CKD TECHNOLOGY Search Results

CKD Technology

Abstract: ckd310jb1c105s CKD610 CKD510JB CKD510JB1A105S CHIP TANTAL CAP CKD110JB digital IC TANTAL 104 TANTAL 16V
Contextual Info: REV C Low ESL Feed Through Features Features CKD CKD series series LOW ESL FEED THROUGH TYPE CKD SERIES ARE CONSTRUCTED WITH 3 TERMINALS WHICH REDUCE INDUCTANCE AND EXTEND IN TO FOLLOWING APPLICATIONS. SIGNAL LINE FOR HIGH IMPEDANCE CIRCUIT. e.g. DIGITAL LINE.

D34063

Abstract: MC34063 5v MC34063 DIP 8SOP150 mc34063 5v 4A 8-SOP-150 MC34063 step-down CKD Technology 12 v to 5 v MC34063 MC34063
Contextual Info: CKD Technology CKD34063 DC TO DC CONVERTER CONTROLLER DESCRIPTION T he CK D34063 Series is a monolithic control circuit containing the primary functions required for DC to DC converters. T hese , devices consist of an internal temperature compensated reference, comparator

omron relay 5 pin 12V DC

Abstract: RELAY SPDT rising edge OMRON 24v relay dc 11 pin omron contactor S3D2-AK-US OMRON PROXIMITY SWITCH 5 pin relay 12vdc with NO NC omron 12v relay s3d2-akd OMRON TL-G3D
Contextual Info: Sensor Controller S3D2 Offers High-speed Input Response of 0.1 ms and Equipped with Built-in Timer • High-speed response of 0.1 ms. ■ Ideal as a two-input Controller. ■ Lineup includes the S3D2-BK with flip-flop functions convenient for level control, the S3D2-AKD/CKD/CCD with

CQ13

Abstract: CQ31 TQFP48 TSA1201 TSA1204 TSA1204IF TSA1204IFT
Contextual Info: TSA1204 DUAL-CHANNEL, 12-BIT, 20MSPS, 120mW A/D CONVERTER • 0.5Msps to 20Msps sampling frequency ■ Adaptative power consumption: 120mW @ CKD VCCBI GNDBE D1 OEB VCCBE AVCC D0 LSB AVCC 38 37 D2 D3 AGND 3 34 D4 INBI 4 33 D5 AGND 5 32 D6 IPOL 6 31 D7 30 D8

connctor

Abstract: C8318-04FDDXX0 Hsuan mao
Contextual Info: 2 3 4 5 6 7 8 A A B B C C D D E E F F G 玄茂科技股份有限公司 HSUAN MAO TECHNOLOGY CO., LTD. H DRAWING. 制表日: 2002/12/15 1 2 Jane UNIT SCALE MM 1: 1 APPD. APPROVED CKD. TOLERANCE ± 0.3 3 4 5 6 G PART NAME 1394 CONNCTOR FEMALE PCB SMT W/4 Metal Post

CQ31

Abstract: marking code c41 SMD ic SW-SPST footprint SA1203I TQFP48 TSA1201 TSA1203 TSA1203IF TSA1203IFT cq13
Contextual Info: TSA1203 DUAL-CHANNEL, 12-BIT, 40MSPS, 230mW A/D CONVERTER PIN CONNECTIONS top view AVCC OEB CKD VCCBI GNDBE VCCBE D0(LSB) 41 40 39 38 37 D1 AVCC 42 36 D2 35 D3 3 34 D4 INBI 4 33 D5 A GND 5 32 D6 IPOL 6 31 D7 AVCC 7 30 D8 29 D9 INQ 9 28 D10 A GND 10 27 D11(MS B )

Contextual Info: TC9805P TENTATIVE D A T A TC9805P is a 24-pin CMOS programmable logic device PLD based on EEPROM cells. It has a zero-standby function. Designed using Toshiba's original technology, this device features low power dissipation and inputs that are compatible w ith TTL, NMOS, and CMOS output

c832

Abstract: Hsuan Mao J394 X1300 22bu c832a C8324-04MSXB00 OY-IE0030 Jess Technology
Contextual Info: 8 B m/NOTZÌ.m /Salety: 1-1-Mi/Rating: AC 5V/0.5A 1-2- ÄHSSJfc^nsutoticn Resistance; 500M ohm Min at DC fOOV l-il0M# /Dtetectric Withstanding tfoJtoge.* AC IGOV fot t nninute f-4, HMBjfi/Conloct Resistance: 30m ohm or Jess 24íS/*WTBíML* 2 - 1.St?/P»kìhR/BRASS/&èXu"/GW30u’/J=0.20mm

PD10

Abstract: wVGA 30mhz time BU7963GUW BU7964 BU7963 BU7961 ALS01
Contextual Info: MSDL Mobile Shrink Data Link Transceivers for Mobile Phones Data rate 1350Mbps RGB Interface BU7963GUW No.10058EAT05 ●Description BU7963GUW is a differential serial interface connecting mobile phone LCD modules to the host CPU. Unique technology is utilized for lower power consumption and EMI. MSDL minimizes the number of wires required - an important consideration

Contextual Info: MSDL Mobile Shrink Data Link Transceivers for Mobile Phones Data rate 1350Mbps RGB Interface BU7963GUW No.10058EAT05 ●Description BU7963GUW is a differential serial interface connecting mobile phone LCD modules to the host CPU. Unique technology is utilized for lower power consumption and EMI. MSDL minimizes the number of wires required - an important consideration

C8317-04AFHSW0

Abstract: C8317 Hsuan mao
Contextual Info: 8 NO, NAME MATERIAL 1 HOUSING P.B.T, G,F, 2 3 PIN TERM, PHDSh BRDNZE SHELL ÏIÛ.25 REMARK FINISH WHITE GL3LD/TIN PLATED GQLD:1~iu’ NICKEL PLATED NI,2~3u BRASS TiÜ.3 3‘ TY 1 4 1 ß D UNIT HSUAN MAO TECHNOLOGY CO., LTD. $ .| t 0 :2000/06/07 RANDY APPROVED

C8317-04AFDXX0

Abstract: C8317-04AFD Hsuan mao
Contextual Info: 8 B D NO. 1 2 3 MATERIAL FINISH NAME BLACK OR WHITE NYLON PA9T G.F. HOUSING PIN TERM. PHOS. BRONZE T:0.25 GOLD-TIN PLATED NICKEL PLATED BRASS T:0.3 SHELL HSUAN MAO TECHNOLOGY CO., LTD. H $ 'J £ 0 :2001/06/15 DRAWING. J ja n ts APPROVED REMARK NI:M.5u:TIN:3u.

fbt 073

Abstract: C8317-04AFVSW0 C8317 Dold USB B PCB RIGHT ANGLE 4 PIN Hsuan mao
Contextual Info: 8 4 -0 0 .9 2 B D PCB LAYOUT BOTTOM VIEW NO. 1 2 3 4 5 NAME Ma ter ia l WHITE HOUSING d.F. PÏN TEKM. )>HOS. BRONZE T:0.26 dOLD/TIN PLATED BRASS T:0.3 S h e ll NICKEL PLATED 0HELL NICKEL PLATED ElPCd T:0.3 WHITE b o tto m Co v er P.B.T. Q.F. HSUAN MAO TECHNOLOGY CO., LTD.

2002112

Abstract: PA9T Hsuan mao
Contextual Info: 10.0 B C o m p o n e n t £ i d e p c b LAYOUT D NO. NAME Ma t e r ia l 1 HOUgiNd 2 PIN tERiíINAX 3 HSUAN MAO TECHNOLOGY CO., LTD. H # ' J & a : 2 0 0 2 /1 2 /9 DRAWING. ¿¡[o n e / APPROVED SHELL FIN ISH REMARK BLACK NYXON PA9T G.f. BRA90; b0.2 GÍOLD/TIN PLATED Cl0LD:30~35^

mcb circuit diagram

Abstract: MSAN-135 MT9080 MT9085 ts992
Contextual Info: Application Note MSAN-135 Design of Large Digital Switching Matrices using the SMX/PAC ISSUE 3 CONTENTS 1.0 Introduction 2.0 Digital Switching Basics 3.0 Design of 1024 Channel Switch 3.1 Parallel Timeslot Switch 3.1.1 Circuit Description 3.1.2 Throughput Delay Considerations

TS992

Abstract: TS1021 MSAN-135 MT9080 MT9085 TS991 C30S0 A11-A15 C16128 TS1022
Contextual Info: Application Note MSAN-135 Design of Large Digital Switching Matrices using the SMX/PAC ISSUE 3 CONTENTS 1.0 Introduction 2.0 Digital Switching Basics 3.0 Design of 1024 Channel Switch 3.1 Parallel Timeslot Switch 3.1.1 Circuit Description 3.1.2 Throughput Delay Considerations

MSAN-135

Abstract: MT9080 MT9085 ts992 D0D12
Contextual Info:  Application Note MSAN-135 Design of Large Digital Switching Matrices using the SMX/PAC ISSUE 3 CONTENTS 1.0 Introduction 2.0 Digital Switching Basics 3.0 Design of 1024 Channel Switch 3.1 Parallel Timeslot Switch 3.1.1 Circuit Description 3.1.2 Throughput Delay Considerations

Contextual Info:  Application Note MSAN-135 Design of Large Digital Switching Matrices using the SMX/PAC ISSUE 3 CONTENTS 1.0 Introduction 2.0 Digital Switching Basics 3.0 Design of 1024 Channel Switch 3.1 Parallel Timeslot Switch 3.1.1 Circuit Description 3.1.2 Throughput Delay Considerations

SA1203I

Abstract: TQFP48 TSA1203 TSA1203IF TSA1203IFT Marking STMicroelectronics tqfp OEB47
Contextual Info: TSA1203 DUAL-CHANNEL, 12-BIT, 40MSPS A/D CONVERTER ADVANCE DATA • 0.5Msps to 40Msps sampling frequency ■ Ultra low power consumption: 250mW @ ORDER CODE 20Msps, 300mW@ 40Msps ■ ENOB=11.0 @ Nyquist ■ Input range: 2Vpp differential for each chan■ ■

MURATA NFM61

Abstract: murata resistor array muRata Capacitor KC NFM216D ferrite bead tdk NFM51R CHIP capacitor cross reference INDUCTOR EMI FERRITE 2012 Taiyo Yuden BK1608 cross reference murata chip suppression filter
Contextual Info: EMI/EMC FILTERS 0.1 1 10 100 1000 -10 Attenuation dB KCR, KGM, KC & Ferrite Beads Typical Attenuation Frequency Curves KOA SPEER ELECTRONICS, INC. . . . your partner in advancing technology • -20 ■ -30 ■ ■ -40 ■ Frequency (MHz) KGM: Less Sharp

Contextual Info: High-Reliability Advanced CMOS Logic ICs CD54AC574/3A Octal D-Type Flip-Flop, 3-State Positive-Edge-Triggered, Non-Inverting CD54ACT574/3A The RCA CD54AC574/3A and CD54ACT574/3A are octal Dtype, 3-state, positive-edge-triggered flip-flops that utilize the new RCA ADVANCED CMOS LOGIC technology. The

PT7C5006ANC

Abstract: CKD Technology 50mhz crystal oscillator crystal 40mhz sine wave 5006AKD
Contextual Info: Data Sheet PT7C5006 Crystal Oscillator Module ICs |

Contextual Info: 1/4 STRUCTURE Silicon Monolithic Integrated Circuit PRODUCTNAME BU7961GUW FUNCTION Serial Interface for Mobile Devices Application MSDL3 Mobile Shrink Data Link 3 Serializer LSI FEATURES •Maximum transmission rate of highspeed differential interface MSDL3 is 900Mbps.

BU7961

Abstract: PD10
Contextual Info: 1/4 STRUCTURE Silicon Monolithic Integrated Circuit PRODUCTNAME BU7961GUW FUNCTION Serial Interface for Mobile Devices Application MSDL3 Mobile Shrink Data Link 3 Serializer LSI FEATURES •Maximum transmission rate of highspeed differential interface MSDL3 is 900Mbps.