|
SSM10N961L
|
|
Toshiba Electronic Devices & Storage Corporation
|
N-ch MOSFET x 2, Common drain, VSSS=30 V, 0.0128 Ω@10V, TCSPAG-341501 |
Datasheet
|
|
|
68464-410HLF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 10 Positions, 2.54 mm (0.100in) Pitch. |
PDF
|
|
|
68464-434HLF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 34 Positions, 2.54 mm (0.100in) Pitch. |
PDF
|
|
|
68464-456HLF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 56 Positions, 2.54 mm (0.100in) Pitch. |
PDF
|
|
|
68464-408HLF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 8 Positions, 2.54 mm (0.100in) Pitch. |
PDF
|
|
