COMPONENT CONSTRUCTION Search Results

04ZDS00003

Abstract: madison
Contextual Info: 1 PAIR 28 AWG + 2 CONDUCTOR 28 AWG SHIELDED USB CABLE COLOR CODE Component I Qty=1 Component # Component Conductor #1 Conductor #2 1 I Green White 2 II Black 3 II Red Component II (Qty=2) Binder ELECTRICAL CHARACTERISTICS Inner Shield Drain Wire Component I – 28 AWG Pair

bicc* cable

Abstract: BICC
Contextual Info: BICC BRAND-REX LTD 24AWG 25 Pair CAT 5 Our Ref: PowerPlus 155 COMPONENT II CABLE CONSTRUCTION Conductor 24 AW G solid bare copper Insulation Polyolefin Pair 2 cores twisted together to form a pair Component I 3 pairs twisted together Component II 4 pairs twisted together

Component Construction

Abstract: componen metal detector metal detectors circuit leadframe photodetector emitter metal detector CIRCUIT metal detector datasheet
Contextual Info: Component Construction Vishay Semiconductors Component Construction Photodetector and infrared emitter components are available in plastic or metal packages. Plastic devices mostly include a lens to improve radiant sensitivity or radiant intensity. Detector chips are mounted on

WIPED 51

Abstract: B3F-6020 B3F-6050 B3F-6150 transistor pt 6020 B3F-6000 B3F-6002 B3F-6005 B3F-6022 B3F-6052
Contextual Info: Mechanical Key Switch Radial Taped Radial Switches IB3F–6 IB3F_6 Automatic mounting possible via general-purpose radial taped component inserters. Conform to EIAJ RC 1008A Electronic Component Taping Dimensions. The same snap-action contact construction as the

C 6351 G

Contextual Info: Back Mechanical Key Switch Radial B3F-6 Taped Radial Switches Automatic mounting possible via general-purpose radial taped component inserters. Conform to EIAJ RC 1008A Electronic Component Taping Dimensions. The same snap-action contact construction as the

EIA-RS-198

Contextual Info: Surface Mounting Guide MLC Chip Capacitors Component Pad Design Component pads should be designed to achieve good solder filets and minimize component movement during reflow soldering. Pad designs are given below for the most common sizes of multilayer ceramic capacitors for both wave

Contextual Info: 24 V and 300 V DC-DC Converter Modules Module Construction & Component Derating This document provides a detailed view of the construction for Maxi, Mini and Micro DC-DC converters as well as the component design derating guidelines. Qualification Testing

Contextual Info: File E156996 Project 94ME78496 October 27, 1994 REPORT on COMPONENT - POWER SUPPLIES, INFORMATION TECHNOLOGY EQUIP. INCLUDING ELEC. BUSINESS EQUIP. * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * COMPONENT - POWER SUPPLIES, TELEPHONE Westcor Corp.

Contextual Info: Mechanical Key Switch Radial B3F-6 Taped Radial Switches Automatic mounting possible via general-purpose radial taped component inserters. Conform to EIAJ RC 1008A Electronic Component Taping Dimensions. The same snap-action contact construction as the B3F Series for a definite click action.

MIL-STD-810F shock

Abstract: MIL-STD-810F 500.4 V24A12M400BL MIL-STD-810F MIL-STD-810F 509.4 V24C5M100BL helicopter construction MIL-STD-810F Acceleration V24B5H200BL helicopter main rotor design
Contextual Info: 24 V and 300 V DC-DC Converter Modules Module Construction & Component Derating This document provides a detailed view of the construction for Maxi, Mini and Micro DC-DC converters as well as the component design derating guidelines. Module Size/Power Chart

Contextual Info: Standard Products!! SLF10145-H TYPE SMD Power Inductor Component Image & Dimension Features : Pb Free!! 4.5+/-0.3mm a Component Size : Mount Area : 10.1mm x 10.1mm Low Profile : 4.8mm Max. Height b) Generic use for portable DC/DC Converter. c) High Magnetic Shield Construction should actualize

25PR

Abstract: BICC bicc* cable
Contextual Info: BM8BHR8BEBSB8 BICC BRAND-REX LTD 24AW G 25 Pair CAT 5 Our Ref: C5U - 25PR - HF1 CABLE CONSTRUCTION Conductor 24 AWG solid bare copper Insulation Polyolefin Pair 2 cores twisted together to form a pair Component I 3 pairs twisted together Component II 4 pairs twisted together

Contextual Info: COMPONENT RESEARCH CO I bSE D • 53G3111 □□□□71T fill A19 Component Research METALLIZED POLYPHENYLENE SULFIDE A 1 9 S P E C IF IC A T IO N S CONSTRUCTION M etallized polyphenylene su lfid e d ie le ctric, herm etically sealed, extended metal film

96182 eaton

Abstract: MS3320 ms3320-5 eaton 96182 MS35206 DATA SHEET ms25244 MS3320-20 MS26574 ms3320-2 MS3320-10
Contextual Info: Electric Distribution & Controls Circuit Breakers Military/Aerospace Making the Best Better Traditional aerospace component suppliers are being asked to assume even greater levels of responsibility. One trend is that component manufacturers are being asked to increase their

Contextual Info: COMPONENT RESEARCH — Component Research CO I bSE D • 2303^11 0000714 E3T D I O METALLIZED _ ^ PO LY C A R B O N A T E CAPACITOR * P 1 2 S P E C IF IC A T IO N S CONSTRUCTION Metallized polycarbonate dielectric, hermetically sealed, extended metal film electrodes

96182 eaton

Abstract: 1841-1-5620 eaton 96182 sm600ba SM15CXD1 SM601BA SM600BA75A1 MS24141-D1 SM15AXD1 ms24171-d1
Contextual Info: Electric Distribution & Controls Relay Catalog Making the Best Better Traditional aerospace component suppliers are being asked to assume even greater levels of responsibility. One trend is that component manufacturers are being asked to increase their subsystem integration capability

SLF12575-TYPE-H

Abstract: SLF12575T
Contextual Info: TDK New Products!! SLF12575-TYPE-H Automotive Target SMD Power Inductor Component Image & Dimension Features : LEAD Free!! a Component Size : Mount Area : 12.5mm x 12.5mm Low Profile : 7.85mm Max. Height 7.5±0.35 b) Generic use for Automotive Appliance.

KYOCERA RESISTOR NETWORKS

Abstract: VOLTAGE DEPENDENT RESISTOR resistor kyocera resistor avx RC ARRAY DISCRETE CAP ic 4518 implantable Medical connector Thick Film Chip Resistor Network AVX film chip capacitors 1206 resistor
Contextual Info: CUSTOM INTEGRATED PASSIVE COMPONENTS GENERAL DESCRIPTION An Integrated Passive Component IPC , as the name suggests, is a device that incorporates more than one passive component into a single substrate. Integration involves either grouping multiple similar passive elements into

TECHNICAL FILE

Abstract: LAMBDA Part LAMBDA
Contextual Info: www.lambdapower.com Jan 2007 WHAT LEGISLATION APPLIES TO COMPONENT POWER SUPPLIES? There are many directives that could affect the end equipment into which component power supplies are fitted, and of course some affect the power supplies themselves. Here Bob Taylor,

TCDT1120

Abstract: TCDT1124 TCDT1120G VDE0884 IEC60065
Contextual Info: TCDT1120/ TCDT1120G Vishay Semiconductors Optocoupler, Phototransistor Output Features • • • • • Extra low coupling capacity - typical 0.2 pF High Common Mode Rejection Four CTR groups available Lead-free component Component in accordance to RoHS 2002/95/EC

Contextual Info: Making the Best Better Traditional aerospace component suppliers are being asked to assume even greater levels of responsibility. One trend is that component manufacturers are being asked to increase their subsystem integration capability to better serve the consolidating global

SMD Marking WZR

Abstract: weidmuller eg 01 1324460000 weidmuller relay AP 309 bsk 45 dk qb weidmuller seg/u 2 Pin Screw Terminal Block Connector 5mm Pitch 0383560000
Contextual Info: Component Carriers and Housings 292 Component Carriers and Housings Weidmüller EG 4 housing are suitable for the installation of electronic components with a maximum diameter or width of 4.5 mm. Four independent clamping yoke screw connections are available.

gold metal detectors

Abstract: soft solder die bonding schematic diagram intel atom INCOMING RAW MATERIAL INSPECTION lead side brazed hermetic X-RAY INSPECTION ausi die attach electrical three phase schematic riser DIAGRAM epoxy adhesive paste cte table intel 24008
Contextual Info: 2 3 Component Assembly Technology 1/22/97 9:49 AM CH03WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 3 COMPONENT ASSEMBLY TECHNOLOGY 3.1. INTRODUCTION The packaging technologies used to manufacture or assemble Intel’s three basic types of

TCDT1120

Contextual Info: TCDT1120/ TCDT1120G Vishay Semiconductors Optocoupler, Phototransistor Output Features • • • • • Extra low coupling capacity - typical 0.2 pF High Common Mode Rejection Four CTR groups available Lead-free component Component in accordance to RoHS 2002/95/EC