CHOMERICS THERMATTACH Search Results

C2929

Abstract: Chomerics Thermattach C2121 C2121M APF19-19-06CB APF19-19-10CB APF19-19-13CB APF30-30-06CB C4040T C2121M cts
Contextual Info: Series APF Forged Heat Sinks ELECTRONIC COMPONENTS Technical Data Low Height Thin-Fin Forged Aluminum Features • Precision Forging Technology for High Power Applications • Low Profile Thin Fins • Designed for BGA and Other Surface Mount Packages • Select From Multiple Fin Heights

Chomerics Thermattach

Abstract: T412 T411 APF19-19-06CB APF19-19-10CB APF19-19-13CB APF30-30-06CB T410 Chomerics
Contextual Info: Series APF Low Height Thin-Fin Forged Heat Sinks Technical Data Features • Precision Forging Technology for High Power Applications • Low Profile Thin Fins • Designed for BGA and Other Surface Mount Packages • Select from Multiple Fin Heights • Improved Thermal Performance

Chomerics Thermattach

Abstract: ARCLAD 8223 T410 T412 Chomerics
Contextual Info: Thermal Management Solution for BGA, PGA, CQFP, and PQFP This Series 658 is a omnidirectional pin fin heat sink for both natural and forced- Features and Benefits: convection applications. ♦ Available in four standard heights, .25 in., .35 in., 45 in., and .60 in.

CU1100

Abstract: CPR19-19-12U C2525M C1919S C2121M CPR19-19-15U CPR19-19-20U CPR19-19-25U c2929m C2121M cts
Contextual Info: Series CPR Forged Copper Heat Sinks Technical Data Features • Precision forging technology for high power applications • Omni-directional pins • Designed for BGA and other surface mount packages • Various mounting methods available • Select from multiple fin heights

C2121M

Abstract: APR27-27-12CB C2727M APR19-19-12CB APR19-19-15CB APR19-19-20CB APR19-19-25CB C4040T APR35 C2727S
Contextual Info: Series APR Forged Heat Sinks Technical Data Features • Precision forging technology for high power applications • Omni-directional pins • Designed for BGA and other surface mount packages • Various mounting methods available • Select from multiple fin heights

C4040T

Abstract: APR19-19-12CB APR19-19-15CB APR19-19-20CB APR19-19-25CB APR27-27-12CB APR35 C2323M
Contextual Info: CTS Series APR Forged Heat Sinks FORGED HEAT SINKS WITH PIN FINS Technical Data DESIGN FEATURES ELECTRONIC COMPONENTS • Precision forging technology for high power applications Forged Aluminum Heat Sinks with Pin Fins • Omnidirectional pins F•eatures

AN1018

Abstract: heat sink Chomerics Thermattach T412 APF19-19-13CB APF30-30-06CB APF19-19-06CB APF19-19-10CB
Contextual Info: Technical Brief AN1018 Low Height Thin-Fin Forged Heat Sink Introduction Board space constraints and increased demands for thermal management control are challenges that engineers must consider with each new application. Unused input power is lost as heat, which can destroy

AER19-19-12CB

Abstract: AER19-19-15CB APF19-19-06CB APF19-19-10CB APF19-19-13CB APF30-30-06CB
Contextual Info: Series AER Forged Heat Sinks CTS FORGED HEAT SINKS WITH PLATE FINS ELECTRONIC COMPONENTS Technical Data DESIGN FEATURES • Precision forging technology for high power applications • Designed A forluminum BGA and other surface mount with packages Forged

AER25-25-12CB

Abstract: AER19-19-12CB AER19-19-15CB AER19-19-18CB AER19-19-21CB c2525 AER21-21-23CB C1919S C2121M
Contextual Info: Series AER Forged Heat Sinks Technical Data Features • Precision forging technology for high power applications • Omni-directional pins • Designed for BGA and other surface mount packages • Various mounting methods available • Select from multiple fin heights

Contextual Info: HIGH TEMP FAN HEAT SINKS - FHS-090 SERIES High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 44.6 mm

Contextual Info: HI-TEMP FAN HEAT SINK – FHP Series High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 27x27 mm to 40x40 mm ■ Common 5VDC @ 0.5 A max USB 2.0 fan electrical

Contextual Info: HI-TEMP FAN HEAT SINK – FEX Series High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprint 35x35 mm and 40x40 mm ■ Common 5VDC @ 0.5 A max USB 2.0 fan electrical

Contextual Info: HI-TEMP FAN HEAT SINKS – FHE SERIES High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 45.0

Contextual Info: HI-TEMP FAN HEAT SINK – FHE Series High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 44.6

Contextual Info: HI-TEMP FAN HEAT SINK – FHP Series High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 27x27 mm to 40x40 mm ■ Common 5VDC @ 0.5 A max USB 2.0 fan electrical

zif rod

Contextual Info: – THERMAL MANAGEMENT PRODUCTS CATALOG www.ctscorp.com CTS TABLE OF CONTENTS PAGE HI-TEMP FAN HEAT SINKS 3 ADHESIVE PEEL AND STICK HEAT SINKS 6 FORGED HEAT SINKS WITH PLATE FINS 7 FORGED HEAT SINKS WITH PIN FINS 9 CLIP AND TAPE STYLES 10 ZIF STANDARD CIRCUIT BOARD RETAINERS

Contextual Info: HI-TEMP FAN HEAT SINKS – FHL SERIES High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 28.1

Contextual Info: HI-TEMP FAN HEAT SINKS – FHL SERIES High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 28.1

Contextual Info: THERMAL MANAGEMENT PRODUCTS CATALOG CTS ELECTRONIC COMPONENTS www.ctscorp.com CTS ® TABLE OF CONTENTS PAGE FAN HEAT SINKS 3 ADHESIVE PEEL AND STICK HEAT SINKS 6 FORGED HEAT SINKS WITH PLATE FINS 7 FORGED HEAT SINKS WITH PIN FINS 9 CLIP AND TAPE STYLES

LAD66A4

Abstract: PGA zif socket 478 electroless nickel MIL-STD-810 TX0547 TX0522ND 8815 k cts ocxo CTS ocxo 125 ocxo cts 03 transistor c4040
Contextual Info: THERMAL MANAGEMENT PRODUCTS CATALOG CTS ELECTRONIC COMPONENTS www.ctscorp.com CTS ® TABLE OF CONTENTS PAGE ADHESIVE PEEL AND STICK HEAT SINKS 3 FORGED HEAT SINKS WITH PLATE FINS 4 FORGED HEAT SINKS WITH PIN FINS 6 CLIP AND TAPE STYLES 7 ZIF STANDARD CIRCUIT BOARD RETAINERS

Contextual Info: FAN HEAT SINKS - FHS-090 SERIES High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 44.6

0.3mm pitch BGA

Abstract: vme 3u board standards 4-40 Kapton Washer led matrix 16X16 c2929 rod 456 LAT03B5U PGA zif socket 478 t410 TRANSISTOR up3-to3-b
Contextual Info: THERMAL MANAGEMENT PRODUCTS CATALOG CTS ELECTRONIC COMPONENTS CTS Electronic Components - California CTS ® TABLE OF CONTENTS PAGE CORPORATE PROFILE 2 ADHESIVE PEEL AND STICK HEAT SINKS 3 FORGED HEAT SINKS WITH PLATE FINS 4 FORGED HEAT SINKS WITH PIN FINS

POWER TRANSFORMER E154515

Abstract: scheme e131175 sampo E159656 foxconn e253117 e131175 XEPEX E140166 sony bando power transformer power transformer e190246 tamradio transformer e199273
Contextual Info: 10129 LIST OF COMPANY IDENTIFICATIONS The List of Company Identifications contains the trade names, trademarks, or other designations authorized for use in lieu of these Company names. ‘‘ ’’ — 2CS SRL ’’ — ACT CO LTD ‘‘ ‘‘ ’’ — 3E HK LTD

IXF1010

Abstract: T-710 36ga intel fan
Contextual Info: Intel IXF1010 Thermal Design Considerations Preliminary Application Note July 2002 This document contains preliminary information on new products. Information is subject to change without notice. Verify with your local Intel sales office that you have the latest datasheet before finalizing a design.