BPC10 Search Results

OCLARO

Abstract: ausn submount bh134
Contextual Info: 80W 9xxnm 20% Fill Factor High Power Laser Diode Bar on Passive Cu Block Cooler BPC9xx-80C-660 & BPC10xx-80C-660 Features: • Mounted 10mm laser diode bar • Passive 1” x 1” Cu block cooler • 20% fill factor 100µm / 500 µm pitch • 80W operating power

planar Resistor BPC

Abstract: bleeder Resistor
Contextual Info: 3W to 10W Planar High Power Resistors BPC Series • Non-Inductive planar package · High power density. · Thin package for high density PCB installation. · Power dissipated above the board. · RoHS compliant.Benefits Applications Power supply pre-load resistors.

Contextual Info: Resistors Make Possible 3W to 10W Planar High Power Resistors BPC Series Non-Inductive planar package High power density. Thin package for high density PCB installation. Power dissipated above the board. RoHS compliant. Applications Power supply pre-load resistors.

planar Resistor BPC

Abstract: BPC SERIES
Contextual Info: 3W to 10W Planar High Power Resistors BPC Series • Non-Inductive planar package · High power density. · Thin package for high density PCB installation. · Power dissipated above the board. · RoHS compliant.Benefits Applications Power supply pre-load resistors.

M123A02BXB105KC

Abstract: CKS07 C052Z103K5X5CA M123A02BXB823KC C-512 M123A03BXB105KC CKS06 470 BPC56 C512Z m123a03bxc474kc
Contextual Info: CERAMIC MOLDED/RADIAL — MIL-C-123 KEMET G E N E R A L IN F O R M A T IO N s-os-oS CAPACITOR OUTLINE DRAWINGS - RADIAL LEADS DIMENSIONS — INCHES & (MILLIMETERS) CASE SIZE MILITARY EQUIVALENT STYLES H HEIGHT L LENGTH w WIDTH S LEAD SPACING C052 CKS05 .190 ±.010(4.83 ±.25)

Contextual Info: 3W to 10W Planar High Power Resistors BPC Series • Non-Inductive planar package · High power density. · Thin package for high density PCB installation. · Power dissipated above the board. · RoHS compliant. Applications Power supply pre-load resistors.

Contextual Info: 6.0 Amp SINGLE PHASE SILICON BRIDGE Semiconductor M echanical Dimensions Description £ O s T -.040 .750 Min. 1 ] x Mechanical Data: Weight - 0.3 Ounces. Mounting Torque _ 5.1 lbs. Mounting Position - Any. Features • COMPACT SIZE ■ 150 AMP SURGE OVERLOAD RATING

Contextual Info: UNPROGRAMMED ONE TIME PROGRAMMABLE ROM OUTLINE The UNPROGRAMMED OTP ROM IC MEMORY CARD series is made up of One Time Programable ROM chips. Memory capacity is from 64K Bytes to 1M Bytes. HE series is 16 bit wide data bus. This card is only used for customer’s development.

BPC1004

Abstract: seiko epson RAM IC MEMORY CARD
Contextual Info: UNPROGRAMMED ONE TIME PROGRAMMABLE ROM 1. OUTLINE The UNPROGRAMMED OTP ROM IC MEMORY CARD series is made up of One Time Programable ROM chips. Memory capacity is from 32K Bytes to 1M Bytes. IE series is 8 bit wide data bus. This card is only used for customer’s development.

KL SN 102 94v-0

Abstract: diode EGP 30D circuit diagram of 5kw smps full bridge MELF ZENER DIODE color bands blue y-349 diode GI 2W06G DO-213AB smd diode color marking code 6j 507 SMD TRANSISTOR smd diode marking g2a zener Marking BJ9
Contextual Info: General Instrument / Power Semiconductor Division / I * r .jr > / INTRODUCTION General Instrument Corporation is a world leader in developing technology, systems and product solutions for the interactive delivery o f video and data. G l’s success results

Contextual Info: Data Sheet 50 Amp PLASTIC SILICON AUTOMOTIVE RECTIFIERS semiconductor M echanical Dimensions Features • LOW COST ■ H IG H SURGE CAPABILITY ■ DIFFUSED JU N C TIO N ■ LOW LEAKAGE C U R RENT ■ H IG H TEMPERATURE C A PA B ILITY ■ MEETS U L SPECIFICATIO N 9 4V -0

Contextual Info: 3.0 Amp FAST SW ITCHING MEGARECTIFIERS D a ta Sheet semiconductor M echanical Dimensions JEDEC D0-201 AD i [" .1901 .210 g . . 1.00 M in. -285 r _i /375 1 i t Features • HIGH TEMPERATURE METALLURGI­ C A L!^ BONDED CONSTRUCTION ■ 3 j0 AMP OPERATION @ T = 55°C , WITH

KT 8030

Abstract: SMBJ15A SMBJ130A SMBJ17A SMBJ58A SMBJ100A SMBJ64A SMBJ28A SMBJ8.0A SMBJ120A
Contextual Info: Data Sheet 5.0V to 170V SMD TRANSIENT VOLTAGE SUPPRESSORS Semiconductor 4E Mechanical Dimensions Description N 1^4.06/4.60^ Cathode _ • SMBJ5.0 Package “SMB 13.30/3.90 t*—mo /s/ sM .11/.30 1.65/2.191*-*1 1.91/2.41^ — ^ .O T /.20 1.90/2.15

KBPC606 equivalent

Abstract: PWS01
Contextual Info: Bridge Rectifiers T Y PE NO. V rrm v1 rms Io I fsm IR RM V fm V (V) (A) Ta (°C ) 2WO 005M 2 WO 01M 2 WO 02 M 2 WO 04M 2 WO 06M 2W O 08M 2 W O 10M 50 100 200 400 600 800 1000 35 70 140 280 420 560 700 2.0 2.0 2.0 2.0 2.0 2.0 2.0 25 25 25 25 25 25 25 50 50

sot143 Marking code wl4

Abstract: WL4 SOT143 1K resistor Type MHP A 002 52 05 welwyn MHP 40101-019 SQM5 thermistor PCR 406 marking 16 sot143 planar Resistor BPC
Contextual Info: Fixed Resistors Product Data Short Form Belief in Technology 1 Fixed Resistors TT electronics plc is a global electronics company. Within its electronic components group are multiple manufacturing facilities for fixed resistors and dedicated engineering teams providing custom solutions.

1N5498

Abstract: CA542 AP6KE91A CGJ-1 DF06S 214 H AG 48 2KBP10M I1404 P6KE200 602 CA-592 BZWO4P
Contextual Info: NUMERICAL INDEX 1.5KA6.8.A .564 1.5KE22C.CA. 592 1.5KE170.A. 592 1N4383GP. 1.5KA7.5.A.564 1.5KE24.A.592 1ÆKE170C.CA.592 1N4384GP.244

planar Resistor BPC

Abstract: resistor 10w power RESISTOR 10W bpc5
Contextual Info: 3W to 10W PLANAR HIGH POWER RESISTORS Features………………………………………………………… ƒ ƒ ƒ ƒ . Non-Inductive planar package High power density. Thin package for high density PCB installation. Power dissipated above the board.

intel 945 motherboard schematic diagram

Abstract: benq lcd monitor circuit diagram tf041-th-pcb 945 MOTHERBOARD CIRCUIT diagram usb tf041 inverter mp1010bem PCI8402 TF041-PCB PC intel 945 MOTHERBOARD schematic VRM Section of 945 Motherboard
Contextual Info: SERVICE MANUAL FOR 8224 BY: Star Meng Validation Tool Research Department /EDVD Mar.2006 / R01 8224 N/B Maintenance Contents 1. Hardware Engineering Specification …………………………………………………………………. 4 1.1 Introduction …………………………………………………………………………………………………………… 4

Contextual Info: Pd Data Sheet 6.0 Amp SINGLE PHASE SILICON BRIDGE K B U 6 0 0 . 610 Series Semiconductor M echanical Dimensions Features • COMPACT SIZE ■ 250 AMP SURGE OVERLOAD RATING ■ LOW LEAKAGE CURRENT ■ MEETS UL SPECIFICATION 94V-0 E le c tric a l C h a ra c te ris tic s @ 2 5 “C.

Contextual Info: Data Sheet 3.0 Amp SUPER FAST PLASTIC RECTIFIERS Semiconductor M echanical Dim ensions D027A 1-.374 — t , 1-OOTyp. ► L i 1 _ L _ f t Features • LOW CO ST ■ HIGH SU R G E CAPABILITY ■ LOW LEA KA G E ■ M EETS U L SPECIFICATION 94V-0

FBL-00-256

Abstract: FBL-00 FBL-00-103 resistor 1K 5w dissipation planar Resistor BPC 1M resistor frequency FBL00256 FBL-00256 Wirewound Resistors 5 watt ceramic HM31
Contextual Info: APPLICATION NOTES BPC SERIES POWER RESISTOR APPLICATIONS BI Technologies offers the BPC Series of noninductive, planar, thick film, power resistors for current limiting, power supply circuits and snubber circuits. Manufactured using 96% alumina substrates

Contextual Info: 3W to 10W Planar High Power Resistors BPC Series • · · · · Non-Inductive planar package High power density. Thin package for high density PCB installation. Power dissipated above the board. RoHS compliant.Benefits Applications Power supply pre-load resistors.

edge CONNECTOR series CE

Abstract: BPC03
Contextual Info: UNPROGRAMMED ONE TIME PROGRAMMABLE ROM OUTLINE The UNPROGRAMMED OTP ROM IC MEMORY CARD series is made up of One Time Programable ROM chips. Memory capacity is from 32K Bytes to 1M Bytes. IE series is 8 bit wide data bus. This card is only used for customer’s development.

CECC 40101-019 FZ

Abstract: trimmer electron 3296 trimmer 3296 electron NTC 2.2K3A359I NTCLE203E3103GB0 thermistor ntc 3r9 Bourns 47K VA05H 1688-776 BS-CECC 40101-019 hr r 681k- 1kv
Contextual Info: 1301 Technical portal and online community for Design Engineers - www.element-14.com Resistors, Potentiometers & Thermistors Anti-Surge & Pulse Withstanding . . . . . . . . . . . . Carbon Film . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Fusible Resistors . . . . . . . . . . . . . . . . . . . . . . . . . .