CIM21J182 Search Results

Contextual Info: Ver 201305 Chip Bead For EMI Suppression CIB/CIM21 Series 2012/ EIA 0805 APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES RECOMMENDED LAND PATTERN 0.8~1.2mm Perfect shape for automatic mounting, with no directionality.

CIB21P260

Abstract: CIB41P151 10f471 CIB31P500 CIM05U600 CIB21P110 CIB32P600 CIB31P260 CIB10P220 CIB21P470
Contextual Info: Chip Bead ; CIB/CIM Series For EMI Suppression Feature •Smallest beads suitable for surface mounting •Perfect shape for automatic mounting, with no directionality. •Excellent solderability and high heat resistance for either flow or reflow soldering.

CIB31P310

Abstract: 10f471 CIB21P470 CIB21P260 z500r
Contextual Info: Chip Bead ; CIB/CIM Series For EMI Suppression Feature •Smallest beads suitable for surface mounting •Perfect shape for automatic mounting, with no directionality. •Excellent solderability and high heat resistance for either flow or reflow soldering.

CIM21J202

Abstract: CIM21J121 CIM21 CIM21U601 CIM21U102 CIM21J600 CIM21J601
Contextual Info: Multilayer Chip Bead CIM Series- CIM21 2012/ EIA 0805 CIM Series display high impedance because it is composed of a multilayered internal conductor and has excellent attenuation characteristics for wide band frequency. FEATURES The smallest beads suitable for surface mounting

Contextual Info: 201208 Chip Bead For EMI Suppression CIB/CIM21 Series 2012/ EIA 1008 APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES RECOMMENDED LAND PATTERN 0.8~1.2mm  Perfect shape for automatic mounting, with no directionality.