BSM 256 Search Results

bsm 256

Abstract: siemens igbt BSM 150 gb 100 d C67076-A2102-A2 BSM 15 GB bsm siemens VM105270
Contextual Info: L.GE D • Ö235b05 DDMSÖÖfl 413 « S I E G SIEMENS SIEMENS AKTIENGESELLSCHAF IGBT Module Preliminary Data BSM 150 GB 100 D BSM 150 GAL 100 D VCE - 1000 V I c = 2 x 2 0 0 A at T c = 25 C / c = 2 X 150 A at Tc = 8 0 C • • • • • Power m odule H alf-bridge/Chopper

bsm 256

Abstract: igbt module bsm 300 Al2O3
Contextual Info: Technische Information / Technical Information IGBT-Module IGBT-Modules BSM 300 GB 60 DLC Höchstzulässige Werte / Maximum rated values Elektrische Eigenschaften / Electrical properties Kollektor-Emitter-Sperrspannung collector-emitter voltage Kollektor-Dauergleichstrom

Contextual Info: Technische Information / Technical Information IGBT-Module IGBT-Modules BSM 300 GB 60 DLC Höchstzulässige Werte / Maximum rated values Elektrische Eigenschaften / Electrical properties Kollektor-Emitter-Sperrspannung collector-emitter voltage Kollektor-Dauergleichstrom

Contextual Info: Technische Information / Technical Information IGBT-Module IGBT-Modules BSM 300 GB 60 DLC Höchstzulässige Werte / Maximum rated values Elektrische Eigenschaften / Electrical properties Kollektor-Emitter-Sperrspannung collector-emitter voltage Kollektor-Dauergleichstrom

zl70101 design

Abstract: ZL70102
Contextual Info: Datasheet, Revision 4 ZL70120 MICS-Band RF Base Station Module BSM Features Description 1 • Complete MICS-Band RF Telemetry Radio Solution • Generic RF Base Station Module Designed to Interact with Implantable Medical Devices Based on the ZL70102 and

Contextual Info: SIEMENS BSM150 GT 120 DN2 IGBT Power Module Preliminary data • Solderable Power module • 3-phase full-bridge • Including fast free-wheel diodes • Package with insulated metal base plate Type BSM 150 GT 120 DN2 K ce 1200V 200A Package Ordering Code

ATIC 224

Abstract: siemens mosfet BSM 50
Contextual Info: SIEMENS SIMOPAC MOSFET Module VDS = 200 V /q = ^ D S o n = 0.03 Q • • • • • • 2 x 81 BSM 224 A a Power m odule H alf-bridge N channel E nhancem ent mode Package with insulated m etal base plate C ircuit diagram : Fig. 2 a 1) Type Ordering code

BSM150GB100D

Abstract: bsm 256
Contextual Info: SIEMENS BSM150GB100D BSM 150 GAL 100 D IGBT Module P re lim in a ry D a ta VCE = 1000 V / c = 2 x 2 0 0 A at Tc = 25 C l c = 2 x 1 5 0 A at fc = 80 C • Power module • Half-bridge/Chopper • Including fast free-wheel diodes • Package with insulated metal base plate

Contextual Info: TM58PR10 1. Feature ROM: 1K x 14 bits RAM: 24 x 8 bits STACK: 4 Levels I/O ports: 18-pin PA7 ～ PA0, PB5 ～ PB0, PC2 ～ PC0, REM Timer/counter: 8bits x1 (TMR0) Prescaler: 3 bits Reset : 1. Power-On Reset 2. Low voltage reset 3. Wake-up(Release from sleep mode)

Contextual Info: Advance Information TM58PR10 Data Sheet Tenx reserves the right to change or discontinue this product without notice. tenx technology inc. tenx technology, inc. Preliminary Rev.1.7, 2008/07/10 Advance Information DS-TM58PR10 1. FEATURE z ROM: 1K x 14 bits

Contextual Info: TM58RR10 1. Feature ROM: 1K x 14 bits Mask ROM RAM: 24 x 8 bits STACK: 4 Levels I/O ports: 18-pin (PA7 ~ PA0, PB5 ~ PB0, PC2 ~ PC0, REM) Timer/counter: 8bits x1 (TMR0) Prescaler: 3 bits Reset : 1. Power-On Reset 2. Low voltage reset 3. Wake-up(Release from sleep mode)

Contextual Info: Advance Information TM58PE10 8 Bit Microcontroller Data Sheet Tenx reserves the right to change or discontinue this product without notice. tenx technology inc. tenx technology, inc. Preliminary Rev.1.3, 2008/06/10 Advance Information DS-TM58PE10 Contain 1. Feature . 2

Contextual Info: TM58PE10 1. Feature ……………………………………………………………………………………. P.2 2. Pin Definition & Pad Assignment 2.1 18 Pin & 20 Pin………………………………………………………………………… P.4

Contextual Info: Advance Information TM58PR06 8 Bit Microcontroller Data Sheet Tenx reserves the right to change or discontinue this product without notice. tenx technology inc. Preliminary tenx technology, inc. Rev 1.0, 2008/12/03 TM58PR06 8 Bit Microcontroller Advance Information

Contextual Info: TM58PE10 1. Feature ……………………………………………………………………………………. P.1 2. Pin Definition & Pad Assignment 2.1 18 Pin & 20 Pin………………………………………………………………………… P.3

Contextual Info: Advance Information TM58PR11 Data Sheet Tenx reserves the right to change or discontinue this product without notice. tenx technology inc. tenx technology, inc. Preliminary Rev.1.3, 2008/07/xx Advance Information DS-TM58PR11 1. FEATURE z ROM: 1K x 14 bits

Contextual Info: TM58PR10 1. Feature. 2 2. Pin Definition & Pad Assignment. 3

Contextual Info: TM58PE10 1. Feature ……………………………………………………………………………………. P.2 2. Pin Definition & Pad Assignment 2.1 18 Pin & 20 Pin………………………………………………………………………… P.4

Contextual Info: TM58RR10 1. Feature. 2 2. Pin Definition & Pad Assignment. 3

Contextual Info: TM58PR11 1. Feature. 2 2. Pin Definition & Pad Assignment. 3

Contextual Info: TM58PR11 1. Feature. 2 2. Pin Definition & Pad Assignment. 3

Contextual Info: TM58PR10 1. Feature. 2 2. Pin Definition & Pad Assignment. 3

Contextual Info: TM58RR10 1. Feature. 2 2. Pin Definition & Pad Assignment. 3

bsm b3

Contextual Info: TM58PR10 1. Feature. 2 2. Pin Definition & Pad Assignment. 3