BSM B3 Search Results

siemens igbt BSM 200 GA 120

Abstract: siemens igbt BSM 300 igbt module bsm 300 igbt BSM 300 GA 120 siemens igbt BSM 10 siemens igbt BSM 300 ga 120 siemens igbt BSM 200 GA 100 SIS00025 C67070-A2017-A70 siemens igbt chip
Contextual Info: SIEMENS BSM 300 GA 120 DN2 IGBT Power Module • Single switch • Including fast free-wheeling diodes • Package with insulated metal base plate Package Ordering Code BSM 300 G A 120 DN2 1200V 430A SINGLE SWITCH 1 C67076-A2007-A70 BSM 300 GA 120 DN2 S 1200V 430A

Contextual Info: SIEMENS BSM 150 GB 170 DN2 IGBT Power Module Preliminary data • Half-bridge • Including fast free-wheeling diodes • Package with insulated metal base plate • on.min = 10 Ohm BSM 150 GB 170 DN2 1C 1700V 220A LU Type Package Ordering Code HALF-BRIDGE 2

Contextual Info: ELECTRICAL SOLUTIONS A. System Overview Metric Butt Splice, Non-Insulated B1. Cable Ties Type BSM • Designed to splice two solid or stranded wires together to repair or lengthen wires • Butted configuration provides low profile for limited space applications

Contextual Info: bSM'ìaS'ì 00173L3 b3 T • MITSUBISHI RF POWER MODULE M67713 220-225MHZ, 12.5V, 7W, FM PORTABLE RADIO PIN : P in ©VBB VCC1 @PO ®G N D : : : : : RF INPUT BASE BIAS SUPPLY DC SUPPLY RF OUTPUT FIN ABSOLUTE MAXIMUM RATINGS Tc = 25 “C unless otherwise noted

siemens igbt BSM 200 GA 120

Abstract: 1C00 siemens bsm 284 f siemens R9
Contextual Info: bGE » • flEBSbOS 0045^20 b3^ * S I E 6 SIEMENS SIEMENS AKTIEN6ESELLSCHAF BSM 300 GA 100 D IGBT Module Preliminary Data VCE = 1000 V / c = 400 A at Tc = 25 C / c = 300 A at Tc = 80 C • • • • • Power module Single switch Including fast free-wheel diodes

Contextual Info: MICRON SEMICONDUCTOR INC b3E D blllSMI GOOÔDbû bSM • MRN ADVANCE M IC R O N 8 MEG X MT16D832 32, 16 MEG x 16 DRAM MODULE 8 MEG DRAM MODULE X 32,16 MEG x16 FAST-PAGE-MODE FEATURES PIN ASSIGNMENT (Top View • Industry-standard pinout in a 72-pin single-in-line

54123L

Abstract: 4C827 MS4123L
Contextual Info: b3E • bSM TflB ? MI T S U B I S H I oom öb^ G2b ■ I1IT 3M IT S U B IS H I BIPOLAR DIGITAL ICs MS4123L D6TL LOGIC EARTH LEAKAGE CURRENT DETECTOR DESCRIPTION M 54123L is a semiconductor integrated circuit with ampli­ PIN CONFIGURATION (TOP VIEW) fier for a high-speed earth leakage circuit breaker.

Contextual Info: bOE ]> B Ö235b05 QQMSTDI 10b M S I E G SIEMENS SIEMENS AKTIEN6ESELLSCHAF • 7 ^ 3 SIMOPAC Module BSM 191 V DS = 1000 V / d =28 A ^ DS on = 0.37 Q • • • • • • Power module Single switch N channel Enhancement mode Package with insulated metal base plate

BZV85

Abstract: DG2B CBV2
Contextual Info: N AUER PHILIPS/DISCRETE b^E D • bbS3T31 GGEb7bb bSM H A P X 11 BZV85 SERIES VOLTAGE REGULATOR DIODES Silicon planar voltage regulator diodes in hermetically sealed DO-41 glass envelopes intended for stabilization purposes. The series covers the normalized E24 ± 5%> range of nominal working voltages

Contextual Info: M IT S U B IS H I B IPO LA R D IG IT A L ICs b3 E • bSM'ìfiB? D D I S l l b MITSUBISHI D G T L 3D2 « « 1 1 3 M 54580P LOGIC 7-UNIT 150mA SOURCE TYPE DARLINGTON TRANSISTOR ARRAY DESCRIPTION The M54580P, 7-channel source driver, consists of 7 PNP and 7 NPN transistors connected to form high current gain

54571P

Contextual Info: b3E bSM TflS? O G lS D Tfl M IT S U B IS H I DGTL Sb7 « M IT B M I T S U B I S H I B I P O L A R D I G I T A L I Cs M 54571P L O G IC 6-UNIT 350mA TRANSISTOR ARRAY AND MOTOR DRIVER DESCRIPTION The M54571P, 6-channel sink driver and voltage regulator, is

siemens BSM b2

Abstract: smd zener GD AX transistor fp 1016 79 p Siemens anwendungsbeispiele siemens igbt BSM 25 gb 100 d BTS412A DIODE ZENER BZW 04 TRANSISTOR EN SMD TZ N-Kanal FET BTS542R
Contextual Info: Technische Angaben SIPMOS-Leistungstransistoren und Dioden SIPMOS-Leistungstransistoren Transistoren im Bereich 50 V . 1000 V, 1,5 A . 60 A und 18 mQ . 8 Q. P -K a n a l N-Kanal Produktpalette • • • • • N- und P-Kanal-Anreicherungstypen FREDFET

siemens igbt

Abstract: C67076-A2015-A2 IGBT Single 1200v 1000a tsc 3001 3001li
Contextual Info: SIEM ENS IGBT Module BSM300GA160D 3 0 0 g a lSa doc VCE= 1600 V lc = 400 A at 7c =25°C 'c = 300 A at Tc =80°C • Power module • Single switch • Including fast free-wheel diodes • Package with insulated metal base plate Single switch Type Ordering code

Contextual Info: TM58PR10 1. Feature ROM: 1K x 14 bits RAM: 24 x 8 bits STACK: 4 Levels I/O ports: 18-pin PA7 ～ PA0, PB5 ～ PB0, PC2 ～ PC0, REM Timer/counter: 8bits x1 (TMR0) Prescaler: 3 bits Reset : 1. Power-On Reset 2. Low voltage reset 3. Wake-up(Release from sleep mode)

Contextual Info: TM58RR10 1. Feature ROM: 1K x 14 bits Mask ROM RAM: 24 x 8 bits STACK: 4 Levels I/O ports: 18-pin (PA7 ~ PA0, PB5 ~ PB0, PC2 ~ PC0, REM) Timer/counter: 8bits x1 (TMR0) Prescaler: 3 bits Reset : 1. Power-On Reset 2. Low voltage reset 3. Wake-up(Release from sleep mode)

Contextual Info: Advance Information TM58PE10 8 Bit Microcontroller Data Sheet Tenx reserves the right to change or discontinue this product without notice. tenx technology inc. tenx technology, inc. Preliminary Rev.1.3, 2008/06/10 Advance Information DS-TM58PE10 Contain 1. Feature . 2

Contextual Info: TM58PE10 1. Feature ……………………………………………………………………………………. P.2 2. Pin Definition & Pad Assignment 2.1 18 Pin & 20 Pin………………………………………………………………………… P.4

Contextual Info: Advance Information TM58PR06 8 Bit Microcontroller Data Sheet Tenx reserves the right to change or discontinue this product without notice. tenx technology inc. Preliminary tenx technology, inc. Rev 1.0, 2008/12/03 TM58PR06 8 Bit Microcontroller Advance Information

Contextual Info: TM58RR10 1. Feature . 2 2. Pin Definition & Pad Assignment. 3

Contextual Info: TM58PE10 1. Feature ……………………………………………………………………………………. P.1 2. Pin Definition & Pad Assignment 2.1 18 Pin & 20 Pin………………………………………………………………………… P.3

Contextual Info: Advance Information TM58PR11 Data Sheet Tenx reserves the right to change or discontinue this product without notice. tenx technology inc. tenx technology, inc. Preliminary Rev.1.3, 2008/07/xx Advance Information DS-TM58PR11 1. FEATURE z ROM: 1K x 14 bits

Contextual Info: TM58PR10 1. Feature. 2 2. Pin Definition & Pad Assignment. 3

Contextual Info: TM58PE10 1. Feature ……………………………………………………………………………………. P.2 2. Pin Definition & Pad Assignment 2.1 18 Pin & 20 Pin………………………………………………………………………… P.4

Contextual Info: TM58RR10 1. Feature. 2 2. Pin Definition & Pad Assignment. 3