CAPACITANCE IN BGA PACKAGE Search Results

AN1001

Abstract: application notes capacitor cross reference active and passive electronic components capacitance in BGA package capacitor package resistor resistor 220 ohm resistor 220 resistor cross reference
Contextual Info: Application Note AN1001 ClearONE RC BGA Configuration Options Introduction The double-sided construction of the CTS ceramic Ball Grid Array BGA package allows the PC board designer to closely locate passive resistor and capacitor elements near the active signal sources and

IPC-D-317A

Abstract: SN74V293 capacitance in BGA package SDMA002 IPC-D-317
Contextual Info: Application Report SDMA002 - June 2001 Design Considerations of SN74V293 FIFO in a MicroSTAR BGA Package Gary Khazan and Andy Pauley Standard Linear & Logic ABSTRACT Texas Instruments’ near-chip-scale MicroSTAR BGA package is gaining in popularity for

C4 to BGA

Abstract: MX23L1612 MX23L1612XI-70 MX23L1612XI-70G MX23L1612XI-90 MX23L1612XI-90G PM0815
Contextual Info: MX23L1612 16M-BIT MASK ROM PIN DESCRIPTION FEATURES • Bit organization - 2M x 8 byte mode - 1M x 16 (word mode) • Fast access time - Random access:70ns(max.) • Current - Operating:25mA - Standby:5uA • Supply voltage - 2.7V ~ 3.6V • Package - 48 ball mini BGA (6mm x 8mm, ball pitch 0.8mm, ball

coreless substrate

Abstract: SDD11 coreless Coreless pcb transformer
Contextual Info: DesignCon 2008 Study of Fundamental Limit and Packaging Technology Solutions for 40-Gbps Transceiver Package Design Hong Shi, Altera Corporation [hshi@altera.com] Xiaohong Jiang, Altera Corporation John Xie, Altera Corporation CP-01038-1.0 February 2008 Abstract

Contextual Info: MX23L1613 16M-BIT MASK ROM FEATURES PIN DESCRIPTION • Bit organization - 2M x 8 byte mode - 1M x 16 (word mode) • Fast access time - Random access:70ns(max.) • Current - Operating:25mA - Standby:5uA • Supply voltage - 2.7V ~ 3.6V • Package - 48 pin TSOP(12mm x 20mm)

Turn-Key

Abstract: Adapters Sockets Product Presentations Giga-snaP™ BGA SMT Adapters Receptacles Prototyping Adapters Surface Mount Package Emulation Probing and Analysis Adapters BGA Sockets
Contextual Info:  RoHS ISO w i t h 900 d 08 20 i g n : 1 es Certified Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . 2 Catalog 26 Receptacles . . . . . . . . . . . . . . . . . . . . . 22 Package Conversion For Production Applications . . . . 24-25

GS8662D10BGD-400

Abstract: GS8662D10BGD-333 AN1021
Contextual Info: GS8662D07/10/19/37BD-450/400/350/333/300 72Mb SigmaQuad-II+TM Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.0 Clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package • Dual Double Data Rate interface

GS8342Q10BD-357

Abstract: GS8342Q37BD-200I 8342Q07101937B
Contextual Info: GS8342Q07/10/19/37BD-357/333/300/250/200 36Mb SigmaQuad-II+TM Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.0 Clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package • Dual Double Data Rate interface

GS8342DT10BGD-350I

Abstract: IR receiver TK 19 205
Contextual Info: GS8342DT07/10/19/37BD-450/400/350/333/300 36Mb SigmaQuad-II+TM Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.0 Clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package • Dual Double Data Rate interface

Contextual Info: Preliminary GS8342QT07/10/19/37BD-357/333/300/250/200 36Mb SigmaQuad-II+TM Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.0 Clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package

GS8342D19BGD-300

Abstract: GS8342D10BD-350I GS8342D19BD-350I 8342D07101937B
Contextual Info: GS8342D07/10/19/37BD-450/400/350/333/300 36Mb SigmaQuad-II+TM Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.0 Clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package • Dual Double Data Rate interface

GS8662DT19BD-400

Contextual Info: GS8662DT07/10/19/37BD-450/400/350/333/300 72Mb SigmaQuad-II+TM Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.0 Clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package • Dual Double Data Rate interface

MX23L8102

Abstract: MX23L8102XI-12 MX23L8102XI-70 MX23L8102XI-90
Contextual Info: MX23L8102 8M-BIT MASK ROM FEATURES PIN DESCRIPTION • Bit organization - 1M x 8 byte mode - 512K x 16 (word mode) • Fast access time - Random access:70ns(max.) • Current - Operating:15mA - Standby:5uA • Supply voltage - 2.7V ~ 3.6V • Package - 48 ball mini BGA (6mm x 8mm, ball pitch 0.8mm, ball

Contextual Info: MX23L3212 32M-BIT MASK ROM FEATURES PIN DESCRIPTION • Bit organization - 4M x 8 byte mode - 2M x 16 (word mode) • Fast access time - Random access:70ns(max.) • Current - Operating:16mA - Standby:5uA • Supply voltage - 2.7V ~ 3.6V • Package - 48 ball mini BGA (7.0mm x 7.0mm, ball pitch

Contextual Info: GS8342QT07/10/19/37BD-357/333/300/250/200 36Mb SigmaQuad-II+TM Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.0 Clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package • Dual Double Data Rate interface

GS76024A

Abstract: GS76024AB
Contextual Info: GS76024AB BGA Commercial Temp Industrial Temp 8, 10, 12 ns 3.3 V VDD Center VDD and VSS 256K x 24 6Mb Asynchronous SRAM Features 119-bump Ball Grid Array Package • Fast access time: 8, 10, 12 ns • CMOS low power operation:290/260/220 mA at minimum cycle time

Contextual Info: Preliminary GS73024AB BGA Commercial Temp Industrial Temp 128K x 24 3Mb Asynchronous SRAM Features 8, 10, 12 ns 3.3 V VDD 119-Bump Ball Grid Array Package • Fast access time: 8, 10, 12 ns • CMOS low power operation: 250/200/170 mA at minimum cycle time

Contextual Info: Preliminary GS82582QT06/11/20/38E-500/450/400/375 288Mb SigmaQuad-II+TM Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.5 clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package

Contextual Info: Preliminary GS82582Q06/11/20/38E-500/450/400/375 288Mb SigmaQuad-II+TM Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.5 clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package

Contextual Info: GS81302Q07/10/19/37E-318/300/250/200 144Mb SigmaQuad-II+TM Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.0 clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package • Dual Double Data Rate interface

GS81302Q37GE-333

Contextual Info: GS81302Q07/10/19/37E-333/300/250/200 144Mb SigmaQuad-II+TM Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–200 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • 2.0 clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package

GS81302QT19GE-200

Contextual Info: GS81302QT07/10/19/37E-333/300/250/200 144Mb SigmaQuad-II+TM Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–200 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • 2.0 clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package

48 ball VFBGA

Abstract: 90 ball VFBGA LVTH162 micro pitch BGA tSSOP 56 socket TSSOP YAMAICHI SOCKET 48-PIN 56-PIN ALVCH16373 LVCH16244A
Contextual Info: Application Report SZZA029B - May 2002 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch, Very Thin Fine-Pitch BGA VFBGA Packages Frank Mortan and Mark Frimann Standard Linear & Logic ABSTRACT TI’s 56-ball MicroStar Jr. package, registered under JEDEC MO-225, has demonstrated

xilinx topside marking

Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the