CN0966XXXXXXXX Search Results

BACC63B

Contextual Info: CN0966 Series C48 Family Self-Locking Plug Connectors Threaded Coupling CN0966XXXXXXXX BACC63BP1 1.345* (34.164) Max. 360° LOCKING ACCESSORY TEETH 3 Dimensions Shell Size 8 10 12 14 16 18 20 22 24 28 A + .005 (.127) in mm .835 21.209 .972 23.698 1.165

Contextual Info: CN0966 Series C48 Family Self-Locking Plug Connectors Cinch 1 . 345 " Threaded Coupling CN0966XXXXXXXX BACC63BP1 TEETH Dimensions Shell Size 8 10 12 14 16 18 20 22 24 28 A + .005 (.127) mm in .835 .972 1.165 1.230 1.355 1.470 1.607 1.735 1.858 2.113 21.209

BACC63 Series

Abstract: BACC63 BACC10GH BOEING bacc63 BACC45FT BACC63BP bacc10 BACC10JS BACC45FN BACC45
Contextual Info: CYLINDRICAL C48 Series/MIL-C-26500 Accessories & Application Tooling Boeing: BACC45 / BACC63 Series MIL-C-26500 C48 Series Introduction • Qualified to MIL-C-26500. ■ Styles qualified to Boeing BACC45 Series. FEATURES ■ Styles qualified to Boeing BACC63 Series.

DC-37PTI

Abstract: ms24266r bacc63bn LGA 478 SOCKET PIN LAYOUT 94v-0 lcd display BACC45 BACC63CB bacc10gh BACC63BV MIL-C-27500
Contextual Info: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.

DIN 41529

Abstract: bacc10 MIL-C-83513 connector BACC45FT BACC10GH BACC45FN S2402D PTI 30 040 ga BACC45FM cd 1191 acb
Contextual Info: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.

BACC63CB

Abstract: bacc63bv m32029 BACC45 BACC45FT M22759/33-26-9 BACC45FN BACC63BP MIL-C-39029/31 Cinch Connectors bacc45ft
Contextual Info: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.