CERAMIC DUAL-IN-LINE PACKAGE Search Results

ca0555

Abstract: CA555
Contextual Info: Nomenclature Guide CA Types CA3260 A T PART NUMBER CAXXXX ELECTRICAL OPTIONS A, B, C, Blank PACKAGE DESIGNATOR D: Ceramic Dual-In-Line Metal-Seal SBDIP E: Dual-In-Line Plastic (PDIP) F: Ceramic Dual-In-Line Frit-Seal (CERDIP) J: Ceramic Leadless Chip Carrier (CLCC)

PQL176

Abstract: CD3024 PD3024 PQB132 28-pin quad packages Thin Quad flat package PQT144 Ceramic Dual-In-Line Packages PQJ144 PQR100
Contextual Info: SECTION 4 PHYSICAL DIMENSIONS CD 020 20-Pin Ceramic Dual In Line Package .4-3 CD3024 24-Pin Slim Ceramic Dual In Line Package .4-4

CD4067 DATASHEET

Abstract: cd4067 CD4097 ALL CD4067
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS052A – Revised March 2002 The CD4067 and CD4097 are supplied in 24-lead dual-in-line welded-seal ceramic packages D suffix , 24-lead dual-in-line frit-seal ceramic packages (F suffix), 24-lead dual-in-line plastic

CD4067BE

Abstract: cd4067 cd4067 harris CD4097be
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS052A – Revised March 2002 The CD4067 and CD4097 are supplied in 24-lead dual-in-line welded-seal ceramic packages D suffix , 24-lead dual-in-line frit-seal ceramic packages (F suffix), 24-lead dual-in-line plastic

Contextual Info: Nomenclature Guide AD Types ADC0803LC PART NUMBER Converters AD, ADC 1 WM -T PACKAGE DESIGNATOR D: Ceramic Dual-In-Line Frit-Seal CERDIP or Ceramic Dual-In-Line Metal Seal (SBDIP) H: TO-52 Can N: Dual-In-Line Plastic (PDIP) WM: Small Outline Plastic (SOIC)

ordering information

Contextual Info: Mechanical Drawings DEVICES INCORPORATED Mechanical Drawings ❑ Ceramic Dual In-line Package ❑ Sidebraze, Hermetic Dual In-line Package ❑ Flatpack ❑ Ceramic Pin Grid Array ❑ Plastic J-Lead Chip Carrier ❑ Ceramic Leadless Chip Carrier ❑ Ceramic Flatpack

oki cross

Abstract: CERAMIC LEADLESS CHIP CARRIER CLCC
Contextual Info: Nomenclature Guide 80C, 82CXXX Types M D TEMPERATURE RANGE C: 0°C to +70°C I: -40°C to +85°C M: -55°C to +125°C PACKAGE DESIGNATOR P: Dual-In-Line Plastic PDIP D: Ceramic Dual-In-Line Frit-Seal (CERDIP) or Ceramic Dual-In-Line Metal Seal (SBDIP) G: Ceramic Pin Grid Array (CPGA)

CD4093

Abstract: CD4093 applications cd4093 harris cd4093 Data SCHS115B
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS115B – Revised March 2002 The CD4093 types are supplied in a 14-lead hermetic dual-in-line ceramic package F suffix , 14-lead dual-in-line plastic package (E suffix), small-outline 14-lead dual-in-line package

CD4093

Abstract: CD4093B CD4093 CIRCUITS CD4093 applications cd4093be SCHS115B cd4093 application CD4093 soic
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS115B – Revised March 2002 The CD4093 types are supplied in a 14-lead hermetic dual-in-line ceramic package F suffix , 14-lead dual-in-line plastic package (E suffix), small-outline 14-lead dual-in-line package

CD40106B

Contextual Info: Data sheet acquired from Harris Semiconductor SCHS097B – Revised August 2002 The CD40106B types are supplied in 14-lead hermetic dual-in-line ceramic packages F suffix , 14-lead dual-in-line plastic package (E suffix), 14-lead dual-in-line surface-mount plastic packages (M and M96

cd40106b

Abstract: CD40106BE CD-40106BE
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS097B – Revised August 2002 The CD40106B types are supplied in 14-lead hermetic dual-in-line ceramic packages F suffix , 14-lead dual-in-line plastic package (E suffix), 14-lead dual-in-line surface-mount plastic packages (M and M96

CD4093 applications

Abstract: CD4093 cd4093 harris CD4093 Types OF CD4093
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS115A – Revised November 1999 The CD4093 types are supplied in a 14-lead hermetic dual-in-line ceramic package F suffix , 14-lead dual-in-line plastic package (E suffix), 14-lead dual-in-line plastic small-outline package (M), and in chip form

Contextual Info: Nomenclature Guide HS/IS Radiation Hardened Types H S PREFIX H: Harris I: Intersil 1 - 6664 PART NUMBER FAMILY Rad Hard/High-Rel Products PACKAGE DESIGNATOR 1: Ceramic Dual-In-Line Frit-Seal CERDIP or Ceramic Dual-In-Line Metal-Seal (SBDIP) 2: Can 4: Ceramic Leadless Chip Carriers (CLCC)

Contextual Info: Nomenclature Guide HS/IS Radiation Hardened Types H S PREFIX H: Heritage Products I: New Products 1 - 6664 PART NUMBER FAMILY Rad Hard/High-Rel Products PACKAGE DESIGNATOR 1: Ceramic Dual-In-Line Frit-Seal CERDIP or Ceramic Dual-In-Line Metal-Seal (SBDIP)

173KB

Contextual Info: Data sheet acquired from Harris Semiconductor SCHS108A – Revised March 2002 The CD40257B types are supplied in 16-lead hermetic dual-in-line ceramic packages D and F suffixes , 16-lead dual-in-line plastic packages (E suffix), 16-lead ceramic flat packages (K suffix), 16-lead small-outline

226 10k

Contextual Info: Data sheet acquired from Harris Semiconductor SCHS039A – Revised March 2002 The CD4041UB types are supplied in 14-lead hermetic dual-in-line ceramic packages D and F suffixes , 14-lead dual-in-line plastic packages (E suffix), 14-lead ceramic flat packages (K suffix), 14-lead small-outline

CD4048A

Abstract: aa359
Contextual Info: C D 4048A Types These types are supplied in 16-lead hermetic dual-in-line ceramic packages D and F suffixes , 16-lead dual-in-line ptastic pack­ age (E suffix), 16-lead ceramic flat package {K suffix), and in chip form (H suffix). CM O S Multi-Function Expandable 8-Input Gate

CD4081B-MIL

Abstract: CD4073B-MIL
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS057C – Revised September 2003 The CD4073B, CD4081B, and CD4082B types are supplied in 14-lead hermetic dual-in-line ceramic packages F3A suffix , 14-lead dual-in-line plastic packages (E suffix), 14-lead

Contextual Info: Data sheet acquired from Harris Semiconductor SCHS054C – Revised September 2003 The CD4069UB-Series types are supplied in 14-lead hermetic dual-in-line ceramic packages F3A suffix , 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline

CD4012BP

Contextual Info: Data sheet acquired from Harris Semiconductor SCHS021D – Revised September 2003 The CD4011B, CD4012B, and CD4023B types are supplied in 14-lead hermetic dual-in-line ceramic packages F3A suffix , 14-lead dual-in-line plastic packages (E suffix), 14-lead

CD4082

Abstract: CD4073B CD4081B CD4082B MS-001 SCHS057C
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS057C – Revised September 2003 The CD4073B, CD4081B, and CD4082B types are supplied in 14-lead hermetic dual-in-line ceramic packages F3A suffix , 14-lead dual-in-line plastic packages (E suffix), 14-lead

CD4011BE DATASHEET

Abstract: CD4023BE 89265AKB3T 89266AKB3T 89273AKB3T CD4011B CD4011BE CD4011BEE4 CD4011BF CD4011BF3A
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS021D – Revised September 2003 The CD4011B, CD4012B, and CD4023B types are supplied in 14-lead hermetic dual-in-line ceramic packages F3A suffix , 14-lead dual-in-line plastic packages (E suffix), 14-lead

CD4069UBE

Abstract: CD4069UBF CD4069UBF3A CD4069UBM CD4069UBM96 CD4069UBM96E4 CD4069UBMT CD4069UBMTE4 CD4069UBNSR CD4069UBNSRE4
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS054C – Revised September 2003 The CD4069UB-Series types are supplied in 14-lead hermetic dual-in-line ceramic packages F3A suffix , 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline

89265AKB3T

Abstract: 89266AKB3T 89273AKB3T CD4011B CD4011BE CD4011BF CD4011BF3A CD4011BK3 CD4012B CD4023B
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS021D – Revised September 2003 The CD4011B, CD4012B, and CD4023B types are supplied in 14-lead hermetic dual-in-line ceramic packages F3A suffix , 14-lead dual-in-line plastic packages (E suffix), 14-lead