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SSM10N961L
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Toshiba Electronic Devices & Storage Corporation
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N-ch MOSFET x 2, Common drain, VSSS=30 V, 0.0128 Ω@10V, TCSPAG-341501 |
Datasheet
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68000-103HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 3 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail |
PDF
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93690-103-24LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical header, Press Fit, Double Row, 24 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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75188-301-03LF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical header, Through Hole, Single Row, 3 Positions, 5.08mm (0.200in) Pitch. |
PDF
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51720-10301602AALF
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Amphenol Communications Solutions
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PwrBlade®, Power Supply Connectors, 3P 16S 2P STB Right Angle Header. |
PDF
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