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SSM10N961L
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Toshiba Electronic Devices & Storage Corporation
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N-ch MOSFET x 2, Common drain, VSSS=30 V, 0.0128 Ω@10V, TCSPAG-341501 |
Datasheet
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10072353-F01-17ULF
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Amphenol Communications Solutions
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Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 34 Positions - 2mm (0.079inch) - Right Angle |
PDF
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10117984-4020HLF
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Amphenol Communications Solutions
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QSFP+ Cable Assemblies, Cable Assemblies, 26AWG, Eyemax: 16 Signal/ 9 Ground; QSFP+: 38 Positions, 2.00mm (0.078in) Length. |
PDF
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68000-117HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail |
PDF
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77315-101-17LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 17 Positions 2.54 mm (0.100in) Pitch, Right Angle |
PDF
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