COPPER PILLAR SOLDER Search Results

cu pillar

Abstract: Amkor Technology amkor flip PoP PACKAGE TESTING
Contextual Info: Copper pillar bump is a next generation flip chip interconnect which offers advantages in many designs while meeting current and future ROHS requirements. It is an excellent interconnect choice for applications such as Transceivers, Embedded Processors, Application Processors, Power

cu pillar

Abstract: pillar amkor amkor flip flip chip 106A led flip-chip 1000X f2f chip Amkor Technology
Contextual Info: Copper pillar bump is a next generation flip chip interconnect which offers advantages in many designs while meeting current and future ROHS requirements. It is an excellent interconnect choice for applications such as Transceivers, Embedded Processors, Application Processors, Power

torque of screw for pcb

Abstract: material MS58 C3602 R-14-0067 MS58 R-14-0064 cinterion SMT Process r-14006 pillar
Contextual Info: PCB Hardware Features and Applications: • • • Enhance the grounding of the Cinterion module to the PCB. Simple production process: SMT process to solder mounting pillars to the PCB Self-locking screw solution for mounting the module on to the mounting pillars.

Contextual Info: TCP-3047H Advance Information 4.7 pF Passive Tunable Integrated Circuits PTIC Introduction http://onsemi.com ON Semiconductor’s PTICs have excellent RF performance and power consumption, making them suitable for any mobile handset or radio application. The fundamental building block of our PTIC

SAC351

Abstract: pillar 3082h
Contextual Info: TCP-3082H Advance Information 8.2 pF Passive Tunable Integrated Circuits PTIC Introduction http://onsemi.com ON Semiconductor’s PTICs have excellent RF performance and power consumption, making them suitable for any mobile handset or radio application. The fundamental building block of our PTIC

tunable antenna

Abstract: WLCSP flip chip
Contextual Info: TCP-3012H Advance Information 1.2 pF Passive Tunable Integrated Circuits PTIC Introduction http://onsemi.com ON Semiconductor’s PTICs have excellent RF performance and power consumption, making them suitable for any mobile handset or radio application. The fundamental building block of our PTIC

Contextual Info: TGV2204-FC 19 GHz VCO with Prescaler Key Features • • • • • • • • Measured Performance Bias conditions: Vcc = 5 V, Itotal = 165 mA Frequency Range: 18.5 – 19.5 GHz Output Power: 7 dBm @ 19 GHz Phase Noise: -105 dBc/Hz at 1 MHz offset, fc=19 GHz

Contextual Info: TCP-3039H Advance Information 3.9 pF Passive Tunable Integrated Circuits PTIC Introduction http://onsemi.com ON Semiconductor’s PTICs have excellent RF performance and power consumption, making them suitable for any mobile handset or radio application. The fundamental building block of our PTIC

pillar

Abstract: wlcsp underfill
Contextual Info: TCP-3027H Advance Information 2.7 pF Passive Tunable Integrated Circuits PTIC Introduction http://onsemi.com ON Semiconductor’s PTICs have excellent RF performance and power consumption, making them suitable for any mobile handset or radio application. The fundamental building block of our PTIC

TCP-3068N

Contextual Info: TCP-3068N Advance Information 6.8 pF Passive Tunable Integrated Circuits PTIC Introduction ON Semiconductor’s PTICs have excellent RF performance and power consumption, making them suitable for any mobile handset or radio application. The fundamental building block of our PTIC

Contextual Info: TCP-3033H Advance Information 3.3 pF Passive Tunable Integrated Circuits PTIC Introduction ON Semiconductor’s PTICs have excellent RF performance and power consumption, making them suitable for any mobile handset or radio application. The fundamental building block of our PTIC

Contextual Info: TCP-3068H Advance Information 6.8 pF Passive Tunable Integrated Circuits PTIC Introduction ON Semiconductor’s PTICs have excellent RF performance and power consumption, making them suitable for any mobile handset or radio application. The fundamental building block of our PTIC

Contextual Info: TCP-3027H Advance Information 2.7 pF Passive Tunable Integrated Circuits PTIC Introduction ON Semiconductor’s PTICs have excellent RF performance and power consumption, making them suitable for any mobile handset or radio application. The fundamental building block of our PTIC

Contextual Info: TCP-3033N Advance Information 3.3 pF Passive Tunable Integrated Circuits PTIC Introduction ON Semiconductor’s PTICs have excellent RF performance and power consumption, making them suitable for any mobile handset or radio application. The fundamental building block of our PTIC

Contextual Info: TGC4703-FC 19 to 38 GHz Doubler Key Features • • • • • • • • Measured Performance Bias conditions: Vd = 3.5 V, Vg1 = -0.4 V, Vg2 = +0.2 V, • 16 Primary Applications 15 • • 14 13 11 10 Product Description 9 8 Input Freq: 19.25 GHz 7 6

Contextual Info: TGS4305-FC 60-90 GHz SP3T Switch Flip Chip Key Features • Frequency Range: 60-90 GHz • 2.3 dB Typical Flipped Insertion Loss • 20 dB Nominal Isolation • > 13 dB Typical Thru State Return Loss • < 5 nsec Switching Speed • Integrated DC blocking at RF ports

Contextual Info: TCP-3047N Advance Information 4.7 pF Passive Tunable Integrated Circuits PTIC Introduction ON Semiconductor’s PTICs have excellent RF performance and power consumption, making them suitable for any mobile handset or radio application. The fundamental building block of our PTIC

Contextual Info: TCP-3056N Advance Information 5.6 pF Passive Tunable Integrated Circuits PTIC Introduction ON Semiconductor’s PTICs have excellent RF performance and power consumption, making them suitable for any mobile handset or radio application. The fundamental building block of our PTIC

Contextual Info: TCP-3033H Advance Information 3.3 pF Passive Tunable Integrated Circuits PTIC Introduction ON Semiconductor’s PTICs have excellent RF performance and power consumption, making them suitable for any mobile handset or radio application. The fundamental building block of our PTIC

Contextual Info: TCP-3039H Advance Information 3.9 pF Passive Tunable Integrated Circuits PTIC Introduction ON Semiconductor’s PTICs have excellent RF performance and power consumption, making them suitable for any mobile handset or radio application. The fundamental building block of our PTIC

HBT3 triquint

Abstract: cu pillar TGV2204-FC pillar HBT3
Contextual Info: TGV2204-FC 19 GHz VCO with Prescaler Key Features • • • • • • • • Measured Performance Bias conditions: Vcc = 5 V, Itotal = 165 mA Frequency Range: 18.5 – 19.5 GHz Output Power: 7 dBm @ 19 GHz Phase Noise: -105 dBc/Hz at 1 MHz offset, fc=19 GHz

cu pillar

Abstract: E-band mmic TGS4305-FC power rf switch
Contextual Info: TGS4305-FC 60-90 GHz SP3T Switch Flip Chip Key Features • Frequency Range: 60-90 GHz • 2.3 dB Typical Flipped Insertion Loss • 20 dB Nominal Isolation • > 13 dB Typical Thru State Return Loss • < 5 nsec Switching Speed • Integrated DC blocking at RF ports

77GHz Radar

Abstract: AT77 E-band mmic
Contextual Info: TGA4706-FC 77 GHz Medium Power Amplifier Key Features • • • • • • Measured Performance Primary Applications Bias conditions: Vd = 3.5 V, Vg = 0 V, Id = ~ 75 mA Typical Pout @ 77GHz dBm 16 • • Automotive Radar E-Band Communication 14 Product Description

Contextual Info: TGS4306-FC 70-90 GHz SP4T Switch Flip Chip Key Features Bias conditions, OFF: Vd = 1.35 V, Id = 10 mA, State 5 Typical ON: Vd = -5V, Id = 0 mA, State 2 RF IN to RF OUT 2 S21 dB OFF -30 -40 74 76 78 80 82 84 Frequency (GHz) 86 88 90 • 20 dB Nominal Isolation