CSP08 Search Results

Lead Free reflow soldering profile BGA

Abstract: BGA-3591 Metcal BGA-3591 Metcal CSP 3502 CSP-3500 BGA-3590 BGA-3592 CSP-085-102 ceramic rework bga rework
Contextual Info: Worldwide and U.S. Headquarters 1530 O’Brien Drive Menlo Park, CA 94025 USA Phone: + 1-650-325-3291 1-800-776-1778 Fax: + 1-650-325-5932 Europe Headquarters Eagle Close, Chandler’s Ford Eastleigh Hampshire SO53 4NF U.K. Phone: + 44 23 8048 9100 Fax: + 44 23 8048 9109

Contextual Info: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface

Contextual Info: High Speed Super Low Power SRAM 512k Word By 16 bit CS16LV81923 Revision History Rev. No. 2.0 2.1 History Issue Date Initial issue with new naming rule Feb.15, 2005 Add 48CSP-6x8mm package outline Mar. 08.2005 Remark 1 Rev. 2.1 Chiplus reserves the right to change product or specification without notice.

AK08D300-CLCC

Abstract: AK08D300-LFCSP2X3 .5mm AK08D300-LFCSP3x3 .5mm AK08D300-MLP.65mm AK10D300-8SON .65mm MLP 3X3 MLP 4X4 AK22D300-DFN AK24D300-LLP MLP 5X5
Contextual Info: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface

Contextual Info: High Speed Super Low Power SRAM 512k Word By 16 bit CS16LV81923 Revision History Rev. No. 2.0 2.1 History Issue Date Initial issue with new naming rule Feb.15, 2005 Add 48CSP-6x8mm package outline Mar. 08.2005 Remark 1 Rev. 2.1 Chiplus reserves the right to change product or specification without notice.

Contextual Info: High Speed Super Low Power SRAM 512k Word By 16 bit CS16LV81923 Revision History Rev. No. History Issue Date 2.0 Initial issue with new naming rule Feb.15, 2005 2.1 Add 48CSP-6x8mm package outline Mar. 08, 2005 2.2 Revise 48CSP-8x10mm pkg code from W to K

Contextual Info: High Speed Super Low Power SRAM 512k Word By 16 bit CS16LV81923 Revision History Rev. No. History Issue Date 2.0 Initial issue with new naming rule Feb.15, 2005 2.1 Add 48CSP-6x8mm package outline Mar. 08, 2005 2.2 Revise 48CSP-8x10mm pkg code from W to K

na07

Abstract: CSP05 NA05
Contextual Info: Nortel Signaling Solutions DMS-STP Signaling N EE TT W WO O RR KK RR EE LL II AA BB II LL II TT YY CC O O UU N N CC II LL N Industry-based System Reliability Support Solutions for Global Networks NRC Is Your System At Risk? Network operators and service providers have entered a new era

QFN leadframe

Contextual Info: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface

Contextual Info: High Speed Super Low Power SRAM 512k Word By 16 bit CS16LV81923 Revision History Rev. No. 2.0 2.1 2.2 History Initial issue with new naming rule Add 48CSP-6x8mm package outline Revise 48CSP-8x10mm pkg code from W to K Issue Date Feb.15, 2005 Mar. 08, 2005

BGA-3000

Abstract: BGA-3500 Metcal CSP 3502 Metcal BGA-3591 CSP-3500 metcal bga-3000 METCAL MX-500 circuit BGA-3591 BGA-3592 reflow temperature bga laptop
Contextual Info: BGA & CSP Rework System BGA-3590 Series CSP-3500 Series USER GUIDE Precision Systems for the Electronics Bench www.metcal.com P/N 7000-1251, Ver. A , 9/01 ii BGA-3500 Series Manual 5/01 TABLE OF CONTENTS PREFACE Specifications 2 System Part Numbers 3 Environmental Conditions

Contextual Info: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface