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SSM10N961L
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Toshiba Electronic Devices & Storage Corporation
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N-ch MOSFET x 2, Common drain, VSSS=30 V, 0.0128 Ω@10V, TCSPAG-341501 |
Datasheet
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61083-101602LF
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Amphenol Communications Solutions
|
BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 100 Positions. |
PDF
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77313-101-60LF
|
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 60 Positions |
PDF
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77313-101-62LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 62 Positions |
PDF
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|
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77313-101-68LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 68 Positions |
PDF
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