CLK13 Search Results

SN28837

Abstract: SN28838
Contextual Info: SN28838 PAL-COLOR SUBCARRIER GENERATOR SOCS029B – AUGUST 1991 • • NS PACKAGE TOP VIEW Solid-State Reliability Surface-Mount Package GND VDD1 PD LSW VCC GND CLK13M VDD2 description The SN28838 is a monolithic integrated circuit designed to interface with the SN28837 PALtiming generator in order to generate the

SBP9989

Contextual Info: TEXAS INSTR -CUC/UP} 2^ 8 9 6 17 22 TEXAS INSTR UC/UP DE j flTbl7H2 DDS1E3S 7 | I 29C 21235 T S 2 - 3 3 '0 3 D SBP9964 TIM IN G C O N T R O LLER FOR THE SBP9900A 1. IN TRO DU CTIO N KEY FEATURES • 1.2 14-Bit Interval Timer-Event Counter • R E S E T , H O L D , and L O A D synchronization

ep4cgx30f484

Abstract: EP4CE115 CYIV-5V1-1 EP4CGX EP4CE55 EP4CE15 sigma delta lcd screen lvds 40 pin diagram ep4ce22 ep4ce40
Contextual Info: Cyclone IV Device Handbook, Volume 1 101 Innovation Drive San Jose, CA 95134 www.altera.com CYIV-5V1-1.5 Copyright 2010 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other

Contextual Info: CB683 f C System Clock Buffer Approved Product _ PRODUCT FEA TURES_ • 24 output buffer divided into 3 groups for high clock fanout applications for CPU and PCI clocks. ■ Each output can be internally disabled for EMI reduction ■ EMI is further reduced by requiring only 1 single

MPC8323e

Abstract: MPC8321 MPC8321 programming guide PowerPC MPC8321 Processor MPC8321E MPC8323 MPC8323ERM
Contextual Info: Freescale Semiconductor Application Note AN3361 Rev. 4, 4/2008 MPC8321E/MPC8323E PowerQUICC Design Checklist Freescale Semiconductor, Inc. This application note describes the generally recommended connections for new designs based on the Freescale PowerQUICC™ MPC8323E processor family. These

Contextual Info: External Memory Interfaces in Stratix V Devices 7 2012.12.28 SV51008 Subscribe Feedback The Stratix V devices provide an efficient architecture that allows you to fit wide external memory interfaces to support a high level of system bandwidth within the small modular I/O bank structure. The I/Os are

MPC8255

Abstract: MPC8260 MPC860 SPEC95
Contextual Info: Advance Information MPC8255EC/D Rev. 0.1, 2/2002 MPC8255 Hardware Specifications This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the MPC8255 PowerQUICC II communications processor.

MPC8270

Abstract: ah222 k242 mPC 514 MPC8270VR MPC8270ZQ MPC8275 MPC8275VR MPC8275ZQ MPC8280
Contextual Info: Freescale Semiconductor MPC8280EC Rev. 1.7, 12/2006 Technical Data MPC8280 PowerQUICC II Family Hardware Specifications This document contains detailed information about power considerations, DC/AC electrical characteristics, and AC timing specifications for .13µm HiP7 members of the

D018

Abstract: D019 D032
Contextual Info: TOSHIBA THMY51E10C70,75,80 TOSHIBA HYBRID DIGITAL INTEGRATED CIRCUIT TENTATIVE 67,108,864-WORD BY 72-BIT SYNCHRONOUS DRAM MODULE DESCRIPTION The THMY51E10C is a 67,108,864-word by 72-bit synchronous dynamic RAM module consisting of 18 TC59SM804CFT DRAMs and PLL/Registers on a printed circuit board.

THMY25E10C70

Contextual Info: TOSHIBA THMY25E10C70,75,80 TENTATIVE TOSHIBA HYBRID DIGITAL INTEGRATED CIRCUIT 33,554,432-WORD BY 72-BIT SYNCHRONOUS DRAM MODULE DESCRIPTION The THMY25E10C is a 33,554,432-word by 72-bit synchronous dynamic RAM module consisting of nine TC59SM808CFT DRAMs and PLL/Registers on a printed circuit board.

D018

Abstract: D019 D032 D051 THMY51E10B70
Contextual Info: T O S H IB A THMY51E10B70,75,80 TOSHIBA HYBRID DIGITAL INTEGRATED CIRCUIT TENTATIVE 67,108,864-WORD BY 72-BIT SYNCHRONOUS DRAM MODULE DESCRIPTION The THMY51E10B is a 67,108,864-word by 72-bit synchronous dynamic RAM module consisting of 18 TC59SM804BFT DRAMs and PLL/Registers on a printed circuit board.

k5m capacitor

Abstract: Betatherm Inrush Current Limiter ICL thermistor ntc 1k betatherm 145 15 k NTC Betatherm K2M capacitor disc thermistor ntc K5M20KA2 2950 transistor
Contextual Info: BetaTHERM Sensors NTC Disc Thermistor NTC Disc Thermistors: Applications ¥ Temperature Compensation for transistor and various electronic circuits. ¥ Detection and control of temperatures for air conditioning equipment. ¥ Delay circuit such as relay. ¥ Automotive Electronics.

MPC8255

Abstract: MPC8260 MPC860 SPEC95
Contextual Info: Freescale Semiconductor, Inc. Advance Information MPC8255EC/D Rev. 0.4, 5/2002 Freescale Semiconductor, Inc. MPC8255 Hardware Specifications This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the MPC8255 PowerQUICC II

Contextual Info: T O S H IB A THMY25E10A70,75,80 TENTATIVE T O S H IB A H Y B R ID D IG ITA L IN T EG R A T ED C IRCUIT 33,554,432-WORD BY 72-BIT SYNCHRONOUS DRAM MODULE DESCRIPTION The THMY25E10A is a 33,554,432-word by 72-bit synchronous dynamic RAM module consisting of

Contextual Info: TOSHIBA THMY7216F0EG-75,-80 TENTATIVE TOSHIBA HYBRID DIGITAL INTEGRATED CIRCUIT 16,777,216-WORD BY 72-BIT SYNCHRONOUS DRAM MODULE DESCRIPTION The THM Y7216F0EG is a 16,777,216-word by 72-bit synchronous dynamic RAM module consisting of nine TC59SM708FT DRAMs and PLL/Registers on a printed circuit board.

Contextual Info: TO SHIBA THMY7280D0CEG-80 TENTATIVE TOSHIBA HYBRID DIGITAL INTEGRATED CIRCUIT 8,388,608-WORD BY 72-BIT SYNCHRONOUS DRAM MODULE DESCRIPTION The THMY7280D0CEG is a 8,388,608-word by 72-bit synchronous dynamic RAM module consisting of nine TC59S6408CFT DRAMs and PLL/Registers on a printed circuit board.

Contextual Info: TOSHIBA THMY7216F0EG-75 TENTATIVE TOSHIBA HYBRID DIGITAL INTEGRATED CIRCUIT 16,777,216-WORD BY 72-BIT SYNCHRONOUS DRAM MODULE DESCRIPTION The THMY7216F0EG is a 16,777,216-word by 72 bit synchronous dynamic RAM module consisting of nine TC59SM708FT DRAMs and PLL/Registers on a. printed circuit board.

Contextual Info: Pin Information for the Cyclone IV EP4CE75 Device Version 1.2 Notes 1 , (2), (3) Bank Number B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B2

CK3A

Contextual Info: Pin Information for the Arria V 5AGTFD3 Device Version 1.0 Note 1 Bank Number VREF PinName/Function (2) VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0

Contextual Info: Pin Information for the Stratix V 5SGXBB Device Version 1.0 Note 1 Bank Number GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L4 GXB_L4 GXB_L4 GXB_L4 GXB_L4 GXB_L4 GXB_L4 GXB_L4 GXB_L4 GXB_L4 GXB_L4

Contextual Info: Pin Information for the Arria V 5AGTMC3 Device Version 1.0 Note 1 Bank Number VREF PinName/Function (2) VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0

Contextual Info: Pin Information for the Arria V 5AGXMA5 Device Version 1.2 Note 1 Bank Number VREF PinName/Function (2) VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0

Contextual Info: Pin Information for the CycloneIII LS EP3CLS150 Device Version 1.1 Notes 1 ,(2) Bank VREFB Number Group Pin Name / Function Optional Function(s) B1 B1 B1 B1 B1 B1 B1 VREFB1N0 VREFB1N0 VREFB1N0 VREFB1N0 VREFB1N0 VREFB1N0 VREFB1N0 IO IO IO IO IO IO IO DIFFIO_L1p

Contextual Info: Pin Information for the Arria V 5AGTMC7 Device Version 1.1 Note 1 Bank Number VREF PinName/Function (2) VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0 VREFB3AN0