CHIP PADS LAYOUT Search Results

MA4BPS101

Abstract: MA4BPS301 PIN diode MACOM SPICE model MA4BPS201 Three bond 09CP
Contextual Info: PIN Diode Chips With Offset Bond Pads MA4BPS101, MA4BPS201, MA4BPS301 MA4BPS101, MA4BPS201, MA4BPS301 PIN Diode Chips with Offset Bond Pads Features • • • • • Chip Layout Bond Pads Removed From Active Junction Large Bond Pads Support Multiple Bond Wires

63023

Contextual Info: VCS2516 Vishay Foil Resistors SURFACE MOUNT Bulk Metal Foil Technology Surface Mount Current Sensing Chip Resistors FEATURES Product may not be to scale INTRODUCTION Model VCS2516 chip resistors have 4 tin/lead coated surface mount pads for 4-terminal connection where a

Contextual Info: THIN FILM CHIP RESISTORS MSTF 2 SERIES MECHANICAL DA TA DAT SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS BACKSIDE SURFACE CHIP RESISTORS 0.020" 0.020" x 0.020" ±0.003" x 0.010" (±0.003") (S)SILICON, (A)ALUMINA, (Q)QUARTZ, OR (G)GLASS NICHROME OR TTANT

Contextual Info: CENTER TAPPED CHIP RESISTORS MSTF 3 SERIES *ID BAR CHIP RESISTORS MECHANICAL DA TA DAT 0.030" SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS 0.030" x 0.030" ±0.003" x 0.010" (±0.003") (S)SILICON, (A)ALUMINA, (Q)QUARTZ, OR (G)GLASS NICHROME OR TTANT ANT ALUM NITRIDE

Contextual Info: THIN FILM CHIP RESISTOR MSTF 1 SERIES 0.015" Sq. MECHANICAL DA TA DAT CHIP RESISTORS 0.010" SIZE SUBSTRA TE SUBSTRATE RESISTOR BONDING P ADS PADS 0.015" x 0.015" x 0.010" ±0.003" (S)SILICON, (A)ALUMINA, (Q)QUARTZ, OR (G)GLASS NICHROME OR TTANT ANT ALUM NITRIDE

Contextual Info: THICK FILM CHIP ARRAYS - CONVEX RESISTORS *CAFS ft CCMLS*OEUOrUNES SMN ARRAY SERIES SMN1206, SMN2012: 8 PIN SMN1206, SMN2010, SMN2012, SMNN1206 FEATURES □ Internationally popular convex termination pads concave termination style also available~see CN series

EK-0402AS-X

Abstract: R20x 0402AS
Contextual Info: www.fastrongroup.com 0402 AS Engineer’s Kit : EK-0402AS-X 0.70 max All dimensions in mm 0.65 max 0.58 1.02 1.20 max 0.22 0.22 Chip Inductors wire wound - open 0.05 ~ 0.29 0.52 0.25 ref 0.66 0.36 0.46 0.36 recommended layout for solder pads 120 100 Q 100

Contextual Info: www.fastrongroup.com 1206 AS 2.50 max 1.50 max 0.51 1.0 2.18 1.8 3.2 4.00 max Engineer’s Kit : EK-1206AS-X 1.0 0.51 All dimensions in mm 0.23 ~ 0.50 Chip Inductors wire wound - open 1.95 recommended layout for solder pads 120 Part No 100 I (%) 80 60 40

arrays resistors

Contextual Info: RESISTORS CAPACITORS COILS DELAY LINES THICK FILM CONCAVE CHIP ARRAYS CN SERIES Resistor Arrays ZN SERIES Jumper Arrays RoHS Term.W is RoHS compliant & 260°C compatible Popular self-aligning concave termination pads convex termination style also available,see SMN series

CN1206

Abstract: CN0804 CN2012 10R0 1R00
Contextual Info: RESISTORS CAPACITORS COILS DELAY LINES THICK FILM CONCAVE CHIP ARRAYS CN SERIES Resistor Arrays ZN SERIES Jumper Arrays RoHS Popular self-aligning concave termination pads convex termination style also available,see SMN series Industry’s widest selection and lowest cost!

H006

Contextual Info: PRELIMINARY THICK FILM CHIP ARRAYS RESISTORS wCOILSwDELAY LINES SMN ARRAY SERIES SMN1206, SMN2012: 8 PIN → P ← SMN1206, SMN2010, SMN2012, SMNN1206 ↓ - ↑ W ↓ FEATURES r Internationally popular convex termination pads concave termination style also available-see CN series

DK1042

Abstract: 98-PL M110535 DK801
Contextual Info: THIRD ANGLE PROJECTION § b H - REV ECN No. OR A B B M 108069 M 110535 M 126537 R7B979 REVISIONS DESCRIPTION NEW RELEASE MODIFY GROUND PADS DELETE CHIP COMP. & TABLE OF VALUES DELETE CHIP COMP, k TABLE OF VALUES SUGGESTED MOUNTING CONFIGURATION FOR DKB01/DK1042 CASE STYLE, r s PIN CONNECTION. 50 0 .

0402AS-4N7K-01

Abstract: 0402AS-R22K
Contextual Info: www.fastrongroup.com 0402 AS Engineer’s Kit : EK-0402AS-X Part No 0.70 max 0.65 max 0.58 1.02 1.20 max 0.22 0.22 0.05 ~ 0.29 Chip Inductors wire wound - open 0.52 0.25 ref 0.66 0.36 0.46 0.36 recommended layout for solder pads 120 100 Q 10 nH 100 80 33 nH

SMN1206

Abstract: SMN2012
Contextual Info: THICK FILM CHIP ARRAYS - CONVEX RESISTORS MCAPS & COILS MDELAY LINES SMN ARRAY SERIES SMN1206, SMN2012: 8 PIN SMN1206, SMN2010, SMN2012, SMNN1206 → P ← ↓ - ↑ W ↓ FEATURES H Internationally popular convex termination pads concave termination style also available-see CN series

CN1206

Abstract: CN2512 CN2012 N2512
Contextual Info: THICK FILM CONCAVE CHIP ARRAYS CN SERIES Resistor Arrays ZN SERIES Jumper Arrays RoHS Term.W is RoHS compliant & 260°C compatible Popular self-aligning concave termination pads convex termination style also available,see SMN series Industry’s widest selection and lowest cost!

0R050

Abstract: VCS2516
Contextual Info: VCS2516 Vishay Foil Resistors SURFACE MOUNT Bulk Metal Foil Technology Surface Mount Current Sensing Chip Resistors FEATURES Product may not be to scale INTRODUCTION Model VCS2516 are surface mount resistors designed with 4 pads for kelvin connection. Utilizing Vishay Bulk Metal®

Contextual Info: THIN FILM CHIP RESISTORS MSTF 2 SERIES MECHANICAL DA TA DAT 0.020" SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS 0.020" x 0.020" ±0.003" x 0.010" (±0.003") SILICON, ALUMINA, QUARTZ, OR GLASS NICHROME OR TTANT ANT ALUM NITRIDE ANTALUM 15,000 Å MINIMUM GOLD

0R100

Contextual Info: VCS2516 Vishay Foil Resistors SURFACE MOUNT Bulk Metal Foil Technology Surface Mount Current Sensing Chip Resistors FEATURES Product may not be to scale INTRODUCTION Model VCS2516 are surface mount resistors designed with 4 pads for kelvin connection. Utilizing Vishay Bulk Metal®

Contextual Info: Part Number: ZMOK56WT-5 3.0x1.0 mm SMD CHIP LED LAMP www.SunLED.com Package Schematics Features ● Ideal for indication light on hand held products ● Long life and robust package ● Variety of lens types and color choices available ● Tinned pads for improved solderability

Contextual Info: Part Number: ZMG56WT-5 3.0x1.0 mm SMD CHIP LED LAMP www.SunLED.com Package Schematics Features ● Ideal for indication light on hand held products ● Long life and robust package ● Variety of lens types and color choices available ● Tinned pads for improved solderability

Contextual Info: Part Number: ZVG56WT-5 3.0x1.0 mm SMD CHIP LED LAMP www.SunLED.com Package Schematics Features ● Ideal for indication light on hand held products ● Long life and robust package ● Variety of lens types and color choices available ● Tinned pads for improved solderability

Contextual Info: Part Number: ZUY56WT-5 3.0x1.0 mm SMD CHIP LED LAMP www.SunLED.com Package Schematics Features ● Ideal for indication light on hand held products ● Long life and robust package ● Variety of lens types and color choices available ● Tinned pads for improved solderability

Contextual Info: Part Number: ZFBB56WT-5 3.0x1.0 mm SMD CHIP LED LAMP www.SunLED.com Package Schematics Features ● Ideal for indication light on hand held products ● Long life and robust package ● Variety of lens types and color choices available ● Tinned pads for improved solderability

smd 647

Contextual Info: Part Number: ZM2DG56WT-5 3.0x1.0 mm SMD CHIP LED LAMP www.SunLED.com Package Schematics Features ● Ideal for indication light on hand held products ● Long life and robust package ● Variety of lens types and color choices available ● Tinned pads for improved solderability