|
SSM10N961L
|
|
Toshiba Electronic Devices & Storage Corporation
|
N-ch MOSFET x 2, Common drain, VSSS=30 V, 0.0128 Ω@10V, TCSPAG-341501 |
Datasheet
|
|
|
75160-332-06LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,6 position, 2.54mm pitch |
PDF
|
|
|
10073456-033LF
|
|
Amphenol Communications Solutions
|
Quickie Header, Wire to Board Connector, Double Row, 26 Positions, Press-Fit Slimline Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating. |
PDF
|
|
|
G832MB130603322HR
|
|
Amphenol Communications Solutions
|
0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 5.7 mm, 60 Positions, Dual Row, BTB Vertical Plug SMT, 8u\\ Gold White. |
PDF
|
|
|
65846-033LF
|
|
Amphenol Communications Solutions
|
PV® Wire-to-Board Connector System, Mini Latching, Double Row, 68 Positions, Polarized, 2.54 mm (0.100in) Pitch, Housing. |
PDF
|
|
