CHAPTER 2 PACKAGE MATERIALS Search Results

footprint jedec MS-026 TQFP

Abstract: footprint jedec MS-026 LQFP JEDEC TRAY ssop footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP 44 MS-026 BED BGA package tray 40 x 40 AMD Package moisture MO-069 footprint jedec MS-026 TQFP 144
Contextual Info: u Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Surface-Mount Array Packages Column Grid Array Packages Surface-Mount Leaded Packages Thru-Hole Packages Packages and Packing Publication Revision A 3/1/03 2-1 u Chapter 2 Package Design SURFACE-MOUNT ARRAY PACKAGES

CDA 194

Abstract: jedec mo-142 footprint jedec ms-024 D2863-77 leadframe C7025 ALJ- 1300 footprint WSON leadframe Cu C7025 MO-052 MO-108
Contextual Info: ‹ Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Flammability Rating Oxygen Index Fine-Pitch Ball Grid Array Leadframe Packages Packages and Packing Methodologies Handbook 17 Oct 2008 2-1 ‹ Chapter 2 Package Design FLAMMABILITY RATING The UL Rating for all Spansion products is 94 V-0.

NEC A39A

Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
Contextual Info: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES

nec microcomputer

Abstract: PG-FP3 ID78K0 ID78K4 IE-78001-R-A IE-784000-R V830
Contextual Info: Online Delivery Service ODS Guidance -1- Contents * Click to link , jump to directly Chapter 1.Introduction Chapter 2.Services of ODS Chapter 3.Microcomputer Software Development Tools which can be downloaded 3-1. Software Development Tool product included in “Software Package (SP)” product

12x12 bga thermal resistance

Abstract: XC2V6000-ff1152 xc2v3000fg XC2V3000-FG676 smd transistor J6 pin XC2V3000-BG728 XC2V80 IO-L93N UG002 Printed Circuit Boards PCB
Contextual Info: R Chapter 4 PCB Design Considerations 1 Summary This chapter covers the following topics: • • • • • • • • • • 2 Pinout Information Pinout Diagrams Package Specifications 3 Flip-Chip Packages Thermal Data Printed Circuit Board Considerations

Contextual Info: <Dual-In-Line Package Intelligent Power Module> 600V LARGE DIPIPM Ver.4 Series APPLICATION NOTE PS21A79 / PS21A7A Table of contents CHAPTER 1 INTRODUCTION .2

vfo 200v 0.4kw

Abstract: dipipm dipipm application note
Contextual Info: <Dual-In-Line Package Intelligent Power Module> MOSFET Super mini DIPIPM APPLICATION NOTE PSM03S93E5-A / PSM05S93E5-A Table of contents CHAPTER 1 INTRODUCTION .2

PS22A74

Contextual Info: <Dual-In-Line Package Intelligent Power Module> 1200V LARGE DIPIPM Ver.4 Series APPLICATION NOTE PS22A7 Table of contents CHAPTER 1 INTRODUCTION .2

Ablebond 8380

Abstract: smema DA6523 nozzle heater X3304 Theta-JC 5th mechnical engineering date sheet alpha Resistors slide cut template DRAWING Die Attach epoxy stamping
Contextual Info: 2 12 Advanced Package Applications: Tape Carrier Package 1/17/97 9:18 AM CH12WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 12 ADVANCED PACKAGE APPLICATIONS: TAPE CARRIER PACKAGE 12.1. INTRODUCTION TO THE PACKAGE TECHNOLOGY As semiconductor devices become more complex, they are being introduced into products that

OC-106 94V0 C

Abstract: olin 7025 CDA 194 Tamac4 eftec 7025 alloy lead frame sn 8400 Au Sn eutectic thermal conductivity Eftec 64t
Contextual Info: 2 5 Physical Constants of IC Package Materials 1/16/97 3:41 PM CH05WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 5 PHYSICAL CONSTANTS OF IC PACKAGE MATERIALS The Table 5-1 through Table 5-5 list typical values for selected properties of materials used in

kic 125

Abstract: ic KA 2645 C 6090 Side Brazed Ceramic Dual-In-Line Packages thermal analysis on pcb Coffin-Manson Equation AL Cu tungsten slug glass diode Braze Dual-In-Line 16 Packages cte table for epoxy adhesive and substrate PERFORMANCE CHARACTERISTICS OF IC PACKAGES
Contextual Info: 2 4 Performance Characteristics of IC Packages 1/22/97 10:05 AM CH04WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 4 PERFORMANCE CHARACTERISTICS OF IC PACKAGES 4.1. IC PACKAGE ELECTRICAL CHARACTERISTICS The following parameters are provided for Intel packages:

BGA 328

Contextual Info: u Chapter 8 Tape and Reel CHAPTER 8 TAPE AND REEL Introduction Design and Materials Device Count per Reel Reel Dimensions and Labels Tape Dimensions Packages and Packing Publication Revision A 3/1/03 8-1 u Chapter 8 Tape and Reel INTRODUCTION AMD offers a tape-and-reel packing container for PLCC, SOIC,

TLC 1050

Abstract: FAA064 spansion Packing and Packaging Handbook DATE CODE Transistor Bo 17 Datasheet spansion Packing and Packaging Handbook WNF008
Contextual Info: ‹ Chapter 6 Tape and Reel CHAPTER 6 TAPE AND REEL Introduction Design and Materials Device Count per Reel Reel Dimensions and Labels Tape Dimensions Packages and Packing Methodologies Handbook 17 Oct 2008 6-1 ‹ Chapter 6 Tape and Reel INTRODUCTION A tape-and-reel packing container is available for shipment of the following Spansion products: single-chip FBGA packages

Chapter 2 Package Materials

Abstract: for movement device spansion datecode
Contextual Info: ‹ Chapter 7 Tubes CHAPTER 7 TUBES Introduction Design and Materials Device Count per Tube and Box Tube Dimensions Packages and Packing Methodologies Handbook 15 Aug 2007 7-1 ‹ Chapter 7 Tubes INTRODUCTION Tubes are used as unit carriers for PDIP, PLCC, SOIC, USON, and

Contextual Info: Genesys Logic, Inc. GL827S USB 2.0 Single Slot SD/MMC/MS/xD-Picture Card Reader Controller Datasheet Revision 1.06 Mar. 20, 2009 GL827S USB 2.0 Single Slot Card Reader Controller Copyright: Copyright 2009 Genesys Logic Incorporated. All rights reserved. No part of the materials may be

Contextual Info: Genesys Logic, Inc. GL827 USB 2.0 Single Slot SD/MMC/MS/SM/xD-Picture Card Reader Controller Datasheet Revision 1.12 Jul. 11, 2008 GL827 USB 2.0 Single Slot Card Reader Controller Copyright: Copyright 2008 Genesys Logic Incorporated. All rights reserved. No part of the materials may be

Contextual Info: Genesys Logic, Inc. GL831A SATA to PATA Bridge Controller Datasheet Revision 1.02 Apr. 9, 2009 GL831A SATA to PATA Bridge Controller Copyright: Copyright 2009 Genesys Logic Incorporated. All rights reserved. No part of the materials may be reproduced in any form or by any means without prior written consent of Genesys Logic, Inc.

Contextual Info: Genesys Logic, Inc. GL817E USB 2.0 MS/ MS PRO/ SD/ MMC Controller Datasheet Revision 1.33 Feb. 01, 2005 GL817E USB2.0 MS/MS PRO/SD/MMC Controller Copyright: Copyright 2005 Genesys Logic Incorporated. All rights reserved. No part of the materials may be

Contextual Info: Genesys Logic, Inc. GL827 USB 2.0 Single Slot SD/MMC/MS/SM/xD-Picture Card Reader Controller Datasheet Revision 1.11 Jan. 29, 2008 GL827 USB 2.0 Single Slot Card Reader Controller Copyright: Copyright 2008 Genesys Logic Incorporated. All rights reserved. No part of the materials may be

gl823

Abstract: GL823-OGG
Contextual Info: Genesys Logic, Inc. GL823 USB 2.0 SD/MMC Card Reader Controller Datasheet Revision 1.03 Jun. 28, 2010 GL823 Datasheet Copyright Copyright 2010 Genesys Logic, Inc. All rights reserved. No part of the materials shall be reproduced in any form or by any means without prior written consent of Genesys Logic, Inc.

Memory Stick pro duo pinouts

Abstract: memory stick pro duo pin datasheet Memory Stick pinouts 93C46 93C46 IC GL817 IC 93c46 Memory Stick Micro SD Card and MMC Reader pro duo card
Contextual Info: Genesys Logic, Inc. GL817E USB 2.0 MS/ MS PRO/ SD/ MMC Controller Datasheet Revision 1.38 Apr. 19, 2006 GL817E USB2.0 MS/MS PRO/SD/MMC Controller Copyright: Copyright 2006 Genesys Logic Incorporated. All rights reserved. No part of the materials may be

93C46 IC

Abstract: Genesys Logic Memory Stick pro duo pinouts Memory Stick pinouts IC 93c46 93C46 CRC16 GL817E LQFP-48 LQFP-64
Contextual Info: Genesys Logic, Inc. GL817E USB 2.0 MS/ MS PRO/ SD/ MMC Controller Datasheet Revision 1.36 Jun. 21, 2005 GL817E USB2.0 MS/MS PRO/SD/MMC Controller Copyright: Copyright 2005 Genesys Logic Incorporated. All rights reserved. No part of the materials may be

CV-8710

Abstract: EME-G770HCD Sumitomo EME-G600 material SUMITOMO EME G770 EME-G760 MGC CCL-HL832 EME-G600 CCL-HL832 sumitomo g770 Ablestik ablebond 3230 epoxy
Contextual Info:  Chapter 3 Package Materials CHAPTER 3 PACKAGE MATERIALS Introduction JIG-101 Ed 3.0 Declarable Substance List Reporting of 38 Substances of Very High Concern EU REACH Material Declaration Sheets Packages and Packing Methodologies Handbook 6 Jul 2010

Contextual Info: Genesys Logic, Inc. GL817E USB 2.0 MS/ MS PRO/ SD/ MMC Controller Datasheet Revision 1.30 Jul. 02, 2004 GL817E USB2.0 MS/MS PRO/SD/MMC Controller Copyright: Copyright 2004 Genesys Logic Incorporated. All rights reserved. No part of the materials may be