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    BSC DATE SHEET Search Results

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    Part ECAD Model Manufacturer Description Download Buy
    MSP430F2274MDATEP
    Texas Instruments 16-bit Ultra-Low-Power Micro controller, 32kB Flash, 1K RAM 38-TSSOP -55 to 125 Visit Texas Instruments Buy

    BSC DATE SHEET Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    POD-SOT23

    Abstract: MO-178 sot 23- POD
    Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOT−23, 6 Lead CASE 527AJ−01 ISSUE O D e E1 E DATE 19 DEC 2008 SYMBOL MIN NOM A 0.90 A1 0.00 A2 0.90 b 0.30 0.50 c 0.08 0.22 1.45 0.15 1.15 2.90 BSC E 2.80 BSC E1 1.60 BSC e 0.95 BSC L 0.45 0.30 0.60 0.60 REF


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    OT-23, 527AJ-01 MO-178. 98AON34321E 527AJ POD-SOT23 MO-178 sot 23- POD PDF

    SOT23-5 JEDEC standard

    Abstract: POD-SOT23 SOT235 MO-178 sot 23- POD 527AH
    Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOT−23, 5 Lead CASE 527AH−01 ISSUE O D DATE 19 DEC 2008 SYMBOL E1 MIN NOM A 0.90 1.45 A1 0.00 0.15 A2 0.90 b 0.30 0.50 c 0.08 0.22 E 1.15 1.30 D 2.90 BSC E 2.80 BSC E1 1.60 BSC 0.95 BSC e e L 0.45 0.30 L1 PIN #1 IDENTIFICATION


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    OT-23, 527AH-01 MO-178. 98AON34320E 527AH SOT23-5 JEDEC standard POD-SOT23 SOT235 MO-178 sot 23- POD 527AH PDF

    POD-SOT23

    Abstract: 527AK MO-178 L2 SOT23-8
    Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOT−23, 8 Lead CASE 527AK−01 ISSUE A DATE 18 MAR 2009 SYMBOL E1 e E b PIN #1 IDENTIFICATION NOM MAX A 0.90 1.45 A1 0.00 0.15 A2 0.90 A3 0.60 0.80 b 0.28 0.38 c 0.08 0.22 1.10 1.30 D 2.90 BSC E 2.80 BSC E1 1.60 BSC


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    OT-23, 527AK-01 MO-178. 98AON34327E 527AK POD-SOT23 527AK MO-178 L2 SOT23-8 PDF

    TSOT236-006-01

    Abstract: MO-193 TSOT236
    Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSOT−23, 6 LEAD CASE 419AF−01 ISSUE O DATE 19 DEC 2008 SYMBOL D MIN NOM A e E1 MAX 1.00 A1 0.01 0.05 0.10 A2 0.80 0.87 0.90 b 0.30 c 0.12 E 0.45 0.15 D 2.90 BSC E 2.80 BSC E1 1.60 BSC e 0.95 TYP 0.30 L L1 0.40


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    TSOT-23, 419AF-01 MO-193. 98AON34406E 419AF TSOT236-006-01 MO-193 TSOT236 PDF

    MTR28515TF

    Abstract: QML-38534 mtr28515
    Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Chanaes in accordance with NOR 5962-R006-96. 95-10-18 K.A. Cottonaim B Correct oaraarach 1.4, output currents. 97-10-22 K.A. Cottonaim C Figure 1, dimension table, symbol q: inches column, change 1.950 BSC to 1.950 maximum and millimeters column, 49.53 BSC to 49.53


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    5962-R006-96. MTR28515TF/883 MTR28515TF QML-38534 mtr28515 PDF

    SOT233

    Abstract: POD-SOT23 sot 23- POD 527AG
    Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOT−23, 3 Lead CASE 527AG−01 ISSUE O D DATE 19 DEC 2008 SYMBOL MIN A 0.89 1.12 A1 0.013 0.10 b 0.37 0.50 c 0.085 0.18 D 2.80 3.04 E 2.10 2.64 E1 1.20 3 E1 E NOM MAX 1.40 e 0.95 BSC e1 1.90 BSC L 0.40 REF e1 L1


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    OT-23, 527AG-01 O-236. 98AON34319E 527AG SOT233 POD-SOT23 sot 23- POD 527AG PDF

    AT 980202

    Abstract: QML-38534 980202 MTR28512T883 MTR28512TF DSCC 93073
    Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Chanaes in accordance with NOR 5962-R005-96. 95-10-18 K.A. Cottonaim B Figure 1, dimension table, symbol q: inches column, change 1.950 BSC to 1.950 maximum and millimeters column, 49.53 BSC to 49.53 maximum. Table I, delete note 4 from output current test (Iq u t ) ancl


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    5962-R005-96. MTR28512TF/883 AT 980202 QML-38534 980202 MTR28512T883 MTR28512TF DSCC 93073 PDF

    l282

    Abstract: L-282
    Contextual Info: PACKAGE DIAGRAM OUTLINES LEADLESS CHIP CARRIER C o n t i n u e d DCN REV DESCRIPTION 17288 03 UPDATE TO STANDARDIZE DRAWING DATE APPROVAL A A1 NOTES: (UNLES OTHERWISE SPECIFIED; 1. ALL DIMENSIONS ARE IN INCHES. 2. BSC - BASIC LEAD SPACING BETWEEN CENTERS.


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    L28-2 l282 L-282 PDF

    28 LEADLESS CHIP CARRIER DWG

    Abstract: MS-009-AE
    Contextual Info: PACKAGE DIAGRAM OUTLINES LEADLESS CHIP CARRIER DCN REV DESCRIPTION 17 295 05 UPDATE TO STANDARDIZE DRAWING DATE APPROVAL A E NOTES: 2. E UNLES OTHERWISE SPECIFIED; BSC - BASIC LEAD SPACING BETWEEN CENTERS. DWG # SYMBOL MIN A .060 .075 A1 .050 .065 B1 R9 L 20-1


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    L20-1 28 LEADLESS CHIP CARRIER DWG MS-009-AE PDF

    Contextual Info: REV 00 DCN DESCRIPTION 20289 ORIGINAL ISSUE ——I |—— bl DATE APPROVED ——Ie |—— S1 - mwwffl b — ► li^ — £11 L1 _\w S —• — SEATING PLANE NOTES: UNLESS OTHERWISE SPECIFIED 1. ALL DIMENSIONS ARE IN INCHES. 2. BSC - BASIC LEAD SPACING BETWEEN CENTERS.


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    PSC-2095 PDF

    footprint soic28

    Abstract: DIMENSIONS soic 28 SOIC28-049-01 SOIC28 751BN-01 SOIC-28
    Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−28, 300 mils, Extended Footprint CASE 751BN−01 ISSUE A DATE 17 MAR 2009 SYMBOL E MIN NOM A 2.35 2.65 A1 0.10 0.30 A2 2.05 2.55 b 0.31 0.51 c 0.20 0.33 D 17.78 18.03 E 11.43 12.12 E1 7.34 7.60 1.27 BSC e b


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    SOIC-28, 751BN-01 98AON34303E SOIC-28 751BN footprint soic28 DIMENSIONS soic 28 SOIC28-049-01 SOIC28 751BN-01 PDF

    Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSSOP20, 4.4x6.5 CASE 948AQ−01 ISSUE A DATE 19 MAR 2009 b SYMBOL MIN NOM A E1 E MAX 1.20 A1 0.05 0.15 A2 0.80 1.05 b 0.19 0.30 c 0.09 0.20 D 6.40 6.50 6.60 E 6.30 6.40 6.50 E1 4.30 4.40 4.50 e L 0.65 BSC 0.45 L1


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    TSSOP20, 948AQ-01 MO-153. 98AON34453E 948AQ PDF

    tssop16

    Abstract: TSSOP-16
    Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSSOP16, 4.4x5 CASE 948AN−01 ISSUE O DATE 19 DEC 2008 b SYMBOL MIN NOM A E1 E MAX 1.10 A1 0.05 0.15 A2 0.85 0.95 b 0.19 0.30 c 0.13 0.20 D 4.90 5.10 E 6.30 6.50 E1 4.30 4.50 0.65 BSC e L 1.00 REF L1 0.45 0.75 θ


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    TSSOP16, 948AN-01 MO-153. 98AON34436E 948AN tssop16 TSSOP-16 PDF

    948AL

    Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSSOP8, 4.4x3 CASE 948AL−01 ISSUE O DATE 19 DEC 2008 b SYMBOL MIN NOM A E1 E MAX 1.20 A1 0.05 0.15 A2 0.80 b 0.19 0.30 c 0.09 0.20 D 2.90 3.00 3.10 E 6.30 6.40 6.50 E1 4.30 4.40 4.50 0.90 e 0.65 BSC L 1.00 REF L1


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    948AL-01 MO-153. 98AON34428E 948AL 948AL PDF

    Contextual Info: .350 DIA GLASS LENS MAX .225 .014 .023 .038 .065 .006 .015 2.096 .510 .620 .590 .630 .100 BSC .125 .200 .150 .020 .060 — .098 .005 0" 15' LTR A MIN - B B1 C D E E1 e L L1 Q S S1 a SIGNATURE ALL DIMENSIONS SHOWN ARE IN INCHES. a; DATE DOC. CONTROL: ENGR. MGR:


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    PDF

    Contextual Info: PACKAGE DIAGRAM OUTLINES LEADLESS CHIP C ARRIER C o 11 1i 1111 e d DCN REV 17294 02 DESCRIPTION UPDATE DATE TO S T A N D A R D I Z E APPROVAL DRAWI NG A A1 NOTES: (UNLES OTHERWI SE 1. A LL DI MENSI ONS ARE 2. BSC - BASI C LEAD BETWEEN CENTERS. IN INCHES.


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    L22-1 PDF

    TSSOP14

    Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSSOP14, 4.4x5 CASE 948AM−01 ISSUE O DATE 19 DEC 2008 b SYMBOL MIN NOM A E1 E MAX 1.10 A1 0.05 0.15 A2 0.85 0.95 b 0.19 0.30 c 0.13 0.20 D 4.90 5.10 E 6.30 6.50 E1 4.30 4.50 e 0.65 BSC L 1.00 REF L1 0.45 0.75 θ


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    TSSOP14, 948AM-01 MO-153. 98AON34434E 948AM TSSOP14 PDF

    EDR-7320

    Abstract: SOIC8-208 SOIK8-031-01 eiaj edr-7320 751BE-01 soik8
    Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−8, 208 mils CASE 751BE−01 ISSUE O DATE 19 DEC 2008 SYMBOL MIN NOM A E1 E MAX 2.03 A1 0.05 0.25 b 0.36 0.48 c 0.19 0.25 D 5.13 5.33 E 7.75 8.26 E1 5.13 5.38 e 1.27 BSC L 0.51 0.76 θ 0º 8º PIN#1 IDENTIFICATION


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    751BE-01 EDR-7320. 98AON34273E 751BE EDR-7320 SOIC8-208 SOIK8-031-01 eiaj edr-7320 751BE-01 soik8 PDF

    MS-009-AR

    Contextual Info: PACKAGE DIAGRAM OUTLINES LEADLESS CHIP CARRIER Ccm t i n u e d DCN 1T289 REV DESCRIPTION 05 UPDATE TO S T A N D A R D I Z E DATE APPROVAL DRAWING A1 U NL E S 2. OTHERWI SE SPECIFIED, BSC - BASI C LEAD S PA CI NG BETWEEN CENTERS. DWG # SYMBOL A .055 .120


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    L48-1 MS-009-AR PDF

    E16-1

    Abstract: MO-092AC
    Contextual Info: PACKAGE DIAGRAM O U T L I N E S CERPACK REV DCN 04 17576 DESCRIPTION UPDATED TO DATE STANDARDIZE APPROVED 4- 6-90 DWG Thomas - i T E1 D e- NOTES: UNLESS OTHERWISE SPECIEIED 1. ALL DIMENSIONS ARE IN INCHES. 2. BSC - BASIC LEAD SPACING BETWEEN CENTERS. 3. SYMBOL ”N” REPRESENTS THE NUMBER OF LEAD!:


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    E16-1 E20-1 E24-1 E28-1 E28-2 PSC-21 E16-1 MO-092AC PDF

    MO-187

    Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS MSOP 8, 3x3 CASE 846AD−01 ISSUE O DATE 19 DEC 2008 SYMBOL MIN NOM MAX 1.10 A E E1 A1 0.05 0.10 0.15 A2 0.75 0.85 0.95 b 0.22 0.38 c 0.13 0.23 D 2.90 3.00 3.10 E 4.80 4.90 5.00 E1 2.90 3.00 3.10 0.65 BSC e L 0.60


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    846AD-01 MO-187. 98AON34074E 846AD MO-187 PDF

    tssop24 datasheet

    Abstract: TSSOP24
    Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSSOP24, 4.4x7.8 CASE 948AR−01 ISSUE A DATE 17 MAR 2009 b SYMBOL MIN NOM A E1 E MAX 1.20 A1 0.05 0.15 A2 0.80 1.05 b 0.19 0.30 c 0.09 D 7.70 7.80 7.90 E 6.25 6.40 6.55 E1 4.30 4.40 4.50 e L 0.65 BSC 0.50 L1 θ 0.20


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    TSSOP24, 948AR-01 MO-153. 98AON34454E 948AR tssop24 datasheet TSSOP24 PDF

    PDIP24

    Abstract: MS-011
    Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS PDIP−24, 600 mils CASE 646AD−01 ISSUE A DATE 18 MAR 2009 SYMBOL MIN NOM A E1 E D 6.35 A1 0.39 A2 3.18 4.95 b 0.36 0.55 b1 0.77 1.77 c 0.21 0.38 D 31.50 32.25 E 15.24 15.87 E1 12.32 e TOP VIEW A2 MAX 14.73 2.54 BSC


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    PDIP-24, 646AD-01 MS-011. 98AON34194E 646AD PDIP24 MS-011 PDF

    MO-092AC

    Abstract: E16-1
    Contextual Info: PACKAGE DIAGRAM O U T L I N E S CERPACK REV DCN 04 17576 DESCRIPTION U P D A TE D DATE TO S T A N D A R D IZ E DWG APPROVED 4-6-90 Thomas - i T E1 D eNOTES: UNLESS OTHERWISE SPECIEIED 1. ALL DIMENSIONS ARE IN INCHES. 2. BSC - BASIC LEAD SPACING BETWEEN CENTERS.


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    E16-1 E20-1 E24-1 E28-1 E28-2 MO-092AC E16-1 PDF