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L177HDB44SD1CO3F
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350\\), 44 Socket, 0.38um (15u\\) Gold, M3 Front Screwlock, Without Boardlock |
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L177HDE15SD1CO3F
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350\\), 15 Socket, 0.38um (15u\\) Gold, M3 Front Screwlock, Without Boardlock |
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L177SDA15S1ACO3F
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, Right Angle PCB Thru Hole, FP=10.40mm (.409in), Row Pitch 2.54mm, 15 Socket, 0.38um (15u\\) Gold, Bright Tin Shell, M3 Front Screwlock, Ground Tab with Clear Hole Without Boardlock |
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L177SDC37S1ACO3F
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, Right Angle PCB Thru Hole, FP=10.40mm (.409in), Row Pitch 2.54mm, 37 Socket, 0.38um (15u\\) Gold, Bright Tin Shell, M3 Front Screwlock, Ground Tab with Clear Hole Without Boardlock |
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L177SDE09S1ACO3F
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, Right Angle PCB Thru Hole, FP=10.40mm (.409in), Row Pitch 2.54mm, 09 Socket, 0.38um (15u\\) Gold, Bright Tin Shell, M3 Front Screwlock, Ground Tab with Clear Hole Without Boardlock |
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