COPPER BOND WIRE MICRO SEMI Search Results

TCR500

Abstract: SiCr wire bond 60k4
Contextual Info: PMC Passive Micro Components OVERVIEW PMC thin-film technology offers comprehensive materials and processes combinations allowing electronic designers superior space saving, tolerance and signal integrity for semi custom designs in the MHz to GHz spectrum.

silver epoxy

Contextual Info: VISHAY Vishay Semiconductors The Constituents of Semiconductor Components Responsible electronic component and equipment manufacturers are already preparing for the time when the life span of their products comes to an end by scrutinizing the materials incorporated and their

Mil-Std-883 Wire Bond Pull Method 2011

Abstract: 28-pin SOJ SRAM 9749 cel 9200 8361H CY62256V JESD22
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97496, VERSION 1.1 March 1999 256K SRAM, R42 Technology, Fab 4 Qualification CY62256V* 32K x 8 Micro Power Asynchronous SRAM 2.7V - 3.6V CY62256V25* 32K x 8 Micro Power Asynchronous SRAM (2.3V - 2.7V) CY62256V18*

MC100EL91

Abstract: MC100EPT25 MC100LVEP16 MC10LVEP16 100H646
Contextual Info: AND8072/D Thermal Analysis and Reliability of WIRE BONDED ECL Prepared by: Paul Shockman ON Semiconductor Logic Applications Engineering http://onsemi.com APPLICATION NOTE WIRE BONDED Device Failure Mechanisms For the plastic DIP, SOIC, TSSOP, PLCC, TQFP, and

Si3N4

Abstract: antimony trioxide epoxy molding TELEFUNKEN catalog
Contextual Info: Vishay Telefunken The Constituents of Semiconductor Components Document Number 82601 05.01 www.vishay.com 1 Vishay Telefunken Table of Contents The Constituents of Semiconductor Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Contextual Info: Data Sheet LEADFRAME CABGA/fBGA Features ChipArray Packages Amkor’s ChipArray® Ball Grid Array CABGA packages are laminate based packages that are compatible with SMT mounting processes worldwide. The near chip size CABGA fine-pitch BGA (fBGA) offers a

tsmc design rule

Abstract: 1120008 tsmc tsmc cmos MIL-STD-883C method 2011 tsmc Activation Energy tsmc cmos model
Contextual Info: Cypress Semiconductor Product Qualification Report QTP# 002105 VERSION 1.0 October, 2000 High Accuracy EPROM Programmable Single-PLL Clock Generator L28 Technology, CTI fab 2 and TSMC fab 2A, Taiwan CY2077 390 kHz - 133MHz at 5V 390 kHz -100 MHz at 3.3V CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA:

PQFP 176

Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
Contextual Info: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●

7C11483

Abstract: PECVD 8361H CY62128B CY62148B
Contextual Info: Cypress Semiconductor Product Qualification Report QTP# 004405 VERSION 1.0 January, 2001 Micro Power Asynchronous R52LD-5R Technology Fab 4 Cypress CY62148B 512K x 8 Static RAM CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director

CY2304

Abstract: CY2308
Contextual Info: Cypress Semiconductor Product Qualification Report QTP# 98204 VERSION 2.0 October, 2000 Zero Delay Buffer, 3.3V L28 Technology, Fab 2 CY2305/CY2309 10-MHz to 100/133-MHZ CY2304/CY2308 10-MHz to 133-MHZ CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell

AL3000A

Abstract: EME-6300H PALCE20V8
Contextual Info: Qualification Report November 1995, QTP# 95173, Version 1.0 PALCE20V8 Flash Erasable, Reprogrammable CMOS PAL PAL is a registered trademark of Advanced Micro Devices, Inc. CYPRESS SEMICONDUCTOR PAGE 2 PRODUCT DESCRIPTION (for qualification) Information provided in this document is intended for generic qualification and technically describes the Cypress part

CYPRESS an2394

Abstract: CONDUCTIVE INK FLEX CIRCUITS CONDUCTIVE INK FOR FLEX CIRCUITS AN2394 chemtronics chemtronics capacitive Cypress Projected Capacitive touch sensor design 5 PEN PC TECHNOLOGY references Capacitive Cypress touch panel
Contextual Info: A Designer's Guide to Rapid Prototyping of Capacitive Sensors on Any Surface By Mark Lee, Senior Application Engineer, Cypress Semiconductor Corp. Executive Summary This article will discuss how to replace the mechanical buttons on a product with a smooth and sleek touch-sensitive surface.

footprint jedec MS-026 TQFP

Abstract: footprint jedec MS-026 LQFP JEDEC TRAY ssop footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP 44 MS-026 BED BGA package tray 40 x 40 AMD Package moisture MO-069 footprint jedec MS-026 TQFP 144
Contextual Info: u Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Surface-Mount Array Packages Column Grid Array Packages Surface-Mount Leaded Packages Thru-Hole Packages Packages and Packing Publication Revision A 3/1/03 2-1 u Chapter 2 Package Design SURFACE-MOUNT ARRAY PACKAGES

EP4CE6 package

Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
Contextual Info: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead

Ablebond 8380

Abstract: A5700 Ablestik 8380 smema nozzle heater shoulder angle foot length lead solder joint reliability tms 3615 A5716 A5707-01 alpha Resistors slide
Contextual Info: 12 Tape Carrier Package 12.1 Introduction To The Package Technology As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace. Portability of computing and information management is driving the reduction in size from desktop to laptop to notebook to palm top sized products. These

FOOTPRINT MO-229 2X3 SOLDERING

Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
Contextual Info: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level

FIT4

Abstract: EME-6300H PALCE20V8
Contextual Info: Qualification Report April 1996, QTP# 96037, Version 1.0 PALCE20V8 Flash Erasable, Reprogramable CMOS PAL PAL is registered trademark of Advanced Micro Devices, Inc. PRODUCT DESCRIPTION (for qualification) Information provided in this document is intended for generic qualification and technically describes the Cypress part supplied:

FIT4

Abstract: EME-6300H PALCE16V8
Contextual Info: Qualification Report April 1996, QTP# 96023, Version 1.0 PALCE16V8 Flash Erasable, Reprogramable CMOS PAL PAL is registered trademark of Advanced Micro Devices, Inc. PRODUCT DESCRIPTION (for qualification) Information provided in this document is intended for generic qualification and technically describes the Cypress part supplied:

EP4CE15

Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
Contextual Info: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead

D2863-77

Abstract: Plastic Encapsulate Diodes bond wire copper hermetic packages PCB land circuit for wind mill footprint plcc 208 cmos methane SENSOR land pattern PQFP 208
Contextual Info: GENERAL INFORMATION Packages INTRODUCTION P lastic surface-mount package designs were developed in the late 1970s in answer to the demand for costeffective solutions to achieving greater board density without sacriÞcing reliability or functionality. Recent developments in these

Ablebond 8380

Abstract: smema DA6523 nozzle heater X3304 Theta-JC 5th mechnical engineering date sheet alpha Resistors slide cut template DRAWING Die Attach epoxy stamping
Contextual Info: 2 12 Advanced Package Applications: Tape Carrier Package 1/17/97 9:18 AM CH12WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 12 ADVANCED PACKAGE APPLICATIONS: TAPE CARRIER PACKAGE 12.1. INTRODUCTION TO THE PACKAGE TECHNOLOGY As semiconductor devices become more complex, they are being introduced into products that

CMOS handbook

Abstract: error 41 barrier EPM1270 EPM2210 EPM240 EPM240G EPM240Z EPM570 fbga Substrate design guidelines BGA PACKAGE OUTLINE
Contextual Info: Section II. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for MAX II devices. It contains the required printed circuit board PCB layout guidelines, device pin tables, and package specifications.

CERAMIC PIN GRID ARRAY wire lead frame

Abstract: IPC-SM-780 nickel corrosion electroplating
Contextual Info: Glossary A Access hole: A hole or series of holes in successive layers of a multilayer board that provide s access to the surface of the land in one or more layers of the board. All-metal package: A hybrid circuit package made solely of metal, excluding glass or ceramic.

IPC-SM-780

Contextual Info: Glossary A Access hole: A hole or series of holes in successive layers of a multilayer board that provide s access to the surface of the land in one or more layers of the board. All-metal package: A hybrid circuit package made solely of metal, excluding glass or ceramic.