CIM31U101 Search Results

CIM31U101

Abstract: CIM31J151
Contextual Info: Multilayer Chip Bead CIM Series- CIM31 3216/ EIA 1206 CIM Series display high impedance because it is composed of a multilayered internal conductor and has excellent attenuation characteristics for wide band frequency. FEATURES The smallest beads suitable for surface mounting

Contextual Info: Ver 201208 Chip Bead For EMI Suppression CIB/CIM31 Series 3216/ EIA 1206 APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES RECOMMENDED LAND PATTERN 1.8~2.5mm Perfect shape for automatic mounting, with no directionality.

CIB21P260

Abstract: CIB41P151 10f471 CIB31P500 CIM05U600 CIB21P110 CIB32P600 CIB31P260 CIB10P220 CIB21P470
Contextual Info: Chip Bead ; CIB/CIM Series For EMI Suppression Feature •Smallest beads suitable for surface mounting •Perfect shape for automatic mounting, with no directionality. •Excellent solderability and high heat resistance for either flow or reflow soldering.

CIB31P310

Abstract: 10f471 CIB21P470 CIB21P260 z500r
Contextual Info: Chip Bead ; CIB/CIM Series For EMI Suppression Feature •Smallest beads suitable for surface mounting •Perfect shape for automatic mounting, with no directionality. •Excellent solderability and high heat resistance for either flow or reflow soldering.

Contextual Info: Ver 201305 Chip Bead For EMI Suppression CIB/CIM31 Series 3216/ EIA 1206 APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES RECOMMENDED LAND PATTERN 1.8~2.5mm Perfect shape for automatic mounting, with no directionality.