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TIA bonding Abstract: mmic s5 OMMIC STM-16 CGY2102 Contextual Info: INTEGRATED CIRCUITS DATA SHEET CGY2102UH 2.5 Gb/s Transimpedance Amplifier Objective Specification Supersedes data of Sept. 01 2000 File under Integrated Circuits, IC19 2001 Jan 10 Philips Semiconductors Objective Specification 2.5 Gb/s Transimpedance Amplifier	Original	CGY2102UH CGY2102 TIA bonding mmic s5 OMMIC STM-16	PDF

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TIA bonding

Abstract: mmic s5 OMMIC STM-16 CGY2102
Contextual Info: INTEGRATED CIRCUITS DATA SHEET CGY2102UH 2.5 Gb/s Transimpedance Amplifier Objective Specification Supersedes data of Sept. 01 2000 File under Integrated Circuits, IC19 2001 Jan 10 Philips Semiconductors Objective Specification 2.5 Gb/s Transimpedance Amplifier

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CGY2102UH CGY2102 TIA bonding mmic s5 OMMIC STM-16

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