COPPER FIN PIN Search Results

CU1100

Abstract: CPR19-19-12U C2525M C1919S C2121M CPR19-19-15U CPR19-19-20U CPR19-19-25U c2929m C2121M cts
Contextual Info: Series CPR Forged Copper Heat Sinks Technical Data Features • Precision forging technology for high power applications • Omni-directional pins • Designed for BGA and other surface mount packages • Various mounting methods available • Select from multiple fin heights

Contextual Info: 6 1BJUNDB BSV DC MATERIAL: HOUSING: NYLON, U L 9 4 V -2 COLOR CONTACTS: 0 .2 5 THK COPPER ALLOY. NATURAL, COLOR OF PARTS MAY VARY . CONTACT FIN ISH: 0 . 0 0 3 OVER 0 . 0 0 1 2 7 MIN TH K T IN -L E A D MIN THK N IC KEL OVER ENTIRE CONTACT. CONTACT FIN ISH: 0 . 0 0 0 7 6 MIN THK GOLD PLATE ON PIN MATING 5URFACE, 0 .0 0 3 MIN THK

Contextual Info: Catalog 1307612 AMP Universal MATE-N-LOK Connectors Revised 7-01 PC Board Vertical Pin Headers with ACTION PIN Contacts M aterial: Pin and Socket Connectors Housing— PBT, black Flammability Rating — UL94V-0 Contacts— Copper alloy, plated with fin-lead over nickel on entire contact

180Z

Abstract: 16.0z 320z MS320
Contextual Info: 7 U ~! niM a Technical Data Material: Pin outer sleeve : Brass.machined. CuZn38Pb2 Clip {contact U fin ge r): Beryllium copper .heat treated or PHBZ Platinglouter sle e ve ): Tin p la te d : 2um/80u,'nickel,5um/200u‘,Tin Plating clip(contact): 2um/80 u"nichel.gold Plash

Contextual Info: IF IN DOUBT - ASK DRAWING No.: M 705-6 X 0046 X8.85 NOT TO SCALE THIRD ANGLE PROJECTION ALL DIMENSIONS IN mm SPECIFICATIONS: 3.50 MATERIAL:- A HOUSING: PBT, UL94V-0, BLACK TERMINAL: COPPER ALLOY INNER PIN FIN IS H TERMINAL: TIN PLATED ALL OVER ELECTRICAL: CURRENT RATING: 2.5 AMP. MAX.

Contextual Info: 7 8 THIS DRAWING IS UNPUBLISHED. C COPYRIGHT 20 RELEASED FOR PUBLICATION BY - 6 4 3 2 20 LOC GP ALL RIGHTS RESERVED. FIN TYPE HEAT SINK 1 MATERIAL: CAGE ASSEMBLY - NICKEL-SILVER ALLOY. EMI SPRINGS - COPPER ALLOY. HEATSINK - ALUMINUM. HEATSINK CLIP - STAINLESS STEEL.

Contextual Info: RADIALL 0 6 2 0 049 SALES DRAWING F d i t Ì on 7 IT R F , SIZE 1 PIN C0AX_ SN A TFRMINATinN SFR Î F Page : : NSX . / PEN : M AT ERIAL AN D FIN ISH : OUTER AND CENTER CONTACTS DIELECTRIC : TEFLON COPPER ALLO Y - .00005GOLD PLAT ED OVER NICKEL UNDERPLATE

Contextual Info: Kfet. IB 71 U i ÍA ¿2». 2 2 9 - 0 / 0 ,2. NOTES 1. MATERIALS : Body:_ Pin: Insulator: FINISH: Body; Fin: 3. SYM - _Brass per QQ-B-626, 1/2 Hard, Alloy 360. _Beryllium Copper per QQ-C-530, Cond. H . , Alloy 173, Teflon per Mil-P - 1 9468.and L-P-403, Type I.

30f 122

Abstract: E13288 74857
Contextual Info: Catalog 124153 A lV I F* Blindmate Connectors Compilation Issued 3-96 A M P O W E R Wave Crimp Self-Aligning Headers 2 Cable Header M aterial and Fin ish : Housing— UL 94V-0 rated thermoplastic, black Contacts— Copper alloy silver on mating interface tin-lead on solder tails.

A258

Abstract: TR-350
Contextual Info: ORDER INFORMATION 1014 0 REV ECN NO. A NEW DESIGN APP. DATE 50 X I. Plating: 2: Selective Gold No. Of Contact 47 fin+n. L:26.0mm HOUSING: HIGH TEMPERATURE THERMOPLASTIC. CONTACT: COPPER ALLOY. PED: BRASS. -Type Style MATERIAL W/O Stand-Off PLATING SMT CONTACT: UNDERPLATED: 50 u” MIN Ni.

Contextual Info: REV. UNLESS OTHERWISE SPED FED OMENSONS ARE M KNJJMETEItS. CKHCNSONS M [ ] ABE IN INCHES M b Fin CUSTOMS RCmWICE EMLV. Û.S — ô m m B — 30m m 30 - 1 2 0 m m C O N TAC T PIN BER. COPPER ± ± ± 0 .2 0 m m 0_ 4D m m 0 .5 0 m m GOLD .3 1 5 = ± 0 .0 0 7 "

Contextual Info: 6 2DJUN06 BSV DC ECO—06—013157 MATERIAL: HOUSING: NYLON, U L 9 4 V -2 COLOR CONTACTS: 0 .2 5 THK COPPER ALLOY. NATURAL, COLOR OF PARTS MAY VARY . CONTACT FIN ISH: 0 . 0 0 3 OVER 0 . 0 0 1 2 7 MIN THK T IN -L E A D MIN TH K NIC KEL OVER ENTIRE CONTACT.

Contextual Info: 13 10 12 44914 .043 FIN ISH : A □ IA DRILLED HOLE CKTS MATERIAL NO: 02 0 .9 4 /1 .0 7 ° IA FINISHED PLA T E D HOLE ,0013 0 .0 3 3 ELECTRO-DEPOSITED COPPER 0004 0.010 FINISH: B FINISH: C CKTS MATERIAL NO: MATERIAL NO: 4 4 9 1 4 -0 2 0 2 4 4 9 1 4 -0 2 0 3

SD-500873-001

Contextual Info: 10 PARTS QT'Y M A T E R IA L 7 .7 1 FIN IS H (LCP , U L 9 4 V - 0 S : H / \ 0 'J y c ? HOUSING HEAT RESISTAN CE POLYMER (LCP) .U L94V -0,BLAC K SLID ER CAM HEAT RESISTAN CE POLYMER (LCP) .U L94V -0,BLAC K 5 —S ^ JL TERMINAL CORSON COPPER (LCP) , U L 9 4 V - 0 e : n

Contextual Info: 10 q_ iltf '.OOTYP. — 7 . 2 0 * 0.15 13.17 NOTES 1. 2. M ATER IALS : HOUSI NG - LC P .G LA C P O W E R PIN - COPPER A LL O Y FILLED ,U L9V-VO ,C O LO R :BLAC K. FIN IS HES : TIN: 0 . 7 6 M ICROM ET ER MINIMUM GOLD A T C O N T A C T A R E A A N D 2 . 5 7 M IC RO M ETE R MINIMUM TIN A T S O L D E R T A I L A R E A OVE R

Contextual Info: 450-3718 Solder Mount • For .030 0,76 , .031 ( 0,79) and .032 (0,81) Diameter Pins ACTUAL SIZE .190 M n (4.63) H ot* Depth HOW TO ORDER CODE: 450 - 3718 - 01 -X X -00 Finish Basic Part No. FINISH CODED DASH NO. For repeated usage, only one of any of the three recommended pin diameters

Contextual Info: P.C. JACKS-CLOSED ENTRY- PRESS MOUNT BASIC PART NO. 0 9 -9 0 8 1 -1-XX P.C. JACK FOR .0 40 PIN P.C. JACK FOR .025 PIN 0 9 -9 1 7 1 -1 -X X BASIC PA RT NO. 102 FINISH _.0 2 0 0,51 BERYLLIUM J C O PPER -H SPRIN G IN SERT CAPTIVATED .141 3,58 MIN. HOLE DEPTH

Theta JB

Abstract: 2330B 100C MPC8240 MPC8260 PEAK tray drawing TBGA 214226-ICB TBGA480
Contextual Info: M Tape Ball Grid Array TBGA Q3 2000 Page 1 Motorola General Business Information Motorola TBGA Construction • Two Motorola products currently packaged in TBGA: – Voyager / MPC8260 / PowerQUICC II • • • • 480 pins (29x29 array, 1.27 mm pitch, 5 perimeter rows)

ic mc4017

Abstract: MC4017 CI 4017 MC4107 pin configuration 4017 B047 156 20k Tantalum Capacitor
Contextual Info: MC4017 2 W Stereo Audio Power Amplifier with Four Selectable Gain Setting General Description Features The MC4017 is a stereo audio speaker amplifier in a 20-pin TSSOP with thermal pad package,which provide internal gain control internal gain control, and a stereo bridged

Contextual Info: P.C. J A C K S -C L O S E D EIM TRY-PRESS MOUNT 09-9081-1-XX P.C. JACK FOR .040 PIN 09-9031-1-XX P.C. JACK FÜR .030,031 AND B A S IC P A R T NO. F IN ISH •032 PINS* B A S IC PA R T NO. FIN ISH FOR 0 5 0 '0 ,7 S ; .C 3 i 0,79 a 032('0,8fj \ P 'N S * ( t 0011

Contextual Info: THERMAL PERFORMANCE OF AN ELLIPTICAL PIN FIN HEAT SINK Christopher L. Chapman, and Seri Lee Aavid Engineering, Inc. Laconia, New Hampshire 03247 Bill L. Schmidt Silicon Graphics Computer Systems Mountainview, California 94039 L m Abstract Comparative thermal tests have been carried out using

Contextual Info: 45 0 -1 8 0 4 Press Mount • For .059 1,52 , .061 (1,55) and .062 (1,57) Diameter Pins .200 Mn (5.06) Ho* Dep*i ACTUAL SIZE HOW TO ORDER CODE: 450-1804-01 -XX-00 ~7-S Basic Part No. Finish FINISH CODED DASH No. COMPONENT Body Spring FINISH (-03)

Contextual Info: 450-2598 Thru Hole Thru Hole Solder Mounting-For .016 0,41 thru .019 (0,48) or .020 (0,51) Only Diameter Pins 450-3268 THRU HOLE \ .063 (1.60J .032 (0.81) . SPRING INSERT CAPTIVATED-. (BOOY IS SWAGED \ OVER FLANGE OF INSERTI \ .197 (5.00) DEPTH A C TU A L

Contextual Info: SINGLE POLE SOCKETS 450-2598 T h ru Hole 450-3268 .063 1.60 SPRING INSERT CAPTIVATED - Thru Hole Solder Mounting-For .016 (0,41) thru .019 (0,48) or .020 (0,51) Only Diameter Pins .032 (0.81) .207 "(5.28) (BODY IS SWAGE I) .207 063 (1.60) 032 (0.81)