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SSM10N961L
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Toshiba Electronic Devices & Storage Corporation
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N-ch MOSFET x 2, Common drain, VSSS=30 V, 0.0128 Ω@10V, TCSPAG-341501 |
Datasheet
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77311-818-18LF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch. |
PDF
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|
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77313-118-18LF
|
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, 2.54mm (0.100in), Unshrouded Vertical Header, Through Hole, Double Row, 18 Positions |
PDF
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77311-818-05LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 05 Positions, 2.54 mm Pitch. |
PDF
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|
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77311-818-15LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 15 Positions, 2.54 mm Pitch. |
PDF
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