thermal tests Test Item Heat resistance Reflow Temperature cycling - - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC7WH08FC Package Name: CST8 1. Thermal tests Test Item Heat resistance Reflow Temperature cycling - - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC7WG14FC Package Name: CST8 1. Thermal tests Test Item Heat resistance Reflow Temperature cycling - - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC7WH157FC Package Name: CST8 1. Thermal tests Test Item Heat resistance Reflow Temperature cycling - - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC7WGU04FC Package Name: CST8 1. Thermal tests Test Item Heat resistance Reflow Temperature cycling - - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC7PB54FC Package Name: CST8 1. Thermal tests Test Item Heat resistance Reflow Temperature cycling - - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

ic 555

Abstract: datasheet of ic 555 IC chip 555 TA4024CT TA4024
Contextual Info: 8-Pin Chip Scale Package Thin Type CST8 Package Outline Dimensions Outline Dimensions 4 1.1 ±0.03 4 1 1.2 ±0.03 Bottom view 0.22 Unit: mm 0.26 Land Pattern Example 8 5 0.4 ±0.02 0.38 +0.02 –0.03 1 0.15 ±0.03 0.525 ±0.02 1.05 ±0.03 5 1.35 ±0.05 8

CSA8.00mtz

Abstract: murata Ceramic Resonator cst800mtw CD4069UBE circuit CD4069UBE 00MTZ
Contextual Info: Technical Data of Ceramic Resonator Type CSA8.00MTZ CST8.00MTW Applied to M34551M8XXXFP TOYAMA MURATA MANUFACTURING CO., LTD. Product Engineering Service Section I Planning Department Piezoelectric Components Group Approved by Checked by Checked by Issued by

Contextual Info: Reliability Tests Report Product Name: TC7WG17FC Package Name: CST8 1. Thermal tests Test Item Heat resistance Reflow Temperature cycling - - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC7WPB306FC Package Name: CST8 1. Thermal tests Test Item Heat resistance Reflow Temperature cycling - - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC7WPB307FC Package Name: CST8 1. Thermal tests Test Item Heat resistance Reflow Temperature cycling - - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC7WG74FC Package Name: CST8 1. Thermal tests Test Item Heat resistance Reflow Temperature cycling - - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC7WG08FC Package Name: CST8 1. Thermal tests Test Item Heat resistance Reflow Temperature cycling - - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

TE85L

Abstract: TE85L paCKAGE
Contextual Info: 8-Pin Chip Scale Package Thin Type Embossed TE85L Tape for the CST8 Package Tape Dimensions Unit: mm 2.0 ±0.05 φ1.55 ±0.05 0.2 4.0 ±0.1 Y X 1.5 3.5 ±0.05 φ0.5 8.0 1.75 Y X’ Y’ Y’ 0.5 Feed direction 1.6 X X’ Cross section X-X’ Reel Dimensions

Contextual Info: Reliability Tests Report Product Name: TC7WH04FC Package Name: CST8 1. Thermal tests Test Item Heat resistance Reflow Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC7WG04FC Package Name: CST8 1. Thermal tests Test Item Heat resistance Reflow Temperature cycling - - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC7WG34FC Package Name: CST8 1. Thermal tests Test Item Heat resistance Reflow Temperature cycling - - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC7WH74FC Package Name: CST8 1. Thermal tests Test Item Heat resistance Reflow Temperature cycling - - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC7WG32FC Package Name: CST8 1. Thermal tests Test Item Heat resistance Reflow Temperature cycling - - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC7WPN3125FC Package Name: CST8 1. Thermal tests Test Item Heat resistance Reflow Temperature cycling - - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Toshiba TB 1230 N

Abstract: TMPZ84C011 TMPZ84C011A TMP284C011 FO34
Contextual Info: TOSHIBA TMPZ84C011A 3. OPERATIONAL DESCRIPTIONS 3.1 ENTIRE BLOCK DIAGRAM AND OPERATION OF EACH BLOCK 3.1.1 Entire Block Diagram 110489 Figure 3.1.1 Entire Block Diagram MPUZ80-302 TOSHIBA TMPZ84C011A 3.1.2 Operation of Each Block The TMPZ84C011A largely consists of a processor MPU , a counter/timer circuit

toshiba TLC

Abstract: TMPZ84C013 TMPZ84C013A sbc 486 rf traNsmitter receiver 12mhz Equivalent TLC 372 CP ic la 339 R7EH TMPZ84C LC 3514-A
Contextual Info: TOSHIBA TMPZ84C013A 3. OPERATIONAL DESCRIPTION 3.1 BLOCK D IAG RA M AND O PERATIO NAL OUTLINE 3.1.1 Block Diagram C LKO U T XTAL1 } CLKIN CLK M SI MS2 EV L_ HALT Ml ÑMÍ Controller RESET BÜSACK i M REQ HALT MI CGC NMI NMI BÜSREQ J CLK INT R ESET -^> RESET

TC7WG126FC

Contextual Info: TC7WG126FC 東芝CMOSデジタル集積回路 シリコン モノリシック TC7WG126FC Dual Bus Buffer with 3-STATE Output 特 長 TC7WG126FC • 高出力電流 : ±8 mA 最小 @ VCC = 3 V • 超高速動作 : tpd = 2.5 ns (標準) @ VCC = 3.3 V, 15 pF