CP382X Search Results

CP382X Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
cmlt3820g Abstract: CMPT3820 CXT3820 TRANSISTOR 536 Contextual Info: PROCESS CP382X Small Signal Transistor NPN - Low VCE SAT Transistor Chip PROCESS DETAILS Die Size 26 x 26 MILS Die Thickness 5.9 MILS Base Bonding Pad Area 5.5 x 5.5 MILS Emitter Bonding Pad Area 5.5 x 5.5 MILS Top Side Metalization Al - 30,000Å Back Side Metalization	Original	CP382X CMLT3820G CMPT3820 CXT3820 cmlt3820g CMPT3820 CXT3820 TRANSISTOR 536	PDF

Catalog Datasheet

Type

Document Tags

PDF

cmlt3820g

Abstract: CMPT3820 CXT3820 TRANSISTOR 536
Contextual Info: PROCESS CP382X Small Signal Transistor NPN - Low VCE SAT Transistor Chip PROCESS DETAILS Die Size 26 x 26 MILS Die Thickness 5.9 MILS Base Bonding Pad Area 5.5 x 5.5 MILS Emitter Bonding Pad Area 5.5 x 5.5 MILS Top Side Metalization Al - 30,000Å Back Side Metalization

Original

CP382X CMLT3820G CMPT3820 CXT3820 cmlt3820g CMPT3820 CXT3820 TRANSISTOR 536

PDF